Avalue · Przemysłowa i wbudowana płyta główna

EMX-EHLP

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Producent: Avalue

Najważniejsze informacje

  • Intel® Atom® x6000E and Celeron® Series processors
  • 1 x 260-pin DDR4 3200 MHz SO-DIMM Socket, Supports Up to 32GB Max (Only Atom® x6000E Series Processors Support IBECC)
  • 1 x DP++, 1 x HDMI, 1 x LVDS co-lay eDP
  • 4 x Intel® i226LM(IT)
  • 4 x USB 2.0 by Pin Header, 2 x USB3.1 Gen2 and 2 x USB3.1 Gen1 at I/O
  • 1 x M.2 Type B 3042/3052/2242/2260/2280, 1 x M.2 Key E 2230
  • 4 x RS232, 2 x RS-232/RS422/485
  • DC in +12V~24V

Opis produktu

The Avalue EMX-EHLP is a Thin Mini-ITX motherboard designed for industrial and embedded applications. It supports Intel® Atom® x6000E and Celeron® processors, accommodating up to 32GB DDR4 3200MHz SO-DIMM memory (with IBECC support on Atom® x6000E series).

Key features include triple display outputs (1 x DP++, 1 x HDMI, 1 x LVDS co-lay eDP), four Intel® i226LM 2.5GbE LAN ports, multiple USB ports (2 x USB 3.1 Gen2, 2 x USB 3.1 Gen1, 4 x USB 2.0), serial interfaces (4 x RS-232, 2 x RS-232/422/485), and expansion options through M.2 Type B and M.2 Key E slots.

With a compact form factor of 170mm x 170mm, wide voltage input range of 12V to 24V DC, and support for Windows and Linux operating systems, the EMX-EHLP offers a robust solution for space-constrained environments.

Dane techniczne

Procesor

Intel® Atom® x6000E and Celeron® Processor

Pamięć systemowa

1 x 260-Pin DDR4 3200MHz SO-DIMM SSocket Supports Up to 32GB (Only Atom® x6000E Series Processors Support IBECC)

Chipset I/O

EC iTE IT5571

Watchdog

H/W Reset: 1Sec. ~ 65535Sec./Min. and1 Sec. or 1Min./Step

BIOS

AMI uEFI BIOS, 256Mbit SPI Flash ROM

Monitor stanu sprzętu

CPU Temperature Monitoring

Voltage Monitoring

CPU Fan Speed Control

Płyta

Thin Mini ITX

Wiele wyświetlaczy

Triple Display

Chipset graficzny

Intel® UHD Graphics for 10th Gen Intel® Processors

Specyfikacja i rozdzielczość

1 x DP++: 4096 x 2160@60 Hz (DP: 4096 x 2160@60Hz)

1 x HDMI 2.0b: 4096 x 2160@60 Hz

LVDS: 1920 x 1080 Dual Channel 18/24-bits LVDS (Chrontel CH7511B-BFI eDP to LVDS)

1 x eDP 4096 x 2160@60Hz

LVDS and eDP Via Switch IC, Either One Display is Functional.

LVDS

Dual Channel 18/24-bits LVDS (Chrontel CH7511B eDP to LVDS) eDP By BOM Optionr

Rozszerzenia

1 x M.2 Type B Slot for 3042/3052/2242/2260/2280 Size with SATAIII + USB 3.1 GEN2, USB 2.0, SIM Slot for SSD/LTE/IO Cards Support WWAN+GNSS and SSD

*3042/2242 Bridge Bracket to 3052

*SATA 2 Share with M.2 key B SATA

* Only Supports One SIM Card

* Does not support I2S and PCM Functions

1 x M.2 Key E 2230 Support WiFi Module (1 x PCIe x1 & USB 2.0 Signal)

* Does not Support PCM/I2S and UART Functions

Kodek audio

Realtek ALC888S HD Audio Decoding Controller

Interfejs audio

Support Line-out & Mic-in & Front Audio Pin-header

Wzmacniacz audio

TI TPA3113D2 Stereo Class-D 6W

Chipset LAN

4 x Intel® i226LM/IT(Default: i226LM/IT);

(i226IT for Wide temp version) 2.5 Gigabit Ethernet

(BOM optional for 1 x 2 RJ45 Thin Mini ITX Cost version design SKU)

Interfejs Ethernet

100/1000/2500 Base-Tx GbE compatible Gigabit Ethernet

Port LAN

4 x RJ-45

OS

Windows 10, Linux

Informacje o certyfikacji

CE, FCC, RoHS Compliant

USB

2 x USB 3.1 Gen2

2 x USB 3.1 Gen1

4 x USB 2.0

Port COM

4 x RS-232

2 x RS232/422/485

SATA

2 x SATA III

2 x SATA Power

DIO

1 x 16-bit GPIO

Temperatura pracy

0 ~ 60°C (32 ~ 140 °F) Intel® Pentium®/Celeron®N/J Series CPU SKU

-20~60°C (-8~140°F) Intel® Atom®x6000 Series CPU SKU

w/HDD/SSD, ambient with 0.5 m/s Air flow

Temp. przechowywania

-40 ~ 75°C (-40 ~ 167°F)

Wymiary (dł. x szer.)

6.7" x 6.7" (170mm x 170mm)

Masa

0.88lbs (0.4Kgs)

Wilgotność pracy

40°C @ 95% Relative Humidity, Non-condensing

Tryb zasilania

AT/ATX (Default Setting: ATX)

Wymagania dotyczące zasilania

DC in +12V~24V

Informacje o zamawianiu

EMX-EHLP-J6412-A1R (J6412, 4LAN, i226LM, Standard Temp.)

EMX-EHLP-J6413-A1R (J6413, 4LAN, i226LM, Standard Temp.)

EMX-EHLP-X13E-A1R (x6413E, 4LAN, i226IT, Wide Temp.)

EMX-EHLP-X25RE-A1R (x6425RE, 4LAN, i226IT, Wide Temp.)

EMX-EHLP-J12-A1-1R (J6412, 2LAN, i226V, Standard Temp.)

Intel® Celeron®/Atom™ SoC BGA Processor Thin Mini ITX SBC Motherboard

Czym jest EMX-EHLP?

The EMX-EHLP is a przemysłowa i wbudowana płyta główna manufactured by Avalue, designed specifically for thin-mini-itx applications. It features sieć of 4 x Intel® i226LM/IT(Default: i226LM/IT);, (i226IT for Wide temp version) 2.5 Gigabit Ethernet, (BOM option… and system operacyjny of AMI uEFI BIOS, 256Mbit SPI Flash ROM. The Avalue EMX-EHLP is a Thin Mini-ITX motherboard designed for industrial and embedded applications. It supports Intel® Atom® x6000E and Celeron® processors, accommodating up to 32GB DDR4 3200MHz SO-DIMM memory (with IBECC support on Atom® x6000E series). Key features include triple display outputs (1 x DP++, 1 x HDMI, 1 x LVDS co-lay eDP), four Intel® i226LM 2.5GbE LAN ports, multiple USB ports (2 x USB 3.1 Gen2, 2 x USB 3.1 Gen1, 4 x USB 2.0), serial interfaces (4 x RS-232, 2 x RS-232/422/485), and expansion options through M.2 Type B and M.2 Key E slots. With a compact form factor of 170mm x 170mm, wide voltage input range of 12V to 24V DC, and support for Windows and Linux operating systems, the EMX-EHLP offers a robust solution for space-constrained environments.

Najważniejsze cechy i korzyści

  • Intel® Atom® x6000E and Celeron® Series processors
  • 1 x 260-pin DDR4 3200 MHz SO-DIMM Socket, Supports Up to 32GB Max (Only Atom® x6000E Series Processors Support IBECC)
  • 1 x DP++, 1 x HDMI, 1 x LVDS co-lay eDP
  • 4 x Intel® i226LM(IT)
  • 4 x USB 2.0 by Pin Header, 2 x USB3.1 Gen2 and 2 x USB3.1 Gen1 at I/O
  • 1 x M.2 Type B 3042/3052/2242/2260/2280, 1 x M.2 Key E 2230
  • 4 x RS232, 2 x RS-232/RS422/485
  • DC in +12V~24V

Zastosowania i przykłady użycia

Model EMX-EHLP doskonale sprawdza się w różnych zastosowaniach automatyki przemysłowej:

  • DC-powered industrial installations and mobile applications
  • Legacy equipment integration and serial communication
  • High-performance computing and data processing tasks
  • Peripheral device connectivity and data transfer
  • Memory-intensive applications and multitasking
  • Custom industrial computing solutions
  • Industrial and embedded applications
  • Industrial automation platforms

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