Avalue · System komputerowy

EMS-TGL-USB

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Producent: Avalue

Najważniejsze informacje

11th Gen. Intel® Core™ i7/i5/i3 BGA Processor
2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
Rich I/O, 8-USB3.1, 3-USB2.0, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE
Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
CE, FCC Class B, IP50
Wide range DC power input from +9~36V
Support HW TPM 2.0

Opis produktu

The Avalue EMS-TGL-DVI is a modular industrial computing system powered by Intel® Tiger Lake processors, equipped with multiple DVI outputs for high-quality digital video. It features a fanless design and wide temperature support, making it ideal for harsh industrial environments.

This system is suitable for applications requiring reliable video output and robust performance, ensuring flexibility and scalability in demanding settings.

Dane techniczne

Procesor

Intel® Core™ i7-1185GRE Processor (15W, 12M Cache, up to 2.80 GHz), WT

Intel® Core™ i5-1145GRE Processor (15W, 8M Cache, up to 2.60 GHz), WT

Intel® Core™ i3-1115GRE Processor (15W, 6M Cache, up to 3.00 GHz), WT

Intel® Core™ i7-1185G7E Processor (15W, 12M Cache, up to 2.80 GHz), ST

Intel® Core™ i5-1145G7E Processor (15W, 8M Cache, up to 2.60 GHz), ST

Intel® Core™ i3-1115G4E Processor (15W, 6M Cache, up to 3.00 GHz), ST

Pamięć systemowa

2 x 260-pin SODIMM socket Max. up to 64GB DDR4 3200 MT/s

Chipset I/O

EC ITE IT8528E

Informacje o BIOS

AMI uEFI BIOS 256 Mbit SPI Flash ROM

Watchdog

H/W Reset, 1sec. ~ 65535sec.

Monitor stanu sprzętu

CPU & system temperature monitoring and Voltages monitoring

TPM

TPM 2.0

iAMT

iAMT 15.0 (Above i5 CPU)

SBC

EBM-TGLS + EBM-BYTS DB-E

Temperatura pracy

-40°C ~ 70°C (w/SSD) ambient w/ air flow, WT sku

0°C ~ 70°C (w/SSD) ambient w/ air flow, ST sku

Temperatura przechowywania

-30°C ~ 70°C (-22°F ~ 158°F)

Wilgotność pracy

40°C @ 95% Relative Humidity, Non-condensing

Wymiary (szer. x dł. x wys.)

240mm x 150mm x 69 mm (w/ IET module)

Masa

2.3 Kg

Test wibracyjny

With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 1hr/axis

Test udarowy

With SSD : 55Grms, IEC 60068-2-27, Half Sine, 11ms

Stopień ochrony IP

IP 50

Zestaw montażowy

Wall mount kit (standard)

DIN RAIL (optional)

M.2

1 x M.2 Key-B 2242/3042/3052 support SATA3/ PCIeIII x1/ USB3.1 and SIM slot1

1 x M.2 Key-E 2230 for Wi-Fi & BT Module(CNVi)

M.2

1 x M.2 Key-M 2242/2280, support PCIe Gen. III x 4 (NVMe SSD)

1 x M.2 Key-B 2242, support SATA (share with expansion slot)

Przycisk zasilania

1 x Push Button for Power on/off

Przycisk resetu

1 x Push Button for Reset

Wskaźnik LED

1 x Power LED (Blue)

1 x Storage LED (Yellow)-M.2 B-key SATA

1 x LTE LED (Green)- M.2 B-key PCIe

1 x Wifi LED (Green)- M.2 E key

Port COM

2 x COM RS232/422/485 (select via BIOS, auto flow control via HW)

Cyfrowe I/O

1 x 8-bit GPIO (DB9)

Włączanie/wyłączanie zasilania sygnałem przewodowym

1 x 2-Pin Terminal Block

Antena

2 x Antenna with dust cover

USB

2 x USB 3.1 Gen.2 (10Gbp/s)

2 x USB 3.1 Gen.1 (5Gbp/s)

3 x USB 2.0

Port COM

2 x COM RS232/422/485 (select via BIOS, auto flow control via HW)

Port LAN

2 x RJ-45

Audio

1 x Mic-In

1 x Line-Out

DP

1 x DP++ 1.4

HDMI

1 x HDMI 2.0b

DVI

1 x DVI-D

Gniazdo SIM

1 x internal SIM slot

Antena

2 x Antenna with dust cover

Wejście AC/DC

3-Pin Terminal Block (V+. V-, GND)

Antena

2 x Antenna with dust cover

Antena

2 x Antenna with dust cover

Kodek audio

Realtek ALC888S HD codec

Chipset graficzny

Intel® Iris® Xe Graphics (i7-1185GRE/i5-1145GRE/i7-1185G7E/i5-1145G7E)

Intel® UHD Graphics for 11th Gen Intel® Processors (i3-1115GRE/i3-1115G4E)

Rozdzielczość

DP++ 1.4: 4096x2304 @ 60Hz

HDMI 2.0b : Max. resolution 4096x2304 @ 60Hz

Informacje o certyfikacji

CE, FCC Class A

Chipset LAN

1 x Intel® I225-LM

1 x Intel® I219-LM

Specyfikacja

1 x 10/100/1000/2.5G Base-Tx GbE compatible

1 x 10/100/1000Base-Tx GbE compatible

Specyfikacja wejścia napięciowego

9Vdc~36Vdc w/1.5KV Isolation

TVS component for surge protection

Reverse current/voltage protection(Max. Currency: 13A)

Złącze wejścia napięcia

3-Pin Terminal Block (V+. V-, GND)

ACPI

Single power ATX Support S0,S3, S4, S5

ACPI 5.0 Compliant

Tryb zasilania

AT/ATX (ATX is default setting)

OS

Win 10 / Win11 / Linux

Informacje o zamawianiu

Intel® 11th Tiger Lake Core™ Processor i7/i5/i3 Fanless Rugged Embedded System, w_USB IET Module

EMS-TGL-W85-A1-8R (i7-1185GRE)

EMS-TGL-W45-A1-8R (i5-1145GRE)

EMS-TGL-W15-A1-8R (i3-1115GRE)

EMS-TGL-S85-A1-8R (i7-1185G7E)

EMS-TGL-S45-A1-8R (i5-1145G7E)

EMS-TGL-S15-A1-8R (i3-1115G4E)

Czym jest EMS-TGL-USB?

The EMS-TGL-USB is a system komputerowy manufactured by Avalue, designed specifically for modular-computing-system applications. It features sieć of 1 x Push Button for Power on/off and system operacyjny of AMI uEFI BIOS 256 Mbit SPI Flash ROM. The Avalue EMS-TGL-DVI is a modular industrial computing system powered by Intel® Tiger Lake processors, equipped with multiple DVI outputs for high-quality digital video. It features a fanless design and wide temperature support, making it ideal for harsh industrial environments. This system is suitable for applications requiring reliable video output and robust performance, ensuring flexibility and scalability in demanding settings.

Najważniejsze cechy i korzyści

11th Gen. Intel® Core™ i7/i5/i3 BGA Processor
2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
Rich I/O, 8-USB3.1, 3-USB2.0, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE
Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
CE, FCC Class B, IP50
Wide range DC power input from +9~36V
Support HW TPM 2.0

Zastosowania i przykłady użycia

Model EMS-TGL-USB doskonale sprawdza się w różnych zastosowaniach automatyki przemysłowej:

Applications requiring reliable video output and robust performance
Dust-sensitive environments and silent operation requirements
DC-powered industrial installations and mobile applications
Extreme temperature environments and outdoor installations
High-performance computing and data processing tasks
Networked industrial systems and data communication
Peripheral device connectivity and data transfer
Memory-intensive applications and multitasking

Często zadawane pytania

The EMS-TGL-USB features 11th Gen Intel® Tiger Lake processors (Core™ i7/i5/i3), up to 64GB DDR4 memory, and notably enhanced USB connectivity with multiple USB 3.2 Gen 2 (10Gbps) and legacy USB ports. It offers comprehensive I/O including DisplayPort, HDMI, COM ports, and dual LAN ports, supports 5G connectivity, operates fanless in wide temperature ranges (-40°C to 70°C for WT model), has IP50 protection, accepts wide voltage input (9-36V), and includes TPM 2.0 security. This system is ideal for industrial applications requiring extensive peripheral connectivity combined with high-performance computing capabilities.

The EMS-TGL-USB offers extensive USB connectivity with multiple USB 3.2 Gen 2 ports supporting 10Gbps transfer speeds, USB 3.2 Gen 1 (5Gbps) ports, and USB 2.0 ports for legacy device compatibility. This comprehensive USB support enables connection to high-speed data acquisition devices, industrial cameras, storage systems, and various industrial peripherals. The Tiger Lake platform's improved I/O capabilities and increased bandwidth provide better performance for USB-connected devices with reduced latency and superior power management, making it ideal for applications requiring reliable connections to multiple USB devices in industrial environments.

The Tiger Lake platform enhances USB peripheral performance through several key improvements: PCIe 4.0 support providing more bandwidth for the USB controller, enhanced xHCI controller design reducing CPU overhead, improved power management for connected devices, better data buffering capabilities, and dedicated USB controller resources. These enhancements enable the EMS-TGL-USB to handle multiple simultaneous high-bandwidth USB operations with lower latency, support more concurrent devices, maintain consistent performance under load, and deliver reliable communication with critical industrial peripherals even during intensive processing tasks.

Applications benefiting most from this combination include industrial test and measurement systems connecting multiple data acquisition devices, machine vision systems with multiple USB cameras, medical equipment integrating various USB sensors and instruments, industrial automation requiring connections to programmable devices and controllers, quality control systems with USB testing equipment, laboratory automation, 3D scanning and modeling applications, industrial robotics with USB peripheral integration, and any scenario where connecting multiple high-speed and legacy USB devices while simultaneously processing their data streams with sophisticated algorithms is critical to operational success.

A Modular Computing System is an industrial-grade computer designed with modular components that can be interchanged or expanded to customize the system for specific applications. These systems typically feature a base unit with core processing capabilities and standardized interfaces for connecting specialized modules that add functionality such as additional I/O, communication protocols, or industry-specific features. This modularity provides flexibility, scalability, and future-proofing while maintaining the reliability and ruggedness required for industrial environments.

Modular Computing Systems offer several advantages over fixed-configuration computers: customization for specific application requirements, ability to adapt to changing needs without replacing the entire system, simpler upgrades by replacing only specific modules, reduced spare parts inventory, greater longevity as new technologies can be integrated via module updates, streamlined maintenance, and better return on investment through scalability. These benefits make modular systems particularly valuable in industrial environments where requirements evolve and system longevity is important.

An IET (Interface Extension Technology) module is a specialized expansion module used in systems like the EMS series to add specific functionality to the base computing platform. These modules connect to a standardized interface on the main system and provide additional capabilities such as extra COM ports, LAN ports, PoE functionality, or specialized interfaces like CAN bus. IET modules are important because they allow a single base system to be customized for diverse applications by simply changing the module, providing flexibility while maintaining a standardized core platform.

Industries benefiting from modular computing systems include manufacturing (automation control, data collection), transportation (fleet management, railway systems), utilities (substation monitoring, grid control), healthcare (medical equipment integration), retail (point-of-sale, inventory management), building automation (HVAC, access control), defense, aerospace, and smart city infrastructure. Applications requiring customization, future expansion, diverse I/O needs, or adaptation to legacy systems particularly benefit from the flexibility and scalability these systems provide while maintaining industrial-grade reliability.

Wide temperature operation (typically -40°C to 70°C for industrial systems) ensures reliable functioning in non-climate-controlled industrial environments like factory floors, outdoor installations, vehicles, and remote locations. This capability is achieved through careful component selection, thermal design, and elimination of moving parts like fans. Systems with wide temperature ranges can be deployed in harsh conditions without requiring expensive climate control systems, reducing installation and operating costs while improving reliability.

Fanless design means the computer uses passive cooling techniques with heat sinks and thermal engineering instead of active cooling fans. This design is crucial for industrial computers because it eliminates a common point of failure (the fan motor), prevents dust and contaminant ingress that could clog filters and cause overheating, enables sealed enclosures for harsh environments, reduces maintenance requirements, eliminates fan noise, and improves overall system reliability and longevity in challenging industrial conditions with dust, vibration, and temperature fluctuations.

TPM (Trusted Platform Module) 2.0 is a specialized security chip that provides hardware-based encryption capabilities, secure storage for authentication credentials, and system integrity verification. In industrial systems, TPM helps protect sensitive data, secure communication channels, prevent unauthorized access or tampering, and ensure the integrity of control systems. As industrial systems become more connected, TPM provides essential security features to protect against cyber threats targeting critical infrastructure and manufacturing systems.

Vibration and shock resistance are critical for industrial computing systems operating in environments with mechanical disturbances from machinery, vehicles, or handling. Systems are tested to standards like IEC 60068-2-64 (vibration) and IEC 60068-2-27 (shock) to ensure they can withstand these forces without component failure or connection issues. This resilience is achieved through solid-state storage, elimination of moving parts, reinforced component mounting, specialized chassis design, and industrial-grade components, ensuring reliable operation in mechanically challenging environments.

When installing modular computing systems, consider proper thermal management (ensuring adequate airflow around the unit), environmental protection (enclosures appropriate for dust/moisture levels), power quality (stable power source with appropriate voltage and backup options), EMI/RFI isolation (distance from high-interference sources), physical security, accessibility for module swapping and maintenance, proper grounding, cable management (strain relief and protection), and compliance with local regulations and industry standards. Proper planning ensures reliable operation and maximizes the benefits of the system's modular nature.

For fanless modular systems, proper thermal management is crucial: ensure adequate clearance around all sides (typically 5-10cm minimum), avoid enclosing in sealed cabinets without ventilation, mount vertically if possible to enhance natural convection cooling, install away from other heat-generating equipment, consider ambient temperature fluctuations in the installation location, follow manufacturer's mounting recommendations (which often include heat-dissipating brackets), and periodically check for dust accumulation on cooling surfaces. For high-temperature environments, consider additional passive cooling solutions or environmental controls.

For modular computing systems, select a power supply with sufficient wattage for the base system plus all modules (with 20-30% headroom for future expansion), ensure voltage matching the system's input range (typically 9-36V DC for industrial systems), implement surge protection for industrial environments with electrical noise, consider redundant power options for critical applications, use proper wire gauge for current requirements, and potentially include an uninterruptible power supply (UPS) for protection against power outages. The power system should account for the maximum possible configuration with all modules installed.

Best practices for cable management with modular systems include using appropriate cable types for the industrial environment (shielded where necessary), implementing strain relief to prevent connector damage, securing cables to prevent accidental disconnection due to vibration, labeling cables clearly for easier maintenance and troubleshooting, maintaining minimum bend radii to prevent internal damage, using cable trays or conduits for protection, separating power and data cables to minimize interference, allowing sufficient service loops for module replacement without disconnecting cables, and ensuring accessibility for future changes while maintaining a neat installation.

If the system fails to power on, check that the power supply provides the correct voltage within the system's input range (typically 9-36V DC), ensure connections are secure at both the power supply and system, verify any power switches or ignition control settings are correctly configured, check for tripped circuit breakers or blown fuses, inspect for visible damage to power connectors, test with an alternative known-good power supply if available, verify the power LED indicators, and check if the system is in AT mode requiring a specific power signal. For vehicle-mounted systems, ensure the ignition control is properly connected.

For issues with modules or expansion capabilities, verify the module is properly seated and secured, check power cycling the system after confirming connections, ensure any module-specific drivers are installed, check BIOS/UEFI settings for module-related options, inspect for physical damage to connectors, try an alternative slot if available, test with a known-working module to verify slot functionality, check system logs for error messages, and consult module-specific documentation for jumper settings or configuration requirements. After replacing modules, validate that the system recognizes the change through device manager or system information utilities.

For overheating issues, ensure adequate clearance around the system (minimum 5-10cm on all sides), check that the installation position allows for proper convection cooling (typically vertical mounting), clean dust from the chassis and heat sink fins using compressed air (when powered off), verify ambient temperature is within specifications, check system temperature through monitoring utilities or BIOS, ensure any thermal interface materials are properly applied if the system has been serviced, examine CPU usage for processes causing excessive load, and consider adding auxiliary passive cooling or relocating the system to a cooler environment if persistent.

To diagnose communication issues, first identify the specific interface (COM, LAN, USB, etc.) experiencing problems. Check physical connections and cables for damage, verify device driver installation and updates, confirm port configuration settings (baud rate, parity, etc. for serial connections; IP settings for network), try alternative cables or ports to isolate the issue, check for resource conflicts in Device Manager, test with a known-working device, verify any required protocol converters or adapters are functioning, and use diagnostic tools appropriate to the interface type (terminal emulator for serial, ping/traceroute for network) to identify where communication fails.

Najważniejsze informacje

Opis produktu

Dane techniczne

Informacje o systemie

Procesor

Pamięć systemowa

Chipset I/O

Informacje o BIOS

Watchdog

Monitor stanu sprzętu

TPM

iAMT

SBC

Parametry mechaniczne i środowiskowe

Temperatura pracy

Temperatura przechowywania

Wilgotność pracy

Wymiary (szer. x dł. x wys.)

Masa

Test wibracyjny

Test udarowy

Stopień ochrony IP

Zestaw montażowy

Rozszerzenia

M.2

Pamięć masowa

M.2

I/O z przodu

Przycisk zasilania

Przycisk resetu

Wskaźnik LED

Port COM

Cyfrowe I/O

Włączanie/wyłączanie zasilania sygnałem przewodowym

Antena

I/O z tyłu

USB

Port COM

Port LAN

Audio

DP

HDMI

DVI

Gniazdo SIM

Antena

Wejście AC/DC

I/O z prawej strony

Antena

I/O z lewej strony

Antena

Audio

Kodek audio

Wyświetlacz

Chipset graficzny

Rozdzielczość

Certyfikaty

Informacje o certyfikacji

Ethernet

Chipset LAN

Specyfikacja

Wymagania dotyczące zasilania

Specyfikacja wejścia napięciowego

Złącze wejścia napięcia

ACPI

Tryb zasilania

Wsparcie programowe

OS

Informacje o zamawianiu

Informacje o zamawianiu

Czym jest EMS-TGL-USB?

Najważniejsze cechy i korzyści

Zastosowania i przykłady użycia

Często zadawane pytania