Avalue · Przemysłowa i wbudowana płyta główna

ECM-TGUC

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Producent: Avalue

Najważniejsze informacje

Bottom Layer Soldered Processor
Single 260-pin SO-DIMM DRAM Socket, Max, Up to 32GB DDR4 3200MTs (Non-ECC Supported)
Triple display, 2 x DP++, 1 x 2CH LVDS/1x eDP (Default LVDS)
Expansion Slot, M.2 Key-B, M.2 Key-E, M.2 Key-M
Dual Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
DC in +12V ~ +24V

Opis produktu

The Avalue ECM-TGUC is a 3.5-inch Single Board Computer designed for industrial and embedded applications. It integrates 11th Gen Intel® Core™ i5/i3 SoC processors, supporting up to 32GB DDR4 3200MHz SO-DIMM memory.

Key features include triple display outputs (2 x DP++, 1 x LVDS/eDP), dual Ethernet ports (1 x 2.5GbE, 1 x 1GbE), multiple USB ports, serial interfaces, GPIOs, and expansion options through M.2 Key-B, Key-E, and Key-M slots.

With a compact form factor of 146mm x 101mm and support for Windows and Linux operating systems, the ECM-TGUC offers a robust solution for space-constrained environments.

Dane techniczne

Procesor

11th Gen. Intel® Core™ SoC i5/i3 BGA Processor

Intel® Core™ i3-1115G4 (up to 4.1GHz, dual-core, 6M Cache, TDP: 28/15W)

Intel® Core™ i5-1135G7 (up to 4.2GHz, quad-core, 8M Cache, TDP: 28/15W)

Pamięć systemowa

1 x 260-pin DDR4 3200MHz SO-DIMM Socket, Supports Up to 32GB Max. (non ECC only)

Chipset I/O

nuvoTon NCT6126D

Watchdog

H/W Reset, 1sec., 65535sec./min.1sec. or 1min. step

BIOS

AMI BIOS, 256Mbit SPI Flash ROM

Monitor stanu sprzętu

CPU & System Temperature Monitoring Voltages Monitoring

TPM

Onboard nuvoTon NPCT750AADYX Support TPM 2.0, Co-lay infineon SLB9670VQ2.0 & 國民技術 Z32H330TC-SQN-755

Płyta

3.5"

Pamięć masowa

1 x M.2 (Key B, 3052)

1 x SATA III

1 x M.2 (Key M, 2280)

Wiele wyświetlaczy

Triple Display

Chipset graficzny

Intel® 12th Generation CPU Integrated

Specyfikacja i rozdzielczość

DP++ Max resolution 4096x2160@60Hz

LVDS Max resolution 1920 x 1080 Dual channel 18/24-bits or 1x eDP 1920 x 1080@60Hz (2 Lanes), default LVDS

LVDS

1 x LVDS: 1920 x 1080 Dual Channel 18/24-bits LVDS (Chrontel CH7513A-BF eDP to LVDS)

Rozszerzenia

1 x M.2 Key M 2280 (with 1 x PCI-e Gen4 x4) for NVMe SSD

1 x M.2 Key B 3042/3052/2242 (with SATA and USB 2.0, USB 3.0, with 1 x SIM card slot, supports WWAN+GNSS or SSD)

* Only supports one SIM card (co-lay 1 x 10pin FPC connector for uSIM card adapter) 3.8V for 5G

1 x M.2 Key E 2230 supports WiFi module (1 x PCI-e x1 & USB 2.0 Signal))

Kodek audio

Realtek ALC888S HD Audio Decoding Controller

Interfejs audio

Line-in, Mic-in, Line-out

Chipset LAN

1 x Intel® I219LM Gigabit Ethernet

1 x Intel® I225V Gigabit Ethernet

Interfejs Ethernet

1 x 10/100/1000 Base-Tx GbE compatible

1 x 10/100/1000/2.5G Base-Tx GbE compatible

Port LAN

2 x RJ-45

Tryb zasilania

AT/ATX (Default Setting: AT)

OS

Windows 10, Linux

Informacje o certyfikacji

CE, FCC, RoHS Compliant

USB

3 x USB 3.2 Gen2x1

5 x USB 2.0

Port COM

5 x RS-232

1 x RS-232/422/485

SATA

1 x SATA III

DIO

1 x 8-bit GPIO

MIO

1 x SPI

1 x SIM Card Slot

Temperatura pracy

Standard Temperature: 0°C ~ 60°C (-4~140°F) with 0.5m/s Air Flow

Temp. przechowywania

-40°C ~ 75°C (-40°F ~ 167°F)

Wymiary (dł. x szer.)

5.75" x 4.13" (146mm x 101mm)

Masa

0.44lbs (0.2kg)

Wilgotność pracy

40°C @ 95% Relative Humidity, Non-condensing

Wymagania dotyczące zasilania

DC in +12V ~ +24V

Informacje o zamawianiu

ECM-TGUC-15-A1R, ECM-TGUC/i31115G4/1SATA/6COM/8USB/15W/A1

ECM-TGUC-35-A1R, ECM-TGUC/i51135G7/1SATA/6COM/8USB/15W/A1

Czym jest ECM-TGUC?

The ECM-TGUC is a przemysłowa i wbudowana płyta główna manufactured by Avalue, designed specifically for 3.5inch-sbc applications. It features sieć of 1 x Intel® I219LM Gigabit Ethernet, 1 x Intel® I225V Gigabit Ethernet and system operacyjny of AMI BIOS, 256Mbit SPI Flash ROM. The Avalue ECM-TGUC is a 3.5-inch Single Board Computer designed for industrial and embedded applications. It integrates 11th Gen Intel® Core™ i5/i3 SoC processors, supporting up to 32GB DDR4 3200MHz SO-DIMM memory. Key features include triple display outputs (2 x DP++, 1 x LVDS/eDP), dual Ethernet ports (1 x 2.5GbE, 1 x 1GbE), multiple USB ports, serial interfaces, GPIOs, and expansion options through M.2 Key-B, Key-E, and Key-M slots. With a compact form factor of 146mm x 101mm and support for Windows and Linux operating systems, the ECM-TGUC offers a robust solution for space-constrained environments.

Najważniejsze cechy i korzyści

Bottom Layer Soldered Processor
Single 260-pin SO-DIMM DRAM Socket, Max, Up to 32GB DDR4 3200MTs (Non-ECC Supported)
Triple display, 2 x DP++, 1 x 2CH LVDS/1x eDP (Default LVDS)
Expansion Slot, M.2 Key-B, M.2 Key-E, M.2 Key-M
Dual Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
DC in +12V ~ +24V

Zastosowania i przykłady użycia

Model ECM-TGUC doskonale sprawdza się w różnych zastosowaniach automatyki przemysłowej:

DC-powered industrial installations and mobile applications
High-performance computing and data processing tasks
Networked industrial systems and data communication
Memory-intensive applications and multitasking
Visual monitoring and data display systems
Custom industrial computing solutions
Industrial and embedded applications
Industrial automation platforms

Często zadawane pytania

The Avalue ECM-TGUC features 11th Gen Intel® Core™ i5/i3 SoC processors, 1x DDR4 3200MHz SO-DIMM socket supporting up to 32GB, triple display support (2x DP++, 1x LVDS/eDP), dual Ethernet ports (1x Intel® I225V 2.5GbE, 1x Intel® I219LM 1GbE), expansion options via M.2 Key-B, Key-E, and Key-M slots, multiple USB ports (3x USB 3.2 Gen2x1, 5x USB 2.0), 6 COM ports (5x RS-232, 1x RS-232/422/485), and operates with +12V to +24V DC input in a compact 146mm x 101mm form factor.

The ECM-TGUC supports triple display outputs through two DP++ ports (up to 4096x2160@60Hz each) and either one LVDS interface (1920x1080 dual channel 18/24-bits) or one eDP interface (1920x1080@60Hz with 2 lanes), with LVDS being the default configuration. It features Intel® 12th Generation integrated graphics, providing excellent visual performance for industrial applications requiring reliable display capabilities.

The ECM-TGUC features dual Ethernet connectivity with one Intel® I225V 2.5 Gigabit Ethernet controller and one Intel® I219LM Gigabit Ethernet controller. This configuration provides both standard Gigabit (10/100/1000 Base-Tx) and high-speed 2.5 Gigabit (10/100/1000/2.5G Base-Tx) network connections through two RJ-45 ports, offering flexible networking options for industrial applications with varying bandwidth requirements.

The ECM-TGUC offers comprehensive expansion through three M.2 slots: one M.2 Key-M 2280 slot (PCIe Gen4 x4) for NVMe SSD storage; one M.2 Key-B 3042/3052/2242 slot (with SATA, USB 2.0, USB 3.0) with SIM card support for WWAN+GNSS or SSD; and one M.2 Key-E 2230 slot supporting WiFi modules (PCIe x1 & USB 2.0 signal). It also includes a SATA III interface, providing versatile expansion options for various industrial applications.

While both models use 11th Gen Intel processors in a similar form factor, the ECM-TGUC differs from the ECM-TGU in several aspects: the TGUC has dual Ethernet (1x 2.5GbE, 1x 1GbE) compared to TGU's triple Ethernet; TGUC offers USB 3.2 Gen2x1 ports while TGU has USB 3.2 Gen1; TGUC has different processor options focusing on i5/i3 variants; TGUC has a different COM port configuration; and there are differences in the specific implementation of the M.2 slots. The TGUC is generally positioned as a more cost-effective alternative while maintaining essential features for industrial applications.

3.5-inch SBCs (Single Board Computers) are compact embedded computers measuring approximately 146mm x 101mm (5.75" x 4"). Their versatile form factor makes them ideal for applications requiring a balance of performance, I/O options, and size constraints, including industrial automation, IoT gateways, edge computing, digital signage, medical devices, transportation systems, robotics, and industrial control systems. These boards offer significant processing capabilities, multiple I/O options, and industrial-grade reliability for demanding environments.

3.5-inch SBCs offer several advantages including: a balanced form factor between size and functionality (smaller than Mini-ITX but with more features than smaller form factors); rich I/O options without requiring expansion cards; better thermal management than smaller boards due to larger surface area; good performance-to-size ratio; flexibility with both soldered and socketed CPU options depending on model; simplified integration into mid-sized enclosures; good scalability for industrial applications; and long lifecycle support typical of industrial-grade components.

Different Intel processor generations provide varied capabilities to 3.5-inch SBCs: newer generations (Meteor Lake, Raptor Lake, Alder Lake) offer hybrid architecture with enhanced multi-core performance, AI acceleration, and support for DDR5 memory; mid-range options (Elkhart Lake) balance performance and power efficiency for IoT and edge applications; while entry-level processors (Atom series) optimize for low power consumption and extended temperature ranges. The choice between processor generations involves balancing processing requirements, power constraints, thermal considerations, and specific features needed (like AI acceleration, TSN support, or extended lifecycle) for the target application.

When selecting a 3.5-inch SBC for industrial applications, consider: processing requirements for your workload; memory and storage configurations; specific I/O interface requirements (COM ports, USB, display outputs); networking needs (number of ports, speed, reliability); temperature operating range for the deployment environment; power constraints; expansion capabilities through M.2 or other slots; long-term availability guarantees; operating system support and driver availability; ruggedness including shock and vibration resistance; certifications required for your industry; and total cost of ownership including maintenance and support.

For cooling 3.5-inch SBCs in enclosed systems: ensure at least 0.5 m/s airflow as specified in thermal requirements; use conduction cooling with thermal pads connecting the processor to the enclosure acting as a heat sink; implement passive cooling solutions like aluminum enclosures with external fins to increase surface area; maintain adequate clearance around heat-generating components; arrange components to create a natural convection path; position the board away from other heat sources; implement thermal monitoring through the hardware monitoring features; and for extreme environments, use specialized cooling techniques like heat pipes or forced air cooling while maintaining the board's environmental ratings.

For 3.5-inch SBCs, power considerations include: providing stable DC input within the specified voltage range (typically 9-36V) with proper regulation and adequate current capacity; understanding the difference between AT and ATX power modes (with AT being the default for most industrial applications); implementing proper power sequencing during boot and shutdown; adding surge protection for industrial environments; considering power filtering to eliminate electrical noise; implementing brownout protection; calculating total power budget including peripherals; planning for power management; using high-quality power connectors; and potentially implementing backup power solutions for critical applications requiring high availability.

To expand 3.5-inch SBC functionality: utilize M.2 slots for adding WiFi/Bluetooth, cellular connectivity, or high-speed storage; leverage multiple display outputs for multi-screen applications; use USB expansion for additional peripherals; implement I2C, SPI, or GPIO-based sensor networks; utilize the multiple Ethernet ports for network segregation or redundancy; develop custom carrier boards for application-specific needs; implement software-based capabilities through virtualization if supported by the processor; utilize COM port expansion if more serial interfaces are needed; and consider network-based resources for functions that cannot be implemented locally.

Common 3.5-inch SBC performance bottlenecks include: thermal limitations (addressed through proper cooling solutions); memory bandwidth constraints (mitigated by utilizing the fastest supported memory, like DDR5); storage I/O (improved by using NVMe over PCIe rather than SATA); network congestion (overcome by using 2.5G interfaces and implementing proper network design); USB bus saturation (resolved by distributing devices across controllers and using USB 3.2 for high-bandwidth devices); processor limitations in multi-threaded workloads (addressed through workload optimization); and display performance with multiple screens (managed by understanding the display bandwidth limitations of each interface).

For mounting 3.5-inch SBCs: use the four corner mounting holes with appropriate standoffs (typically M3); maintain minimum clearances specified in the manual, especially above heat-generating components; ensure proper thermal contact if using conduction cooling; consider orientation effects on natural convection cooling; use vibration-resistant fasteners with thread-locking compound for applications with vibration; implement strain relief for all cables connected to the board; avoid mounting near sources of electro-magnetic interference; ensure accessibility for maintenance if needed; and verify that the enclosure's thermal design is compatible with the board's cooling requirements and airflow specifications.

When handling 3.5-inch SBCs: always use proper ESD protection including wrist straps and ESD mats; hold the board by its edges to avoid touching components or contacts; avoid flexing the PCB during installation; ensure power is off when connecting/disconnecting components; use appropriate torque when securing mounting screws (typically 0.5-0.7 Nm); apply thermal compounds correctly if required for thermal management; connect cables with proper orientation and avoid forcing connectors; ensure all expansion cards and memory modules are properly seated; avoid exposing the board to moisture or contaminants; and follow proper packaging procedures for transportation to prevent physical damage.

When connecting peripherals to 3.5-inch SBCs: use high-quality, properly shielded cables to minimize EMI/RFI; implement strain relief to prevent connector damage; connect power supplies before connecting signal cables; use locking connectors where available for industrial applications; avoid exceeding the maximum cable lengths specified for each interface; balance loads across multiple USB ports rather than concentrating on one port; verify peripheral power requirements against available supply; properly configure serial port parameters (baud rate, parity, etc.) before connecting serial devices; test peripherals individually before connecting multiple devices; and label all connections for easier maintenance.

For OS setup on 3.5-inch SBCs: obtain the manufacturer-recommended OS image or validated distribution for your specific model; configure BIOS/UEFI settings appropriately before installation, paying attention to boot order and storage controller modes; during installation, optimize partition layouts considering available storage; install essential drivers provided by the manufacturer, particularly chipset, network, and display drivers; disable unnecessary services to reduce resource usage; configure appropriate power management settings based on your application needs; implement a backup strategy for the system image; establish a procedure for OS updates that includes proper testing in a non-production environment first; and document the entire configuration process for future reference.

If a 3.5-inch SBC fails to power on: verify power supply voltage is within specified range (typically 9-36V DC) and current capability (typically 3-5A minimum); check for reverse polarity connection which can damage the board; examine power cables for damage or loose connections; inspect the board for physical damage or burnt components; test with a known-good power supply; verify that the board is configured for the correct power mode (AT or ATX as specified in the documentation); check any power switches or jumpers; measure voltage at test points if available; inspect for short circuits or improperly seated components; and check status LEDs for error codes if present.

For display output issues: check cable connections and integrity; verify monitor power and input selection; confirm the monitor supports the resolution being used; try alternative display interfaces if available (switch between DisplayPort, HDMI, or LVDS/eDP); update display drivers; reset BIOS/UEFI display settings to defaults; test with a known-working display; check BIOS settings for primary display selection; verify multi-display configuration is properly set up; inspect system logs for graphics initialization errors; ensure correct display output is enabled in BIOS if multiple are available; try booting in safe mode; and for persistent issues, try reinstalling graphics drivers or updating the BIOS.

Common network issues include: physical connection problems (check cables and connectors); driver-related issues (update or reinstall network drivers); incorrect IP configuration (verify static/DHCP settings); firewall or security software blocking communication; conflicting IP addresses on the network; switch or router configuration issues; network interface hardware failure; incorrect gateway or DNS settings; specific protocol not enabled or configured; packet filtering rules blocking traffic; VLAN configuration mismatches; and network congestion or bandwidth limitations. Systematic troubleshooting should include link status verification, ping tests to various targets, checking system logs, and testing with alternative cables and network equipment.

For M.2 device issues: verify the card is properly inserted and secured; check that the M.2 card type matches the slot (Key-B, Key-E, Key-M, etc.); confirm the BIOS recognizes the device during POST; verify BIOS storage controller settings (NVMe, SATA, or PCIe mode); update BIOS to the latest version that may include improved device compatibility; check for driver requirements for the specific device; test the M.2 device in another system if possible; verify power management settings aren't affecting device operation; check thermal conditions as M.2 devices can throttle or fail under excessive heat; and for storage devices, run diagnostic tools to verify device health.

Najważniejsze informacje

Opis produktu

Dane techniczne

Informacje o systemie

Procesor

Pamięć systemowa

Chipset I/O

Watchdog

BIOS

Monitor stanu sprzętu

TPM

Płyta

Pamięć masowa

Pamięć masowa

Wyświetlacz

Wiele wyświetlaczy

Chipset graficzny

Specyfikacja i rozdzielczość

LVDS

Rozszerzenia

Rozszerzenia

Audio

Kodek audio

Interfejs audio

Ethernet

Chipset LAN

Interfejs Ethernet

Port LAN

Wymagania dotyczące zasilania

Tryb zasilania

Wsparcie programowe

OS

Certyfikacja

Informacje o certyfikacji

I/O

USB

Port COM

SATA

DIO

MIO

Parametry mechaniczne i środowiskowe

Temperatura pracy

Temp. przechowywania

Wymiary (dł. x szer.)

Masa

Wilgotność pracy

Wymagania dotyczące zasilania

Informacje o zamawianiu

Informacje o zamawianiu

Czym jest ECM-TGUC?

Najważniejsze cechy i korzyści

Zastosowania i przykłady użycia

Często zadawane pytania