What are the display capabilities of the EZX-EHLP?

The EZX-EHLP supports dual display through Mini DisplayPort and eDP 1.3 interfaces, both supporting resolutions up to 4096x2160@60Hz. The board features Intel® UHD Graphics to handle these high-definition displays, making it suitable for industrial HMI applications, digital signage, and other display-intensive embedded applications.

What expansion options does the EZX-EHLP provide?

The EZX-EHLP offers expansion through a versatile M.2 Key-B 3042/2242 slot (via a bridge bracket to 3052) that supports multiple configurations: PCIe x2 (via OEM BIOS request), default PCIe x1+USB2.0/USB3.0, or SATAIII+USB2.0/USB3.0. It includes a SIM slot for adding SSD, LTE, or I/O cards, providing exceptional flexibility for customization based on application requirements.

What are the temperature operating ranges for the EZX-EHLP?

The EZX-EHLP offers two operating temperature ranges depending on the CPU: For Atom N/J Series CPU SKU, it operates from 0°C to 60°C with 0.5 m/s airflow. For Atom x6000E Series CPU SKU, it provides extended temperature range from -20°C to 60°C with 0.5 m/s airflow. Storage temperature range is -40°C to 75°C, making it suitable for various industrial environments.

What I/O interfaces are available on the EZX-EHLP?

The EZX-EHLP provides comprehensive I/O with 2 x USB 3.1 Gen2 Type A ports, 4 x USB 2.0 via pin header, 1 x RS-232/422/485 serial port, 1 x 8-bit GPIO, 1 x RJ-45 Gigabit Ethernet port, and display interfaces including Mini DP and eDP 1.3. This rich I/O complement makes it ideal for connecting to various sensors, peripherals, and networks in industrial applications.

Does the EZX-EHLP have any onboard storage?

The EZX-EHLP comes with onboard eMMC 5.1 64GB storage. Additionally, it supports expansion storage through the M.2 Type B slot that can accommodate an NVMe SSD, providing flexibility for applications requiring additional storage capacity or performance beyond what the onboard eMMC provides.

What operating systems does the EZX-EHLP support?

The EZX-EHLP supports Windows 10 and Linux operating systems, making it versatile for various industrial and embedded applications. This compatibility with both mainstream operating systems allows developers to leverage familiar development environments and extensive software libraries for their specific application requirements.

Avalue · Przemysłowa i wbudowana płyta główna

EZX-EHLP

Karta katalogowa

*Cena na zapytanie. Prosimy o kontakt w sprawie wyceny.

Producent: Avalue

Najważniejsze informacje

Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® J Series Processors (Bottom Layer Soldered Processor)
Onboard Single Channel LPDDR4 4GB Memory Down (8GB for BOM Option)
Dual Display, Mini DP, eDP 1.3
Single Intel® I210AT/IT Gigabit Ethernet
M.2 Key-B 3042/2242 Bridge Bracket to 3052 (with PCIe x2 (Via OEM BIOS Request) or Default (PCIe x1+USB2.0/USB3.0), or (SATAIII+ USB2.0/USB3.0), SIM Slot for SSD/LTE/IO Cards) with FPC Connector
1 x Dual Deck USB3.1 Gen2 Type A for 2 x USB 3.1 Gen2 at I/O, 4 x USB 2.0 by Pin Header
1 x RS-232/422/485
DC in +12V

Opis produktu

The Avalue EZX-EHLP is a compact 1.8-inch Single Board Computer (SBC) designed for embedded and industrial applications. It integrates Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® J Series processors, offering reliable performance in a small form factor.

Key features include 4GB onboard LPDDR4 memory (expandable to 8GB), dual display outputs via Mini DP and eDP 1.3, a single Intel® I210AT/IT Gigabit Ethernet port, and versatile expansion options through an M.2 Key-B slot supporting PCIe, USB, SATA, and SIM cards.

The board also provides multiple USB ports, a serial interface, and GPIOs, making it suitable for various industrial automation, IoT, and edge computing applications.

Dane techniczne

Procesor

Onboard Intel® Pentium®/Celeron®/Atom™ SoC BGA Processor (with CPU Bottom Mounted)

Pamięć systemowa

Onboard Single Channel LPDDR4 4GB Memory Down (8GB for BOM Option)

Platform Controller Hub

Integrated

Chipset I/O

EC iTE IT5571

Watchdog

H/W Reset, 1sec. ~ 65535sec and 1sec. or 1min./step

BIOS

AMI BIOS, 256Mbit SPI Flash ROM

Monitor stanu sprzętu

CPU & System Temperature Monitoring Voltages Monitoring

TPM

Onboard eMMC 5.1 64GB

Pamięć masowa

1 x M.2 Type B

Wiele wyświetlaczy

Dual Display

Chipset graficzny

Intel® UHD Graphics

Specyfikacja i rozdzielczość

Mini DP: Max Resolution 4096x2160@60Hz

eDP1.3: Max Resolution 4096x2160@60Hz

Rozszerzenia

1 x M.2 Type B 3042/2242 Bridge Bracket to 3052

(with PCI-e x2 via OEM BIOS Request

or Default PCI-e x1+USB2.0/USB3.0,

or SATA III+ USB2.0/USB3.0,

SIM Slot for SSD/LTE/IO Cards)

*Default is PCI-e x1/SATA III+USB2.0/USB3.0Support WWAN+GNSS or NVMe SSD

Chipset LAN

1 x Intel I210AT/IT Gigabit Ethernet

Interfejs Ethernet

1 x 10/100/1000 Base-Tx GbE Compatible

Port LAN

1 x RJ-45

OS

Windows 10, Linux

Informacje o certyfikacji

CE, FCC Class, RoHS Compliant

USB

2 x USB 3.1 Gen2

4 x USB2.0

Port COM

1 x RS232/422/485

DIO

1 x 8-bit GPIO

Temperatura pracy

0~60°C, w/HDD/SSD, Ambient with 0.5 m/s Air Flow Atom N/J Series CPU SKU

-20~60°C, w/HDD/SSD, Ambient with 0.5 m/s Air Flow Atom x6000E Series CPU SKU

Temp. przechowywania

-40°C ~ 75°C (-40°F ~ 167°F)

Wymiary (dł. x szer.)

3.31" x 2.55" (84mm x 65mm)

Masa

0.66lbs (0.3Kgs)

Wilgotność pracy

40°C @ 95% Relative Humidity, Non-condensing

Wymagania dotyczące zasilania

DC in +12V

Tryb zasilania

AT/ATX (Default Setting: ATX)

Informacje o zamawianiu

EZX-EHLP-J6412-A1R

EZX-EHLP/J6412/1COM/6USB/1LAN/A1

EZX-EHLP-J6413-A1R

EZX-EHLP/J6413/1COM/6USB/1LAN/A1

EZX-EHLP-X11E-A1R

EZX-EHLP/x6211E/1COM/6USB/1LAN/A1

EZX-EHLP-X13E-A1R

EZX-EHLP/x6413E/1COM/6USB/1LAN/A1

EZX-EHLP-X12RE-A1R

EZX-EHLP/x6212RE/1COM/6USB/1LAN/A1

Intel® Pentium®/Celeron®/Atom™ SoC BGA Processor 1.8 SBC Motherboard

Czym jest EZX-EHLP?

The EZX-EHLP is a przemysłowa i wbudowana płyta główna manufactured by Avalue, designed specifically for 1.8inch-sbc applications. It features sieć of 1 x Intel I210AT/IT Gigabit Ethernet and system operacyjny of AMI BIOS, 256Mbit SPI Flash ROM. The Avalue EZX-EHLP is a compact 1.8-inch Single Board Computer (SBC) designed for embedded and industrial applications. It integrates Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® J Series processors, offering reliable performance in a small form factor. Key features include 4GB onboard LPDDR4 memory (expandable to 8GB), dual display outputs via Mini DP and eDP 1.3, a single Intel® I210AT/IT Gigabit Ethernet port, and versatile expansion options through an M.2 Key-B slot supporting PCIe, USB, SATA, and SIM cards. The board also provides multiple USB ports, a serial interface, and GPIOs, making it suitable for various industrial automation, IoT, and edge computing applications.

Najważniejsze cechy i korzyści

Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® J Series Processors (Bottom Layer Soldered Processor)
Onboard Single Channel LPDDR4 4GB Memory Down (8GB for BOM Option)
Dual Display, Mini DP, eDP 1.3
Single Intel® I210AT/IT Gigabit Ethernet
M.2 Key-B 3042/2242 Bridge Bracket to 3052 (with PCIe x2 (Via OEM BIOS Request) or Default (PCIe x1+USB2.0/USB3.0), or (SATAIII+ USB2.0/USB3.0), SIM Slot for SSD/LTE/IO Cards) with FPC Connector
1 x Dual Deck USB3.1 Gen2 Type A for 2 x USB 3.1 Gen2 at I/O, 4 x USB 2.0 by Pin Header
1 x RS-232/422/485
DC in +12V

Zastosowania i przykłady użycia

Model EZX-EHLP doskonale sprawdza się w różnych zastosowaniach automatyki przemysłowej:

DC-powered industrial installations and mobile applications
Legacy equipment integration and serial communication
High-performance computing and data processing tasks
Networked industrial systems and data communication
Peripheral device connectivity and data transfer
Memory-intensive applications and multitasking
Data logging and storage-intensive operations
Internet of Things (IoT) and edge computing

Często zadawane pytania

The Avalue EZX-EHLP features Intel® Atom® x6000E Series and Intel® Pentium®/Celeron® J Series processors, onboard 4GB LPDDR4 memory (expandable to 8GB), dual display capability via Mini DP and eDP 1.3, Intel® I210AT/IT Gigabit Ethernet, versatile expansion via M.2 Key-B slot, multiple USB ports including 2 x USB 3.1 Gen2, RS-232/422/485 serial interface, and operates with +12V DC input in a compact 84mm x 65mm form factor.

The EZX-EHLP supports several processor options including Intel® Celeron® J6412/J6413, Intel® Atom™ x6211E/x6413E, and Intel® Atom™ x6212RE processors. These processors are soldered to the bottom of the board, and each variant has a specific model number as indicated in the ordering information, allowing customers to select the performance level appropriate for their application requirements.

1.8-inch SBCs (Single Board Computers) are ultra-compact embedded computers measuring approximately 84mm x 65mm. Their small form factor makes them ideal for space-constrained applications including industrial automation, IoT gateways, edge computing, digital signage, medical devices, transportation systems, robotics, and portable instrumentation. Despite their small size, these boards offer significant processing capabilities, multiple I/O options, and industrial-grade reliability for demanding environments.

1.8-inch SBCs offer several advantages over larger form factors including significantly reduced footprint for space-constrained installations, lower power consumption (typically 5-15W), reduced heat generation allowing for fanless designs, simplified integration into existing systems, lighter weight for mobile applications, and comparable performance to larger boards for many tasks. These benefits make them ideal for applications where size, weight, and power constraints are critical considerations.

In 1.8-inch SBCs, Intel Atom processors (particularly the x6000E series) are designed specifically for embedded applications with excellent power efficiency, extended temperature ranges, and long lifecycle support. Pentium and Celeron J-series processors offer somewhat higher performance with slightly increased power consumption, while maintaining compatibility with embedded requirements. The choice between these options involves balancing processing power needs against thermal, power, and longevity considerations for specific applications.

When selecting a 1.8-inch SBC for industrial applications, consider: processing requirements for your workload, memory and storage needs, specific I/O interface requirements, temperature range for the deployment environment, power constraints, expansion capabilities, long-term availability guarantees, operating system support, technical support quality, total cost of ownership, and mechanical integration requirements. For critical applications, prioritize industrial-grade components and extended temperature range support to ensure reliability in demanding environments.

For cooling 1.8-inch SBCs in enclosed systems: ensure at least 0.5 m/s airflow as specified in thermal requirements; use conduction cooling with thermal pads connecting the processor to the enclosure acting as a heat sink; implement passive cooling solutions like aluminum enclosures with external fins to increase surface area; maintain adequate clearance around heat-generating components; consider adding thermal vias in custom carrier boards; position the board away from other heat sources; implement thermal monitoring and throttling; and for extreme environments, use specialized cooling techniques like heat pipes or thermally conductive encapsulation materials.

For 1.8-inch SBCs, power considerations include: providing stable 12V DC input with proper regulation (typically requiring 2-3A capacity); implementing proper power sequencing during boot and shutdown; adding surge protection for industrial environments; considering power filtering to eliminate electrical noise; implementing brownout protection for unstable power sources; calculating total power budget including all peripherals; planning for power management and sleep states if battery operation is required; using high-quality power connectors rated for industrial vibration; and potentially implementing backup power solutions for critical applications requiring high availability.

To expand 1.8-inch SBC capabilities: utilize M.2 slots for adding WiFi/Bluetooth, cellular connectivity, or storage; connect USB expansion hubs for additional peripherals; implement I2C or SPI-based sensor networks through GPIO headers; use industrial Ethernet protocols over the existing Ethernet port; integrate specialized I/O modules through available serial interfaces; develop custom carrier boards for application-specific needs; implement software-based capabilities through containerization; utilize DisplayPort daisy-chaining for multiple displays if supported; consider USB-C alternate modes for expanded connectivity; and leverage network-based resources for functions that cannot be implemented locally.

Common 1.8-inch SBC performance bottlenecks include: thermal limitations (addressed through proper cooling solutions); memory constraints (mitigated by optimizing memory usage and selecting models with maximum RAM); storage I/O (improved by using high-performance NVMe storage over SATA); network limitations (overcome by optimizing network traffic or using additional interfaces); USB bus saturation (resolved by distributing devices across controllers); CPU restrictions in multithreaded applications (addressed through code optimization for available cores); and graphics processing limits (managed by offloading to dedicated hardware or optimizing visual elements). Effective performance tuning requires monitoring system metrics to identify the specific bottlenecks in your application.

For mounting 1.8-inch SBCs: use the designated mounting holes with appropriate standoffs (typically M3); maintain minimum clearances specified in the manual; ensure proper thermal contact if using conduction cooling; consider orientation effects on natural convection cooling; use vibration-resistant fasteners with thread-locking compound for mobile applications; implement strain relief for all cables connected to the board; avoid mounting near sources of electro-magnetic interference; ensure accessibility for maintenance; and if mounting in an enclosure, verify that the enclosure's thermal design is compatible with the board's cooling requirements.

When handling 1.8-inch SBCs: always use proper ESD protection (wrist strap, ESD mat); hold the board by its edges to avoid touching components or contacts; avoid flexing the PCB during installation; ensure power is off when connecting/disconnecting any components; use appropriate torque when securing mounting screws (typically 0.4-0.6 Nm); apply thermal compounds correctly if required; connect cables with proper orientation and avoid forcing connectors; ensure all expansion cards are properly seated; avoid exposing the board to moisture or contaminants; and follow proper packaging procedures for transportation to prevent physical damage or ESD events.

When connecting peripherals to 1.8-inch SBCs: use high-quality, properly shielded cables to minimize interference; implement strain relief to prevent connector damage; follow the recommended connection/disconnection sequence; use locking connectors where available; avoid exceeding the maximum cable lengths specified for each interface; balance loads across multiple USB ports rather than concentrating on one port; verify peripheral power requirements against available supply; properly terminate unused differential pairs in high-speed interfaces; label all connections for easier maintenance; and test peripherals individually before connecting multiple devices to isolate potential issues.

For OS setup on 1.8-inch SBCs: obtain the manufacturer-recommended OS image or build configured for your specific model; prepare bootable media (typically USB or direct eMMC flashing); configure BIOS/UEFI settings appropriately before installation; during installation, optimize partition layouts considering the limited storage space; after installation, install essential drivers provided by the manufacturer; disable unnecessary services to reduce resource usage; configure appropriate power management settings; implement a backup strategy for the system image; establish a procedure for OS updates that includes proper testing; and document the entire configuration process for future reference or recovery purposes.

If a 1.8-inch SBC fails to power on: verify power supply voltage (should be 12V DC) and current capability (typically 2-3A minimum); check for reverse polarity connection; examine power cables for damage; inspect board for physical damage or burnt components; test with a known-good power supply; verify that the board is configured for the correct power mode (AT or ATX); check any power switches or jumpers; measure voltage at test points if available; inspect for short circuits or improperly seated components; and if available, check status LEDs for error codes. Document all troubleshooting steps for manufacturer support if needed.

For display output issues: check cable connections and integrity; verify monitor power and input selection; confirm support for the resolution being used; try alternative display interfaces if available (e.g., switch from DisplayPort to eDP); update display drivers; reset BIOS/UEFI display settings to defaults; test with a known-working display; check BIOS settings for primary display selection; verify if multi-display configuration is properly set up; inspect logs for graphics initialization errors; and try booting in safe mode or low-resolution mode. For persistent issues, try reinstalling graphics drivers or resetting the BIOS to factory defaults.

Common causes of instability include: inadequate cooling (improve airflow or heat dissipation); power supply issues (use a higher-quality PSU with stable output); memory errors (run memory diagnostics); storage problems (check disk integrity, replace failing media); incorrect BIOS settings (update BIOS, load optimized defaults); driver conflicts (update or rollback problematic drivers); electromagnetic interference (improve shielding, relocate board); excessive CPU/GPU load (optimize software, reduce workload); operating system corruption (repair or reinstall OS); and component overheating (monitor temperatures, improve thermal management). Systematic isolation of variables is key to identifying the specific cause of instability.

To troubleshoot network issues: check physical connection and link status LEDs; verify IP configuration (static/DHCP settings); test basic connectivity with ping to loopback, gateway, and external addresses; examine network driver status and version; check for conflicting IP addresses; verify DNS configuration; inspect network logs for errors; try alternate network cables; test connectivity with a different switch port; check firewall or security software settings; verify correct network services are running; reset the network adapter through OS utilities; and if available, update network interface firmware or drivers from the manufacturer.

Najważniejsze informacje

Opis produktu

Dane techniczne

Informacje o systemie

Procesor

Pamięć systemowa

Platform Controller Hub

Chipset I/O

Watchdog

BIOS

Monitor stanu sprzętu

TPM

Pamięć masowa

Pamięć masowa

Wyświetlacz

Wiele wyświetlaczy

Chipset graficzny

Specyfikacja i rozdzielczość

Rozszerzenia

Rozszerzenia

Ethernet

Chipset LAN

Interfejs Ethernet

Port LAN

Wsparcie programowe

OS

Certyfikacja

Informacje o certyfikacji

I/O

USB

Port COM

DIO

Parametry mechaniczne i środowiskowe

Temperatura pracy

Temp. przechowywania

Wymiary (dł. x szer.)

Masa

Wilgotność pracy

Wymagania dotyczące zasilania

Tryb zasilania

Informacje o zamawianiu

Informacje o zamawianiu

Czym jest EZX-EHLP?

Najważniejsze cechy i korzyści

Zastosowania i przykłady użycia

Często zadawane pytania