COM Express, SMARC czy Qseven? Który standard Computer-on-Module (COM) wybrać

Why the COM standard matters before the processor

When you build a long-life embedded product on a Computer-on-Module (COM), the module standard you commit to constrains your carrier-board design for years. Switching from COM Express to SMARC later means a new carrier board and re-validation. So picking the right standard up front matters more than picking the right processor, you can refresh the processor on the same connector.

The three mainstream standards at a glance

• COM Express (PICMG), the workhorse for x86. COM Express Type 6 uses two 220-pin connectors (440 pins total) and comfortably hosts power envelopes well above 20W. Best for high-performance Intel/AMD designs needing rich PCIe lanes and multiple displays.
• SMARC (SGET), a 314-pin edge connector aimed at small, rich-I/O modules. Power envelope target is around 6W. Supports both ARM and x86, which makes it the modern "future-proof" pick when you may pivot architectures.
• Qseven (SGET), a 230-pin edge-connector module sized 70×70 mm with a specification maximum of 12 W. Simpler and slimmer than COM Express; well suited to lower-cost, less-complex carriers.

Match the standard to the project

Pick COM Express when…

You need high-performance Intel Core/Xeon, multiple PCIe Gen4/Gen5 lanes for GPU/AI/storage expansion, dual or triple display output, and you don't mind the larger module and carrier real estate. Most industrial PCs, medical workstations and machine-vision controllers land here. See our COM Express Type 6 modules such as the ESM-RPL.

Pick SMARC when…

You want one carrier that can host either an ARM SoC or a low-power x86, you need a small footprint with rich I/O (camera, audio, CAN, multiple Ethernet), and you're targeting a sub-10W power envelope. Smart cameras, IoT gateways and handheld medical devices typically land here.

Pick Qseven when…

You need a lower-pin-count module with a simple carrier and a power envelope under ~12W (note that standard Qseven at 70×70 mm is physically larger than SMARC’s 82×50 mm module; the genuinely ultra-compact option is the 40×70 mm µQseven variant). Good for cost-sensitive panel-mounted devices and slim handhelds.

What about COM-HPC and OSM?

For very high-performance designs (server-class CPUs, 100GbE, PCIe Gen5 x16) the newer COM-HPC standard supersedes COM Express on capability, modules like the EEV-HC10 and ESM-HRPL target this tier. At the opposite end, Open Standard Module (OSM) is a solder-down, ultra-low-cost form factor (no connector at all) for very high-volume or vibration-critical designs.

Checklist before you commit

• Target power envelope and thermal budget
• Required PCIe lanes / display outputs / Ethernet ports
• ARM, x86 or both over the product's lifetime?
• Mechanical envelope of the end product
• Long-term availability of CPU options on that connector
• Existing carrier-board IP you can reuse

How TSL Automation can help

TSL Automation supplies COM Express, COM-HPC and Open Standard Modules from Avalue worldwide. We can help you shortlist a module + carrier strategy that matches your power, performance and product-life targets. Contact our team with your project brief.