Avalue · Przemysłowa i wbudowana płyta główna

EPX-EHLP

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Producent: Avalue

Najważniejsze informacje

Intel® Celeron® & Atom® x6000E series processors with CPU Bottom Mounted
1 x 260-pin DDR4 2666 MHz SO-DIMM Supports Up to 32GB (Only Atom® x6000 Series Processors,Support IBECC) *Note: Due to mainboard design limitation, the mainboard is not recommend to,use DDR4 3200MHz SO-DIMM.
1 x Dual Stack DP, Single Channel 18/24-bits LVDS
2 x Intel® i226LM/IT 2.5G Gigabit Ethernet
4 x USB 2.0 by Pin Header, 1 x Dual Stack USB 3.1 Gen2 at I/O
1 x M.2 (2242/2260) B-Key, 1 x M.2 (2230) E-Key Support Wifi Module
1 x RS232, 1 x RS232/422/485, 4-bit GPIO
DC in +12V

Opis produktu

The Avalue EPX-EHLP is a 2.5-inch Pico-ITX Single Board Computer designed for industrial and embedded applications. It integrates Intel® Atom® x6000E and Celeron® processors, supporting up to 32GB DDR4 2666MHz SO-DIMM memory.

Key features include dual DisplayPort and LVDS display outputs, dual Intel® 2.5GbE LAN ports, multiple USB ports, serial interfaces, GPIOs, and expansion options through M.2 Key-B and Key-E slots.

With a compact form factor of 100mm x 72mm and support for Windows and Linux operating systems, the EPX-EHLP offers a robust solution for space-constrained environments.

Dane techniczne

Procesor

Intel® Celeron® and Atom® x6000E series processors

Pamięć systemowa

1 x 260-pin DDR4 2666MHz SO-DIMM socket, supports up to 32GB Max.

*Note: Due to mainboard design limitation, the mainboard is not recommend to use DDR4 3200MHz SO-DIMM.

Płyta

PICO ITX

Chipset I/O

EC iTE IT5571 or Equivalent

Watchdog

H/W Reset: 1Sec. ~ 65535Sec./Min. and1 Sec. or 1Min./Step

BIOS

AMI BIOS, 256Mbit SPI Flash ROM

Monitor stanu sprzętu

CPU temperature monitoring

Voltages monitoring

CPU fan speed control

Pamięć masowa

1 x M.2 (Type B)

Wiele wyświetlaczy

Triple Display

Chipset graficzny

Intel® UHD Graphics

Specyfikacja i rozdzielczość

2 x DP (Upper DP, Lower DP++): 4096 x 2160@60 Hz

LVDS: 1366x768 Single Channel 18/24-bits LVDS (Chrontel CH7511B-BF (CH7511B-BFI for Wide Temp Version) eDP to LVDS)

LVDS

1CH 18/24bits LVDS 1366x768

Chrontel. CH7511B eDP to LVDS Converter

Rozszerzenia

1 x M.2 Type B 2242/2260 support SSD. (Default: PCIe) With (1 x PCIe x1 / SATA III + USB3.1 GEN 1 + USB 2.0) as Default or (1 x PCIe x2 + USB 2.0, via OEM BIOS request)

Chipset LAN

2 x Intel® i226V (i226IT for wide temp version) 2.5 Gigabit Ethernet

Interfejs Ethernet

2.5 Gigabit Ethernet

Port LAN

2 x RJ45

OS

Windows 10, Linux

Informacje o certyfikacji

CE, FCC, RoHS Compliant

USB

2 x USB 3.1 Gen2 at IO

4 x USB 2.0 by pin header

Port COM

1 x RS-232

1 x RS-232/422/485

DIO

1 x 4-bit GPIO

SATA

1 x SATA III

Temperatura pracy

Standard Temperature: 0°C ~ 60°C (-4°F ~ 140°F) with 0.5m/s Air Flow

Extend Temperature: -20°C ~ 60°C (-40°F ~ 140°F) with 0.5m/s Air Flow for Wide Temp CPU SKU

Temp. przechowywania

-40°C ~ 75°C (-40°F ~ 167°F)

Wymiary (dł. x szer.)

3.94" x 2.83" (100mm x 72mm)

Masa

0.66lbs (0.3Kgs)

Wilgotność pracy

40°C @ 95% Relative Humidity, Non-condensing

Wymagania dotyczące zasilania

DC in +12V

Tryb zasilania

AT/ATX (Default Setting: ATX)

Informacje o zamawianiu

Intel® Celeron®/Atom™ SoC BGA Processor 2.5 Pico ITX SBC Motherboard

EPX-EHLP-J6412-A1R

EPX-EHLP/J6412/2COM/6USB/2LAN/A1

EPX-EHLP-J6413-A1R

EPX-EHLP/J6413/2COM/6USB/2LAN/A1

EPX-EHLP-X13E-A1R

EPX-EHLP/x6413E/2COM/6USB/2LAN/A1

Czym jest EPX-EHLP?

The EPX-EHLP is a przemysłowa i wbudowana płyta główna manufactured by Avalue, designed specifically for 2.5inch-sbc-pico-itx applications. It features sieć of 2 x Intel® i226V (i226IT for wide temp version) 2.5 Gigabit Ethernet and system operacyjny of AMI BIOS, 256Mbit SPI Flash ROM. The Avalue EPX-EHLP is a 2.5-inch Pico-ITX Single Board Computer designed for industrial and embedded applications. It integrates Intel® Atom® x6000E and Celeron® processors, supporting up to 32GB DDR4 2666MHz SO-DIMM memory. Key features include dual DisplayPort and LVDS display outputs, dual Intel® 2.5GbE LAN ports, multiple USB ports, serial interfaces, GPIOs, and expansion options through M.2 Key-B and Key-E slots. With a compact form factor of 100mm x 72mm and support for Windows and Linux operating systems, the EPX-EHLP offers a robust solution for space-constrained environments.

Najważniejsze cechy i korzyści

Intel® Celeron® & Atom® x6000E series processors with CPU Bottom Mounted
1 x 260-pin DDR4 2666 MHz SO-DIMM Supports Up to 32GB (Only Atom® x6000 Series Processors,Support IBECC) *Note: Due to mainboard design limitation, the mainboard is not recommend to,use DDR4 3200MHz SO-DIMM.
1 x Dual Stack DP, Single Channel 18/24-bits LVDS
2 x Intel® i226LM/IT 2.5G Gigabit Ethernet
4 x USB 2.0 by Pin Header, 1 x Dual Stack USB 3.1 Gen2 at I/O
1 x M.2 (2242/2260) B-Key, 1 x M.2 (2230) E-Key Support Wifi Module
1 x RS232, 1 x RS232/422/485, 4-bit GPIO
DC in +12V

Zastosowania i przykłady użycia

Model EPX-EHLP doskonale sprawdza się w różnych zastosowaniach automatyki przemysłowej:

DC-powered industrial installations and mobile applications
Wireless connectivity and remote monitoring applications
High-performance computing and data processing tasks
Networked industrial systems and data communication
Peripheral device connectivity and data transfer
Memory-intensive applications and multitasking
Custom industrial computing solutions
Industrial and embedded applications

Często zadawane pytania

The Avalue EPX-EHLP features Intel® Celeron® and Atom® x6000E series processors (bottom layer soldered), supports up to 32GB DDR4 2666MHz SO-DIMM memory, provides triple display capabilities (dual DisplayPort with one DP++ port, and LVDS), dual Intel® 2.5GbE LAN ports, expansion via M.2 Key-B and Key-E slots, multiple USB interfaces (2 x USB 3.1 Gen2, 4 x USB 2.0), dual COM ports, and operates with a +12V DC input in a compact 100mm x 72mm form factor.

The EPX-EHLP supports triple display through 2 x DisplayPort connections (one upper DP and one lower DP++ port) with resolutions up to 4096 x 2160@60Hz, plus a single-channel 18/24-bit LVDS interface supporting 1366x768 resolution. The LVDS interface uses a Chrontel CH7511B eDP to LVDS converter (CH7511B-BFI for the wide temperature version). These display options make it suitable for industrial HMI applications, digital signage, and other multi-display use cases.

The EPX-EHLP offers two temperature operation ranges: Standard Temperature (0°C to 60°C/-4°F to 140°F with 0.5m/s airflow) and Extended Temperature (-20°C to 60°C/-40°F to 140°F with 0.5m/s airflow) for the Wide Temp CPU SKU. Storage temperature rating is -40°C to 75°C (-40°F to 167°F), and it can operate in up to 95% relative humidity (non-condensing) at 40°C, making it suitable for deployment in various industrial environments.

The EPX-EHLP offers expansion through a M.2 Type B 2242/2260 slot that supports PCIe x1 + SATA III + USB3.1 GEN 1 + USB 2.0 by default, or can be configured for PCIe x2 + USB 2.0 via OEM BIOS request. It also includes a M.2 Type E 2230 slot supporting WiFi modules. This versatile expansion capability allows for adding storage, wireless connectivity, or other I/O functionality based on application requirements.

2.5-inch Pico-ITX SBCs (Single Board Computers) are compact embedded computers measuring 100mm x 72mm (3.94" x 2.83"), adhering to the Pico-ITX form factor standard. Their small size makes them ideal for space-constrained applications including industrial automation, IoT gateways, edge computing, digital signage, kiosks, medical devices, transportation systems, robotics, and portable instrumentation. Despite their compact dimensions, they offer comprehensive I/O, significant processing capabilities, and industrial-grade reliability for demanding environments.

2.5-inch Pico-ITX SBCs offer several advantages: significantly reduced footprint for space-constrained installations compared to larger form factors like Mini-ITX; lower power consumption (typically 10-20W); reduced heat generation enabling fanless designs; simplified integration into existing systems with standardized mounting options; lighter weight for mobile applications; and comparable performance to larger boards for many tasks. These benefits make them ideal for applications where size, weight, and power constraints are critical considerations while requiring x86 architecture compatibility.

Common connectivity options on 2.5-inch Pico-ITX SBCs include: dual Gigabit or 2.5GbE Ethernet ports; multiple USB interfaces (typically USB 3.x and USB 2.0); serial ports (RS-232/422/485); display outputs (DisplayPort, HDMI, LVDS); SATA interfaces for storage; M.2 expansion slots for storage, wireless, or I/O expansion; GPIO interfaces; and audio I/O. These interfaces provide extensive connectivity options for various sensors, networks, displays, and other peripherals required in industrial and embedded applications.

When selecting a 2.5-inch Pico-ITX SBC, consider: processing requirements for your workload (CPU performance, cores, and integrated graphics capabilities); memory and storage requirements; specific I/O interface needs (type and number of ports); operating temperature requirements for the deployment environment; power constraints and thermal design; expansion capabilities through M.2 or other expansion slots; long-term availability guarantees for industrial deployments; operating system support; and total cost of ownership. For critical applications, prioritize industrial-grade components and extended temperature range support to ensure reliability.

For effective cooling of 2.5-inch Pico-ITX SBCs in enclosed systems: ensure at least 0.5 m/s airflow as typically specified in thermal requirements; implement conduction cooling with thermal pads connecting processors and chipsets to the enclosure as a heat sink; use aluminum enclosures with external fins to increase surface area for passive cooling; maintain adequate clearance around heat-generating components; position the board away from other heat sources; implement temperature monitoring to prevent thermal throttling; and for extreme environments, consider specialized cooling techniques like heat pipes or thermally conductive encapsulation materials. Always verify that your cooling solution meets the specific thermal requirements of your chosen board.

For 2.5-inch Pico-ITX SBCs, power considerations include: providing stable 12V DC input with proper regulation (typically requiring 2-5A capacity depending on processor and peripherals); implementing proper power sequencing during boot and shutdown; adding surge protection for industrial environments; implementing power filtering to eliminate electrical noise; calculating total power budget including all connected peripherals; planning for power management features if battery operation is required; using high-quality power connectors rated for industrial vibration; and potentially implementing backup power solutions for critical applications requiring high availability. Always refer to the specific board's power requirements documentation.

To expand 2.5-inch Pico-ITX SBC capabilities: utilize M.2 slots for adding WiFi/Bluetooth, cellular connectivity, or NVMe storage; connect USB expansion hubs for additional peripherals; implement I2C or SPI-based sensor networks through GPIO headers; leverage industrial Ethernet protocols over the existing LAN ports; integrate specialized I/O modules through available serial interfaces; develop custom carrier boards for application-specific needs; implement DisplayPort Multi-Stream Transport (MST) for daisy-chaining displays if supported; use USB-C alternate modes for expanded connectivity if available; and leverage network-based resources for functions that cannot be implemented locally.

Common performance bottlenecks in 2.5-inch Pico-ITX SBCs include: thermal limitations (address through improved cooling solutions); memory constraints (mitigate by selecting models with maximum supported RAM and optimizing memory usage); storage I/O (improve by using NVMe SSDs over SATA); network limitations (overcome by utilizing higher-speed 2.5GbE interfaces or adding network adapters); USB bus saturation (distribute devices across multiple controllers); CPU restrictions in multithreaded applications (optimize code for available cores or select a higher-performance processor variant); and graphics processing limits (offload to dedicated hardware or optimize visual elements). Monitoring system metrics helps identify specific bottlenecks in your application.

For mounting 2.5-inch Pico-ITX SBCs: use the standardized mounting holes with appropriate standoffs (typically M3); maintain minimum clearances specified in the manual for proper airflow and component clearance; ensure proper thermal contact if using conduction cooling; consider orientation effects on natural convection cooling; use vibration-resistant fasteners with thread-locking compound for mobile applications; implement strain relief for all cables; avoid mounting near sources of electromagnetic interference; ensure accessibility for maintenance; and if mounting in an enclosure, verify that the enclosure's thermal design is compatible with the board's cooling requirements and that all I/O ports are properly aligned with case openings.

When handling 2.5-inch Pico-ITX SBCs: always use proper ESD protection (wrist strap, ESD mat, ionizer); hold the board by its edges to avoid touching components or contacts; avoid flexing the PCB during installation; ensure power is off when connecting/disconnecting any peripherals; use appropriate torque when securing mounting screws (typically 0.4-0.6 Nm); apply thermal compounds or pads correctly if required; connect cables with proper orientation and avoid forcing connectors; ensure all expansion cards are properly seated; avoid exposing the board to moisture or contaminants; and follow proper packaging procedures for transportation to prevent physical damage or ESD events.

When connecting peripherals to 2.5-inch Pico-ITX SBCs: use high-quality, properly shielded cables to minimize interference; implement strain relief to prevent connector damage from vibration; follow the recommended connection/disconnection sequence in the manual; use locking connectors where available for industrial environments; avoid exceeding the maximum cable lengths specified for each interface; balance loads across multiple USB ports rather than concentrating devices on one port; verify peripheral power requirements against available supply; properly terminate unused differential pairs in high-speed interfaces; label all connections for easier maintenance; and test peripherals individually before connecting multiple devices to isolate potential issues.

For OS setup on 2.5-inch Pico-ITX SBCs: obtain the manufacturer-recommended OS image or build configured for your specific model; prepare bootable media (typically USB flash drive, M.2 SSD, or SATA drive); configure BIOS/UEFI settings appropriately before installation; during installation, optimize partition layouts considering storage space limitations; after installation, install all necessary hardware drivers from the manufacturer; disable unnecessary services to reduce resource usage; configure appropriate power management settings; implement a backup strategy for the system image; establish a procedure for OS updates that includes proper testing; and document the entire configuration process for future reference or recovery purposes.

If a 2.5-inch Pico-ITX SBC fails to power on: verify power supply voltage (should be 12V DC) and current capability (typically 2-5A minimum); check for reverse polarity connection; examine power cables for damage or loose connections; inspect the board for physical damage or burnt components; test with a known-good power supply; verify that the board is configured for the correct power mode (AT or ATX); check any power switches or jumpers; measure voltage at test points if available; inspect for short circuits or improperly seated components; and if available, check status LEDs for error codes. Document all troubleshooting steps for manufacturer support if needed.

For display output issues: check cable connections and integrity; verify monitor power and input selection; confirm support for the resolution being used; try alternative display interfaces if available (e.g., switch from DisplayPort to HDMI); update display drivers; reset BIOS/UEFI display settings to defaults; test with a known-working display; check BIOS settings for primary display selection; verify if multi-display configuration is properly set up; ensure display cables meet interface standards (especially for high resolutions); inspect logs for graphics initialization errors; and try booting in safe mode or low-resolution mode. For persistent issues, reinstall graphics drivers or reset the BIOS to factory defaults.

Common causes of instability include: inadequate cooling causing thermal throttling (improve airflow or heat dissipation); power supply issues (use a higher-quality PSU with stable output); memory errors (run memory diagnostics, try reseating memory); storage problems (check disk integrity, replace failing media); incorrect BIOS settings (update BIOS, load optimized defaults); driver conflicts (update or rollback problematic drivers); electromagnetic interference (improve shielding, relocate board); excessive CPU/GPU load (optimize software, reduce workload); operating system corruption (repair or reinstall OS); and component overheating (monitor temperatures, improve thermal management). Systematic isolation of variables is key to identifying the specific cause of instability.

To troubleshoot network issues: check physical connection and link status LEDs; verify IP configuration (static/DHCP settings); test basic connectivity with ping to loopback, gateway, and external addresses; examine network driver status and version; check for conflicting IP addresses; verify DNS configuration; inspect network logs for errors; try alternate network cables; test connectivity with a different switch port; check firewall or security software settings; verify correct network services are running; reset the network adapter through OS utilities; and if available, update network interface firmware or drivers from the manufacturer. For dual-LAN configurations, ensure the correct interface is being used for the intended network connection.

Najważniejsze informacje

Opis produktu

Dane techniczne

Informacje o systemie

Procesor

Pamięć systemowa

Płyta

Chipset I/O

Watchdog

BIOS

Monitor stanu sprzętu

Pamięć masowa

Pamięć masowa

Wyświetlacz

Wiele wyświetlaczy

Chipset graficzny

Specyfikacja i rozdzielczość

LVDS

Rozszerzenia

Rozszerzenia

Ethernet

Chipset LAN

Interfejs Ethernet

Port LAN

Wsparcie programowe

OS

Certyfikacja

Informacje o certyfikacji

I/O

USB

Port COM

DIO

SATA

Parametry mechaniczne i środowiskowe

Temperatura pracy

Temp. przechowywania

Wymiary (dł. x szer.)

Masa

Wilgotność pracy

Wymagania dotyczące zasilania

Tryb zasilania

Informacje o zamawianiu

Informacje o zamawianiu

Czym jest EPX-EHLP?

Najważniejsze cechy i korzyści

Zastosowania i przykłady użycia

Często zadawane pytania