Avalue · Przemysłowa i wbudowana płyta główna
RSC-IMX61
*Cena na zapytanie. Prosimy o kontakt w sprawie wyceny.
Producent: Avalue
Najważniejsze informacje
- NXP i.MX6 Dual Lite/Quad Core 1GHz CPU
- 1GB/2GB DDR3 Memory
- 4GB eMMC Storage
- CE, FCC Class B Certification
Opis produktu
The Avalue RSC-IMX61 is an ARM-based SBC powered by the NXP i.MX6 Dual Lite or Quad Core CPU. It features 1GB/2GB DDR3 memory, 4GB eMMC storage, HDMI + LVDS multiple display outputs, LAN, extensive I/O support, and operates in wide temperature environments, ideal for industrial applications.
Dane techniczne
Procesor
NXP i.MX 6 Dual Lite
NXP i.MX 6 Quad Core
Pamięć systemowa
1GB / 2GB DDR3
Pamięć masowa
4GB eMMC
Wiele wyświetlaczy
HDMI + LVDS
Kodek audio
WM8962
Chipset LAN
KSZ9031RNX
Port LAN
1 x RJ45
Wejście DC
DC 12 ~ 26V
Tryb zasilania
AT
OS
Android 4.4.2 / 6.0
Yocto 2.1
Informacje o certyfikacji
CE
FCC Class B
Zewnętrzne złącze I/O
1 x 10/100/1000 RJ45 Powered LAN
1 x DC Jack
1 x HDMI 2.0 In
1 x Line-out
1 x Micro SD Slot
1 x Power LED
1 x Reset
2 x USB 2.0 Type A
1 x Jack for I/R extender cable (Optional)
Wewnętrzne złącze I/O
1 x Backlight
1 x CAN
1 x I2C
1 x Line-out
1 x LVDS
1 x Micro USB
1 x RS232
1 x RS232/422/485 Debug
1 x RTC battery
1 x SATA
1 x USB 2.0
1 x USB 2.0 Type B OTG
1 x USB
Temperatura pracy
-20°C ~ 85°C (-4°F ~ 185°F)
Temperatura przechowywania
-40°C ~ 85°C (-40°F ~ 185°F)
Wilgotność pracy
0% ~ 90% Relative Humidity, Non-condensing
Wymiary
146mm x 102mm
Masa
0.15 kg
Informacje o zamawianiu
RSC-IMX6L6D-A1R00 : RSC-IMX6L6D-A1R00
RSC-IMX6Q6D-A1R00 : RSC-IMX6Q6D-A1R00
Czym jest RSC-IMX61?
The RSC-IMX61 is a przemysłowa i wbudowana płyta główna manufactured by Avalue, designed specifically for arm-based-sbc applications. It features sieć of KSZ9031RNX and system operacyjny of Android 4.4.2 / 6.0, Yocto 2.1. The Avalue RSC-IMX61 is an ARM-based SBC powered by the NXP i.MX6 Dual Lite or Quad Core CPU. It features 1GB/2GB DDR3 memory, 4GB eMMC storage, HDMI + LVDS multiple display outputs, LAN, extensive I/O support, and operates in wide temperature environments, ideal for industrial applications.
Najważniejsze cechy i korzyści
- NXP i.MX6 Dual Lite/Quad Core 1GHz CPU
- 1GB/2GB DDR3 Memory
- 4GB eMMC Storage
- CE, FCC Class B Certification
Zastosowania i przykłady użycia
Model RSC-IMX61 doskonale sprawdza się w różnych zastosowaniach automatyki przemysłowej:
- High-performance computing and data processing tasks
- Memory-intensive applications and multitasking
- Data logging and storage-intensive operations
- Custom industrial computing solutions
- Industrial automation platforms
- Embedded system development
- Control system integration
- Industrial applications
Często zadawane pytania
The RSC-IMX61 features an NXP i.MX6 Dual Lite or Quad Core 1GHz CPU, 1GB/2GB DDR3 memory, 4GB eMMC storage, HDMI + LVDS display outputs, built-in audio via WM8962 codec, 10/100/1000 Ethernet, DC 12-26V input power, Android 4.4.2/6.0 or Yocto 2.1 OS support, CE and FCC Class B certification, and a wide operating temperature range from -20°C to 85°C.
The RSC-IMX61 offers extensive I/O with 1 x 10/100/1000 RJ45 LAN, 1 x DC jack, 1 x HDMI 2.0 input, 1 x line-out, 1 x microSD slot, power LED, reset button, 2 x USB 2.0 Type A ports, optional IR extender connection, and internal connections for backlight, CAN, I2C, line-out, LVDS, micro USB, RS232, RS232/422/485 debug, RTC battery, SATA, and multiple USB ports.
The RSC-IMX61 supports both Android (versions 4.4.2 and 6.0) and Yocto Linux (version 2.1), providing flexibility for different application requirements. Android is well-suited for touch-based interactive applications, while Yocto Linux offers a customizable embedded Linux platform for industrial control and automation tasks.
The RSC-IMX61 measures 146mm x 102mm and weighs 0.15kg. It features an impressive operating temperature range from -20°C to 85°C (-4°F to 185°F), storage temperature from -40°C to 85°C (-40°F to 185°F), and 0-90% relative humidity (non-condensing) operation, making it suitable for deployment in harsh industrial environments.
ARM-based Single Board Computers (SBCs) use processors based on ARM architecture, known for excellent power efficiency and performance-per-watt ratio compared to x86 SBCs. ARM SBCs typically consume less power, generate less heat (often enabling fanless designs), and are more cost-effective for many applications. While traditionally providing lower raw processing power than x86 counterparts, modern ARM SoCs (especially those with multi-core designs) now offer competitive performance for many industrial and embedded applications while maintaining their efficiency advantages.
ARM-based SBCs excel in industrial applications including HMI (Human-Machine Interface) systems, IoT gateways, edge computing devices, industrial control panels, digital signage, point-of-sale systems, industrial automation, machine vision systems, robotics, medical devices, and transportation systems. Their low power consumption, wide temperature operation, compact form factors, and long lifecycle support make them ideal for environments where reliability, efficiency, and space constraints are critical factors.
ARM-based SBCs typically support a variety of operating systems including various Linux distributions (Debian, Ubuntu, Yocto Project), Android, and some specialized real-time operating systems (RTOS). Windows 10 IoT Core or Windows 11 for ARM is available on select platforms. For industrial applications, Linux-based systems (particularly Yocto) are popular due to their customizability, stability, and long-term support options, while Android is common for touch-based interactive applications.
ARM-based SBCs offer several advantages for industrial applications including lower power consumption (reducing cooling requirements and operating costs), fanless operation (enhancing reliability in dusty environments), wide temperature operation ranges, compact form factors, extended lifecycle support, diverse I/O options optimized for industrial use (like CAN, RS-485, and industrial Ethernet), competitive pricing, and increasingly powerful processing capabilities for edge computing and AI workloads.
When selecting an ARM-based SBC, consider: processing requirements (CPU/GPU capabilities for your workload); memory and storage needs; I/O requirements (specific interfaces like CAN, RS-485, industrial Ethernet); display requirements (resolution, number of displays, interface types); environmental specifications (temperature range, humidity, vibration resistance); power constraints; form factor and mechanical integration; long-term availability and support; operating system compatibility; and total cost of ownership. Prioritize industrial-grade components and wide temperature operation for demanding environments.
ARM Cortex-A53 is an older 64-bit core offering good power efficiency and reliability for basic tasks. Cortex-A55 is its successor, providing approximately 18% better performance at the same power level, with improved memory system. Cortex-A76 is a high-performance core with significantly higher processing power (2-3x over A55) but at higher power consumption, often used in big.LITTLE configurations where A76 cores handle intensive tasks while A55 cores manage background processes to balance performance and power efficiency in modern SoCs.
Common display interfaces on ARM-based SBCs include: HDMI (digital interface supporting high resolutions and audio); LVDS (differential signaling interface common in industrial panels); MIPI DSI (low-power interface for mobile/embedded displays); eDP (DisplayPort variant for embedded applications); and legacy interfaces like VGA (analog) or DVI. They differ in resolution support, cable length limitations, EMI characteristics, power consumption, and compatibility with industrial displays. Modern SBCs often include multiple interfaces to accommodate various display options.
To ensure reliability in harsh environments: select boards with appropriate temperature ratings; implement proper thermal management (heat sinks, enclosures with thermal design); protect against dust and moisture using appropriate IP-rated enclosures; use industrial-grade components and conformal coating where available; implement surge protection and proper grounding; select boards with vibration/shock resistance certifications for mobile applications; use locking connectors to prevent disconnection; implement watchdog timers and reliable power supplies with appropriate filtering; perform thorough environmental testing; and establish monitoring systems for predictive maintenance.
When installing ARM-based SBCs, consider: proper voltage range (typically 9-36V DC for industrial boards); sufficient power supply rating with headroom above maximum consumption; power supply quality (filtering, stability); surge and brownout protection; proper grounding and isolation in electrically noisy environments; cable gauge selection for power delivery; backup power options (UPS or battery) for critical applications; power sequencing requirements for attached peripherals; thermal implications of power consumption; and power management settings in the operating system to optimize efficiency while meeting performance requirements.
For effective thermal management of ARM-based SBCs: ensure adequate airflow around the board; use appropriate heat sinks or thermal pads on processors and other heat-generating components; maintain recommended clearance from other heat sources; consider ambient temperature in the installation environment; for higher-temperature environments, select boards with wider temperature ratings; implement temperature monitoring; in sealed enclosures, use thermal transfer techniques to conduct heat to the enclosure walls; and for outdoor installations, consider solar loading effects and use reflective or insulated enclosures.
For optimal connectivity with ARM-based SBCs: use high-quality, shielded cables for signal integrity; implement proper strain relief to prevent connector damage; use locking connectors where possible; separate signal cables from power cables to minimize interference; follow proper grounding practices; add surge protection for external connections; implement network security measures for connected systems; maintain proper cable lengths within specifications; label all connections clearly; document the complete connectivity scheme; and test all connections thoroughly before final deployment.
For first-time boot and configuration: verify proper power supply and connectivity before powering on; prepare the bootable media (microSD/eMMC) with the appropriate operating system image; connect essential peripherals (display, keyboard); power on and observe boot indicators; follow specific first-boot procedures for your OS (setting root password, network configuration); update the system to latest patches; configure system services as needed; implement required security measures; set up remote access if needed; configure automatic startup applications; establish monitoring and logging; create system backups; and document the complete configuration for future reference.
If an ARM-based SBC fails to boot: verify power supply voltage and polarity; check for power indicators on the board; inspect for physical damage or loose connections; try an alternative power supply; verify boot media (microSD/eMMC) is properly inserted and functional; connect a display to check for boot messages; check boot mode jumpers/switches if present; try a known-good operating system image; look for error codes or LED blink patterns indicating specific issues; disconnect all peripherals except essential ones; and check manufacturer-specific recovery mechanisms or boot options. Document what you've tried for more effective technical support if needed.
To diagnose network issues: check physical connections and link indicators; verify IP configuration (static/DHCP settings); use diagnostic commands (ping, ifconfig/ip addr, traceroute, nslookup); examine network services status; check firewall settings; verify DNS configuration; examine logs for network errors; test alternative network cables; confirm network switch port functionality; verify MAC address conflicts; check for overheating causing intermittent connectivity; test multiple network applications to isolate the issue; and capture network traffic with tools like tcpdump or Wireshark for deeper analysis if necessary.
Common causes of instability include: inadequate power supply (voltage drops under load); thermal issues (overheating due to inadequate cooling or ambient conditions); memory leaks in applications; storage device failures; incompatible drivers or kernel modules; hardware clock issues; excessive I/O operations overwhelming the system; corrupted operating system files; electromagnetic interference in industrial environments; insufficient RAM for workload; improper shutdown causing filesystem corruption; incompatible peripherals; and outdated firmware or operating system. Systematic testing and log analysis can help identify the specific cause.
To resolve display issues: verify physical connections and cable integrity; confirm monitor power and input selection; check supported resolutions and refresh rates; verify display interface configuration in the operating system; examine logs for graphics driver errors; test alternative cables or adapters; try different resolution/refresh settings; update graphics drivers if available; check for conflicting display settings when using multiple outputs; verify sufficient power for the display subsystem; review boot logs for early graphics initialization errors; and try alternative display devices to isolate whether the issue is with the SBC or the display device.