Product Datasheet

28 September 2026

Computer-on-Module · COM Express Type 6

ESM-ASLC

Series: ESM

Manufactured byAvalue
ESM-ASLC Front

The Avalue ESM-ASLC is a COM Express Type 6 Compact module (95 x 95 mm) built on the Intel Atom x7000RE Series processors, designed as a rugged, low-power compute core for wide-temperature embedded and industrial designs. With a DDR5 4800MHz SO-DIMM (up to 16GB, In-Band ECC on selected SKUs), onboard TPM 2.0, and optional eMMC up to 128GB, it delivers efficient x86 performance through the standardised Type 6 pin-out. It exposes configurable PCIe Gen3, up to 4x USB3.2 Gen2 + 8x USB2.0, 2x SATA III, Intel i226-IT 2.5GbE, HDMI 2.0b / DP 1.4 / LVDS triple display, and an extended -40~80°C operating range with a wide +9~19V input, running Windows 11 64-bit or Linux.

Key Features

  • COM Express Type 6 Compact module (95 x 95 mm)
  • Intel Atom x7000RE Series processors
  • 1 x 262-pin DDR5 4800MHz SO-DIMM up to 16GB (In-Band ECC on selected SKUs)
  • Onboard TPM 2.0, optional eMMC 5.1 up to 128GB
  • Configurable PCIe Gen3 (4x x1 / 1x x4 / 2x x1)
  • Intel i226-IT 2.5GbE, up to 4x USB3.2 Gen2 + 8x USB2.0
  • 2 x SATA III, HDMI 2.0b / DP 1.4 / LVDS triple display
  • Extended -40~80°C operating temperature
  • Windows 11 64-bit / Linux; CE, FCC, RoHS

Technical Specifications

System Information

ProcessorIntel® Atom® x7000RE Series Processors
System Memory1 x 262-pin DDR5 4800MHz SO-DIMM socket, supports up to 16GB Max,, support In-Band ECC memory protection (selected SKUs)
I/O ChipsetEC iTE IT5782VG-I-128/BX or Super IO Equivalent
Watchdog TimerH/W Reset, 1Sec. ~ 65535Sec. and 1Sec./Step
BIOSAMI uEFI BIOS, 256 Mbit SPI Flash ROM
H/W Status MonitorCPU temperature monitoring, Voltages monitoring, CPU fan speed control
TPMOnboard TPM 2.0

Expansion

ExpansionBOM1(default) : 4 x PCIe x1 Gen3, BOM2: 1 x PCIe x4 Gen3, BOM3: 2 x PCIe x1 Gen3

Storage

StorageeMMC 5.1 Up to 128GB (Optional)

Display

Graphic ChipsetIntel® UHD Graphics
Spec. & ResolutionHDMI 2.0b: 1920x1080 as Default or 4096x2160 @60Hz set by Bios., *VBT1 use Vbios for Full HD/ no display audio. VBT3 use Vbios for output 4K/ support display audio, DP 1.4: 3840x2160 @60Hz, LVDS (via eDP-to-LVDS): 1920x1080 @60Hz, LVDS via CH7511B or eDP 1.4b(By BOM Optional): 2Lanes FHD 1920x1080 @60Hz
Multiple DisplayTriple Display Support
LVDSCH7511B(eDP to LVDS)
DDIDDIA: 2 CH LVDS (via eDP-to-LVDS) or eDP(By BOM Optional), DDIB: DDI Signal, TCP0: DDI2 Signal or Type C Signal

Audio

Audio InterfaceIntel® HD Audio Integrated on CPU

Ethernet

LAN Chipset1 x Intel® i226-IT
Ethernet Interface10/100/1000/2500 Base-Tx GbE Compatible

Software Support

OSWindows 11 64-bit, Linux

Certification

Certification InformationCE, FCC Class, RoHS Compliant

I/O

USBBOM1(default) : 8 x USB2.0, 2 x USB3.2 Gen 2x1, BOM2: 8 x USB2.0, 4 x USB3.2 Gen 2x1, BOM3: 8 x USB2.0, 4 x USB3.2 Gen 2x1
COM Port2 x UART (RX/TX Only)
SATABOM1(default) : 2 x SATA III, BOM2: N/A, BOM3: 2 x SATA III
DIO1 x 8-bit GPIO
MIO1 x SMBus, 1 x LPC, 1 x eSPI (W-B 10Px1 1.0mm 90D for debug conn), 1 x I2C, 1 x SPI

Mechanical & Environmental

Operating Temp.Extended -40°C ~ 80°C (-40°F ~ 176°F)
Storage Temp.-40°C ~ 75°C (-40°F ~ 167°F)
Operating Humidity40°C @ 95% Relative Humidity, Non-condensing
Weight0.16lbs (0.07kg)
Power Requirement+9V ~ +19V
Power ModeAT/ATX
Dimension (L x W)3.74” x 3.74” (95 x 95 mm)

Ordering Information

Ordering InformationESM-ASLC-X13RE-A1R | Intel Atom® x7213RE COM Express Module 95*95 mm Type 6, ESM-ASLC-X33RE-A1R | Intel Atom® x7433RE COM Express Module 95*95 mm Type 6, ESM-ASLC-X35RE-A1R | Intel Atom® x7835RE COM Express Module 95*95 mm Type 6, ACC-ESMASLC-CL-1R | Cooler for ESM-ASLC/ESM-TWLC W/FAN H=60mm for wide temp

Authorised distributor, India

TSL Automation Solutions

Mumbai, India

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© 2026 TSL Automation Solutions. Specifications subject to change without notice. This datasheet was generated from manufacturer-supplied technical data.