Avalue · Sistema di elaborazione

EMS-EHL-4COM isolation

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Scheda tecnica

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Produttore: Avalue

In evidenza

  • Intel® Celeron®/Atom™ J6413/x6425E SoC BGA Processor
  • 1 x 260-pin SODIMM socket Max. up to 32GB DDR4 3200MT/s
  • Rich I/O, 4-USB3.2, 2-USB2.0, 1-DP, 1-HDMI, 6-COM (4COM w/2.5KV isolation), 2-LAN, 1-8bit GPIO
  • Support 5G (Sub-6G) module, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE
  • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 65°C (ST)
  • CE, FCC Class B, LVD 62368-1, IP50
  • Wide range DC power input from +9~36V
  • Support HW TPM 2.0
  • Support IET modules

Descrizione del prodotto

The Avalue EMS-EHL-4COM-isolation is a modular industrial computing system featuring Intel® Elkhart Lake processors. It is designed with 4 isolated COM ports, making it ideal for applications that require secure and stable serial communication.

The fanless design and wide operating temperature support ensure reliability in harsh industrial environments. Its modular design allows for flexible configuration, making it suitable for various industrial applications.

Specifiche tecniche

Processore

Intel® Celeron® Processor J6413 (1.5M Cache, up to 3.00Ghz), ST, Tj=105°C

Intel® Atom® Processor x6425E(1.5M Cache, up to 3.00Ghz), WT, Tj=-40°C ~105°C

Memoria di sistema

1 x 260-pin SODIMM socket Max. Up to 32GB DDR4 3200 MT/s

Watchdog timer

H/W Reset, 1sec. ~ 65535sec.

Monitoraggio dello stato hardware

CPU & system temperature monitoring and Voltages monitoring

SBC

EBM-EHLS

TPM

TPM 2.0

Temperatura di esercizio

-40°C ~ 70°C (w/SSD) ambient w/ 0.5 air flow, WT sku, x6425E

-40°C ~ 60°C (w/SSD) ambient w/ 0.2 air flow, WT sku, x6425E

0°C ~ 65°C (w/SSD) ambient w/ 0.5 air flow, ST sku, J6413

0°C ~ 55°C (w/SSD) ambient w/ 0.2 air flow, ST sku, J6413

Temperatura di stoccaggio

-30°C ~ 70°C (-22°F ~ 158°F)

Umidità di esercizio

40°C @ 95% Relative Humidity, Non-condensing

Dimensioni (L x P x A)

240mm x 150mm x 64 mm (w/ IET module)

Peso

1.9 kg (System)

2.7 kg (w_Package)

Test di vibrazione

With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 1hr/axis

Test di urto

With SSD : 55Grms, IEC 60068-2-27, Half Sine, 11ms

Grado di protezione IP

IP 50

Kit di montaggio

Wall mount kit (standard)

DIN RAIL (optional)

M.2

1 x M.2 (Key-B, 2242/3042, PCIex2, or ( PCIex1+USB3.1 GEN1), or (SATAIII + USB 3.1 GEN2), USB2.0, SIM Slot for LTE Cards)

*Default is PCIex1/SATAIII+USB3.1 GEN1, others through BIOS Modification.

1 x M.2 (Key-E, 2230, PCIex1, USB2.0)

M.2

1 x M.2 Key-B 2242/2280, support SATA

1 x M.2 Key-B 2242, support SATA (share with expansion slot)

Pulsante di accensione

1 x Push Button for Power on/off

Pulsante di reset

1 x Push Button for Reset

Indicatore LED

1 x Power LED (Blue)

1 x Storage LED (Yellow)- M.2 B-key SATA

1 x LTE LED (Green)- M.2 B-key PCIe

1 x Wifi LED (Green)- M.2 E key

Porta COM

2 x COM RS232/422/485 (select via BIOS, auto flow control via HW)

I/O digitale

1 x 8-bit GPIO (DB9)

Audio

1 x Mic-In, 1 x Line-Out

Accensione/spegnimento con comando via cavo

1 x 2-Pin Terminal Block for wire-control power on/off

Antenna

2 x Antenna with dust cover

USB

2 x USB 2.0

2 x USB 3.1 Gen.2 (10Gbp/s)

2 x USB 3.1 Gen.1 (5Gbp/s), via USB Hub

Porta COM

4x RS232/422/485 (2.5KV isolation)

Porta LAN

2 x RJ45

Audio

1 x Mic-in,1 x Line-out

DP

1 x DP 1.4

HDMI

1 x HDMI 2.0b

Antenna

2 x Antenna with dust cover

Ingresso AC/DC

3-Pin Terminal Block (V+. V-, GND)

Antenna

2 x Antenna with dust cover

Antenna

2 x Antenna with dust cover

Codec audio

Realtek ALC888S (co-lay with ALC897) HD codec

Chipset grafico

Intel® UHD Graphics for 10th Gen Intel® Processors

Risoluzione

DP++ 1.4: 4096x2304 @ 60Hz

HDMI 2.0b : Max. resolution 4096x2304 @ 60Hz

Informazioni sulle certificazioni

CE, FCC Class B, LVD 62368-1

Chipset LAN

2 x Intel I226-IT

Specifiche

2 x 10/100/1000/2.5G Base-Tx GbE compatible

ACPI

Single power ATX Support S0,S3, S4, S5

ACPI 5.0 Compliant

Modalità di alimentazione

AT/ATX (ATX is default setting)

OS

Win 10 64bit / Win 11 64 bit/ Linux

Informazioni per l'ordine

Intel® Elkhart Lake Atom®/Celeron® Processor Fanless Rugged Embedded System, w_4COM Isolation IET Module

EMS-EHL-X64-A1-4R (x6425E)

EMS-EHL-J64-A1-4R (J6413)

Che cos'è EMS-EHL-4COM isolation?

The EMS-EHL-4COM isolation is a sistema di elaborazione manufactured by Avalue, designed specifically for modular-computing-system applications. It features processore of Intel® Celeron® Processor J6413 (1.5M Cache, up to 3.00Ghz), ST, Tj=105°C, Intel® Atom® Processor x6425E(1.…, rete of 2 x RJ45 and sistema operativo of Win 10 64bit / Win 11 64 bit/ Linux. The Avalue EMS-EHL-4COM-isolation is a modular industrial computing system featuring Intel® Elkhart Lake processors. It is designed with 4 isolated COM ports, making it ideal for applications that require secure and stable serial communication. The fanless design and wide operating temperature support ensure reliability in harsh industrial environments. Its modular design allows for flexible configuration, making it suitable for various industrial applications.

Caratteristiche e vantaggi principali

  • Intel® Celeron®/Atom™ J6413/x6425E SoC BGA Processor
  • 1 x 260-pin SODIMM socket Max. up to 32GB DDR4 3200MT/s
  • Rich I/O, 4-USB3.2, 2-USB2.0, 1-DP, 1-HDMI, 6-COM (4COM w/2.5KV isolation), 2-LAN, 1-8bit GPIO
  • Support 5G (Sub-6G) module, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE
  • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 65°C (ST)
  • CE, FCC Class B, LVD 62368-1, IP50
  • Wide range DC power input from +9~36V
  • Support HW TPM 2.0
  • Support IET modules

Applicazioni e casi d'uso

EMS-EHL-4COM isolation è ideale per diverse applicazioni di automazione industriale:

  • Applications that require secure and stable serial communication
  • Dust-sensitive environments and silent operation requirements
  • DC-powered industrial installations and mobile applications
  • Extreme temperature environments and outdoor installations
  • High-performance computing and data processing tasks
  • Networked industrial systems and data communication
  • Peripheral device connectivity and data transfer
  • Memory-intensive applications and multitasking

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