Ficha técnica del producto
14 September 2026
Sistema de computación · Expandable-Computing-System
SLP-WHG-TSN
Serie: SLP
Fabricado porAvalue
The Avalue VMS-CFS-M12 is a modular computing system designed for vehicular applications, featuring M12 connectors for robust and secure connectivity. It supports a fanless design and operates over a wide temperature range, making it suitable for demanding environments. This system is ideal for applications that require durable, reliable connections and robust performance, especially in mobile and industrial settings.
Características principales
- 8th Gen Intel Core SoC i7/i5/i3 & Celeron BGA Processor
- 2 x 260-pin DDR4 2133 MHz SO-DIMM Socket, up to 32GB Max (Non ECC Only)
- Rich I/O, 3-USB3.1, 3-HDMI, 4-COM, 3-LAN, 4-TSN Gigabit Ethernet
- 1 x Key A M.2 2230 supports Wi-Fi & BT Modulle, 1 x M.2 Key-B 3042/2242/2260/2280 with
- internal SIM slot
- Fanless operation temperature from -20°C ~ 50°C
- CE/FCC Class A
- Wide range DC power input from +12~24V
- Support TSN Timing and Synchronization for Time-Sensitive Applications compliant to IEEE 802.,1AS-Rev/AS, and IEEE 1588V2
Especificaciones técnicas
Información del sistema
| Procesador | Intel® Core™ i7-8665UE Processor (15W, 8M Cache, up to 2.0 GHz), Intel® Core™ i5-8365UE Processor (15W, 8M Cache, up to 1.8 GHz), Intel® Core™ i3-8145UE Processor (15W, 4M Cache, up to 1.6 GHz), Intel® Celeron® Processor 4305UE (15W, 2M Cache) |
|---|---|
| Memoria del sistema | 2 x 260-pin SODIMM socket Max. up to 32GB DDR4 2133MT/s |
| Información del BIOS | AMI uEFI BIOS 256 Mbit SPI Flash ROM |
| Temporizador watchdog | H/W Reset, 1sec. ~ 65535sec. |
| Monitor de estado del hardware | Monitoring CPU & System Temperature and Voltage |
| SBC | EMX-WHLGP |
| TPM | Onboard TPM 2.0 |
Mecánica y condiciones ambientales
| Temperatura de funcionamiento | -20~50°C (41˚F ~ 122˚F) w/Industrial SSD, ambient w/ 0.5m/s air flow |
|---|---|
| Temperatura de almacenamiento | -30°C ~ 70°C (-22°F ~ 158°F) |
| Humedad en funcionamiento | 40°C @ 95% Relative Humidity, Non-condensing |
| Dimensiones (An x L x Al) | 217 mm x 115 mm x 220 mm |
| Peso | 2.6 kg (System), 3.4 kg (w_Package) |
| Ensayo de vibración | With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 1hr/axis |
| Ensayo de choque | With SSD : 10Grms, IEC 60068-2-29, Half Sine, 11ms |
| Ensayo de caída | Complied with ISTA 2A |
Expansión
| M.2 | 1 x M.2 Key-A 2230 for Wi-Fi & BT Module, 1 x M.2 Key-B 3042/2242/2260/2280, supports SATA 3/PCIe lll x 1/USB 2.0 and internal SIM slot 1 |
|---|---|
| PCIe | 1 x PCIe*1 slot, 1 x PCIe*4 slot, w/ASIX TSN Card: Quad Port TSN Gigabit Ethernet PCIe NIC Card |
Almacenamiento
| M.2 | 1 x M.2 Key-B 3042/2242/2260/2280, support SSD(share with expansion slot) |
|---|---|
| Bahía de unidad de 2,5 | 1 x 2.5” Drive Bay (internal) |
E/S trasera
| USB | 3 x USB3.1 Gen1, 1 x USB Type C w/o ALT mode |
|---|---|
| Puerto LAN | 3 x RJ-45 GbE, 4 x RJ45 for TSN Gigabit Ethernet |
| Botón de encendido | 1 x Power On/Off |
| Puerto COM | 4 x RS-232 |
| Indicador LED | 1 x Power LED, 1 x HDD LED |
| Ranura SIM | 1 x Internal SIM slot |
| Encendido/apagado por control cableado | 2-Pin Terminal Block |
| Antena | 2 x Antenna with dust cover |
| Entrada CA/CC | 3-Pin Terminal Block (V+. V-, GND) |
Pantalla
| Chipset gráfico | Intel® Processor Graphics |
|---|---|
| Resolución | 3 x HDMI 1.4b: 3840 x 2160 @ 30 Hz |
Certificaciones
| Información de certificación | CE/FCC Class A |
|---|
Ethernet
| Chipset LAN | 1 x Intel® I219-LM, 2 x Intel® I210-IT |
|---|
Requisitos de alimentación
| Modo de alimentación | AT/ATX (ATX is default setting) |
|---|
Soporte de software
| SO | Win 10 64bit, Linux |
|---|
Información de pedido
| Información de pedido | 8th Gen Intel® Core™ Processor Core™ SoC i7/i5/i3 & Celeron® BGA Processor, Fanless Expandable Slot PC with TSN Gigabit Ethernet PCIe NIC Card, SLP-WHG-86-A1-2R (i7-8665UE), SLP-WHG-83-A1-2R (i5-8365UE), SLP-WHG-81-A1-2R (i3-8145UE) |
|---|