Avalue · Placa base industrial y embebida

ECM-RPL

Ficha técnica

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Fabricante: Avalue

Aspectos destacados

Bottom Layer Soldered Processor
One 262-pin DDR5 4800MHz SO-DIMM socket, supports up to 32GB Max. (non ECC only)
Four Display, 1 x DP++, 1 x HDMI, 1 x 2CH LVDS or eDP, 1 x USB Type C support DP
Expansion Slot, M.2 Key-B, M.2 Key-E, M.2 Key-M
Two Gigabit Ethernet, 2 x 2.5GbE
DC in +9V ~ +36V or USB Type C Adapter (20V) Note: DCIN & USB Type C Adapter Can Only Use Either One

Descripción del producto

The Avalue ECM-RPL is a 3.5-inch Single Board Computer designed for industrial and embedded applications. It integrates 13th Gen Intel® Core™ processors, supporting up to 32GB DDR5 4800MHz SO-DIMM memory.

Key features include quad display outputs (DP, HDMI, LVDS/eDP), dual 2.5GbE LAN ports, and multiple expansion slots (M.2 Key-B, M.2 Key-E, M.2 Key-M, Mini PCIe).

With support for Windows 11 and Linux, and a compact form factor of 146mm x 101mm, the ECM-RPL offers a robust solution for space-constrained environments.

Especificaciones técnicas

Procesador

13th Gen. Intel® Core™ i7/i5/i3/Pentium® BGA Processor, support Up to 15/28W Max

Memoria del sistema

1 x 262-pin DDR5 4800MHz SO-DIMM socket, supports up to 32GB Max. (non ECC only)

Chipset de E/S

EC iTE IT5782VG

Temporizador watchdog

H/W Reset, 1sec. ~ 65535sec and 1sec. or 1min./step

BIOS

AMI BIOS, 256Mbit SPI Flash ROM

Monitor de estado del hardware

CPU & system temperature monitoring Voltages monitoring

TPM

Onboard NuvoTon NPCT760AABYX/NPCT754AADYX (for extend temperature) supports TPM 2.0

Placa

3.5"

Almacenamiento

1 x M.2 (Key M, 2280)

1 x M.2 (Key B, 3042/3052/2242)

1 x SATA III

Pantallas múltiples

Four Display

Chipset gráfico

Intel® UHD Graphics or Iris® Xe Graphics CPU integrated

Espec. y resolución

1 x DP 1.4: 7680 x 4320@60 Hz

1 x DP++: 1920 x 1080@60 Hz

1 x USB Type C support DP: 3840 x 2160@60Hz

1 x HDMI 2.0b: 3840 x 2160@60Hz

Note: This resolution is actual test result. Intel resolution as below:

1 x DP 1.4: Max 7680 x 4320@60 Hz

1 x USB Type C support DP: 4096 x 2304@60Hz

1 x HDMI 2.0b: 4096x2160@60Hz

1 x LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS (Chrontel CH7513A-BF eDP to LVDS) or 1 x eDP: 1920 x 1080@60Hz (2 Lanes), default LVDS

Note: JLVDS1 Support 1 x LVDS or 1 x eDP

LVDS

1 x LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS (Chrontel CH7513A-BF eDP to LVDS) or 1 x eDP: 1920 x 1080@60Hz (2 Lanes) Default LVDS.

Note: EDP_LVDS1 Support 1 x LVDS or 1 x eDP

Expansión

1 x M.2 Type M 2280 (with 1 x PCIe Gen4 x4)

1 x M.2 Type B 3042/3052/2242 (with PCIe x1 Gen3, SATA and USB 2.0, USB 3.0, with 1 x SIM card slot, supports WWAN+GNSS or SSD)

Only supports one SIM card (co-lay 1 x 10pin FPC connector for uSIM card adapter) support 5G (3.3V & 3.8V)

1 x M.2 Type E 2230 support CNVi and WiFi 6E module (1 x PCIe x1 & USB 2.0 Signal)

Códec de audio

Realtek ALC888S HD Audio Decoding Controller

Interfaz de audio

Line-in, Mic-in, Line-out

Amplificador de audio

2 x 2W 4Ω Amplifier

Chipset LAN

2 x Intel® I226LM for standard temperature/Intel® I226IT for extend temperature

Interfaz Ethernet

10/100/1000/2.5G Base-Tx GbE compatible

Puerto LAN

2 x RJ-45

Modo de alimentación

AT/ATX (Default Setting: AT)

SO

Windows 11, Linux

Información de certificación

CE, FCC, RoHS Compliant

USB

3 x USB 3.2 Gen2

4 x USB 2.0

1 x USB Type C support DP/USB 3.2 Gen 1, 5V x 3A

Puerto COM

2 x RS-232/422/485

SATA

1 x SATA III

MIO

1 x eSPI

1 x SIM Card Slot

DIO

1 x 8-bit GPIO

Temp. de funcionamiento

Standard Temperature CPU SKU: 0°C ~ 60°C (-4~140°F) with 0.5m/s Air Flow

Extend Temperature CPU SKU: -40°C ~ 70°C(-40~°158F) with 0.5m/s Air Flow for Wide Temp CPU SKU

Temp. de almacenamiento

-40°C ~ 75°C (-40°F ~ 167°F)

Dimensiones (L x An)

5.7" x 4" (146mm x 101mm)

Peso

0.44lbs (0.2kg)

Humedad en funcionamiento

40°C @ 95% Relative Humidity, Non-condensing

Requisitos de alimentación

DC in +9V ~ +36V or USB type C Adapter (20V) Note: DCIN & USB type C Adapter can only use either one.

Información de pedido

ECM-RPL-300-A1R

3.5" w/U300E/2COM/8USB/I226/15W/A1

ECM-RPL-15S-A1R

3.5" w/i3-1315UE/2COM/8USB/I226/15W/A1

ECM-RPL-35S-A1R

3.5" w/i5-1335UE/2COM/8USB/I226/15W/A1

ECM-RPL-65S-A1R

3.5" w/i7-1365UE/2COM/8USB/I226/15W/A1

ECM-RPL-20S-A1R

3.5" w/i3-1320PE/2COM/8USB/I226/28W/A1

ECM-RPL-40S-A1R

3.5" w/i5-1340PE/2COM/8USB/I226/28W/A1

ECM-RPL-70S-A1R

3.5" w/i7-1370PE/2COM/8USB/I226/28W/A1

ECM-RPL-15W-A1R

3.5" w/i3-1315URE/2COM/8USB/I226/15W/A1

ECM-RPL-45W-A1R

3.5" w/i5-1345URE/2COM/8USB/I226/15W/A1

ECM-RPL-65W-A1R

3.5" w/i7-1365URE/2COM/8USB/I226/15W/A1

ECM-RPL-20W-A1R

3.5" w/i3-1320PRE/2COM/8USB/I226/28W/A1

ECM-RPL-50W-A1R

3.5" w/i5-1350PRE/2COM/8USB/I226/28W/A1

ECM-RPL-70W-A1R

3.5" w/i7-1370PRE/6COM/8USB/28W/I226/B1

¿Qué es ECM-RPL?

The ECM-RPL is a placa base industrial y embebida manufactured by Avalue, designed specifically for 3.5inch-sbc applications. It features red of 2 x Intel® I226LM for standard temperature/Intel® I226IT for extend temperature and so of AMI BIOS, 256Mbit SPI Flash ROM. The Avalue ECM-RPL is a 3.5-inch Single Board Computer designed for industrial and embedded applications. It integrates 13th Gen Intel® Core™ processors, supporting up to 32GB DDR5 4800MHz SO-DIMM memory. Key features include quad display outputs (DP, HDMI, LVDS/eDP), dual 2.5GbE LAN ports, and multiple expansion slots (M.2 Key-B, M.2 Key-E, M.2 Key-M, Mini PCIe). With support for Windows 11 and Linux, and a compact form factor of 146mm x 101mm, the ECM-RPL offers a robust solution for space-constrained environments.

Características y ventajas principales

Bottom Layer Soldered Processor
One 262-pin DDR5 4800MHz SO-DIMM socket, supports up to 32GB Max. (non ECC only)
Four Display, 1 x DP++, 1 x HDMI, 1 x 2CH LVDS or eDP, 1 x USB Type C support DP
Expansion Slot, M.2 Key-B, M.2 Key-E, M.2 Key-M
Two Gigabit Ethernet, 2 x 2.5GbE
DC in +9V ~ +36V or USB Type C Adapter (20V) Note: DCIN & USB Type C Adapter Can Only Use Either One

Aplicaciones y casos de uso

El ECM-RPL es ideal para numerosas aplicaciones de automatización industrial:

DC-powered industrial installations and mobile applications
High-performance computing and data processing tasks
Networked industrial systems and data communication
Peripheral device connectivity and data transfer
Memory-intensive applications and multitasking
Visual monitoring and data display systems
Custom industrial computing solutions
Industrial and embedded applications

Preguntas frecuentes

The Avalue ECM-RPL features Intel® Raptor Lake processors, supporting DDR5 memory, multiple high-resolution display outputs, Intel® high-speed Ethernet, versatile expansion options via M.2 slots, comprehensive I/O including multiple USB and COM ports, industrial-grade reliability features, and a compact 146mm x 101mm form factor. The board is designed for performance-demanding industrial applications requiring robust processing capabilities.

The Intel Raptor Lake processors in the ECM-RPL provide significant performance advantages including enhanced multi-core performance with hybrid architecture, higher clock speeds, larger cache sizes for improved data processing, improved integrated graphics capabilities, better power efficiency than previous generations, support for the latest memory and I/O standards, and enhanced security features. These capabilities make the ECM-RPL ideal for compute-intensive industrial applications, multi-tasking workloads, and applications requiring responsive graphical interfaces.

3.5-inch SBCs (Single Board Computers) are compact embedded computers measuring approximately 146mm x 101mm (5.75" x 4"). Their versatile form factor makes them ideal for applications requiring a balance of performance, I/O options, and size constraints, including industrial automation, IoT gateways, edge computing, digital signage, medical devices, transportation systems, robotics, and industrial control systems. These boards offer significant processing capabilities, multiple I/O options, and industrial-grade reliability for demanding environments.

3.5-inch SBCs offer several advantages including: a balanced form factor between size and functionality (smaller than Mini-ITX but with more features than smaller form factors); rich I/O options without requiring expansion cards; better thermal management than smaller boards due to larger surface area; good performance-to-size ratio; flexibility with both soldered and socketed CPU options depending on model; simplified integration into mid-sized enclosures; good scalability for industrial applications; and long lifecycle support typical of industrial-grade components.

Different Intel processor generations provide varied capabilities to 3.5-inch SBCs: newer generations (Meteor Lake, Raptor Lake, Alder Lake) offer hybrid architecture with enhanced multi-core performance, AI acceleration, and support for DDR5 memory; mid-range options (Elkhart Lake) balance performance and power efficiency for IoT and edge applications; while entry-level processors (Atom series) optimize for low power consumption and extended temperature ranges. The choice between processor generations involves balancing processing requirements, power constraints, thermal considerations, and specific features needed (like AI acceleration, TSN support, or extended lifecycle) for the target application.

When selecting a 3.5-inch SBC for industrial applications, consider: processing requirements for your workload; memory and storage configurations; specific I/O interface requirements (COM ports, USB, display outputs); networking needs (number of ports, speed, reliability); temperature operating range for the deployment environment; power constraints; expansion capabilities through M.2 or other slots; long-term availability guarantees; operating system support and driver availability; ruggedness including shock and vibration resistance; certifications required for your industry; and total cost of ownership including maintenance and support.

For cooling 3.5-inch SBCs in enclosed systems: ensure at least 0.5 m/s airflow as specified in thermal requirements; use conduction cooling with thermal pads connecting the processor to the enclosure acting as a heat sink; implement passive cooling solutions like aluminum enclosures with external fins to increase surface area; maintain adequate clearance around heat-generating components; arrange components to create a natural convection path; position the board away from other heat sources; implement thermal monitoring through the hardware monitoring features; and for extreme environments, use specialized cooling techniques like heat pipes or forced air cooling while maintaining the board's environmental ratings.

For 3.5-inch SBCs, power considerations include: providing stable DC input within the specified voltage range (typically 9-36V) with proper regulation and adequate current capacity; understanding the difference between AT and ATX power modes (with AT being the default for most industrial applications); implementing proper power sequencing during boot and shutdown; adding surge protection for industrial environments; considering power filtering to eliminate electrical noise; implementing brownout protection; calculating total power budget including peripherals; planning for power management; using high-quality power connectors; and potentially implementing backup power solutions for critical applications requiring high availability.

To expand 3.5-inch SBC functionality: utilize M.2 slots for adding WiFi/Bluetooth, cellular connectivity, or high-speed storage; leverage multiple display outputs for multi-screen applications; use USB expansion for additional peripherals; implement I2C, SPI, or GPIO-based sensor networks; utilize the multiple Ethernet ports for network segregation or redundancy; develop custom carrier boards for application-specific needs; implement software-based capabilities through virtualization if supported by the processor; utilize COM port expansion if more serial interfaces are needed; and consider network-based resources for functions that cannot be implemented locally.

Common 3.5-inch SBC performance bottlenecks include: thermal limitations (addressed through proper cooling solutions); memory bandwidth constraints (mitigated by utilizing the fastest supported memory, like DDR5); storage I/O (improved by using NVMe over PCIe rather than SATA); network congestion (overcome by using 2.5G interfaces and implementing proper network design); USB bus saturation (resolved by distributing devices across controllers and using USB 3.2 for high-bandwidth devices); processor limitations in multi-threaded workloads (addressed through workload optimization); and display performance with multiple screens (managed by understanding the display bandwidth limitations of each interface).

For mounting 3.5-inch SBCs: use the four corner mounting holes with appropriate standoffs (typically M3); maintain minimum clearances specified in the manual, especially above heat-generating components; ensure proper thermal contact if using conduction cooling; consider orientation effects on natural convection cooling; use vibration-resistant fasteners with thread-locking compound for applications with vibration; implement strain relief for all cables connected to the board; avoid mounting near sources of electro-magnetic interference; ensure accessibility for maintenance if needed; and verify that the enclosure's thermal design is compatible with the board's cooling requirements and airflow specifications.

When handling 3.5-inch SBCs: always use proper ESD protection including wrist straps and ESD mats; hold the board by its edges to avoid touching components or contacts; avoid flexing the PCB during installation; ensure power is off when connecting/disconnecting components; use appropriate torque when securing mounting screws (typically 0.5-0.7 Nm); apply thermal compounds correctly if required for thermal management; connect cables with proper orientation and avoid forcing connectors; ensure all expansion cards and memory modules are properly seated; avoid exposing the board to moisture or contaminants; and follow proper packaging procedures for transportation to prevent physical damage.

When connecting peripherals to 3.5-inch SBCs: use high-quality, properly shielded cables to minimize EMI/RFI; implement strain relief to prevent connector damage; connect power supplies before connecting signal cables; use locking connectors where available for industrial applications; avoid exceeding the maximum cable lengths specified for each interface; balance loads across multiple USB ports rather than concentrating on one port; verify peripheral power requirements against available supply; properly configure serial port parameters (baud rate, parity, etc.) before connecting serial devices; test peripherals individually before connecting multiple devices; and label all connections for easier maintenance.

For OS setup on 3.5-inch SBCs: obtain the manufacturer-recommended OS image or validated distribution for your specific model; configure BIOS/UEFI settings appropriately before installation, paying attention to boot order and storage controller modes; during installation, optimize partition layouts considering available storage; install essential drivers provided by the manufacturer, particularly chipset, network, and display drivers; disable unnecessary services to reduce resource usage; configure appropriate power management settings based on your application needs; implement a backup strategy for the system image; establish a procedure for OS updates that includes proper testing in a non-production environment first; and document the entire configuration process for future reference.

If a 3.5-inch SBC fails to power on: verify power supply voltage is within specified range (typically 9-36V DC) and current capability (typically 3-5A minimum); check for reverse polarity connection which can damage the board; examine power cables for damage or loose connections; inspect the board for physical damage or burnt components; test with a known-good power supply; verify that the board is configured for the correct power mode (AT or ATX as specified in the documentation); check any power switches or jumpers; measure voltage at test points if available; inspect for short circuits or improperly seated components; and check status LEDs for error codes if present.

For display output issues: check cable connections and integrity; verify monitor power and input selection; confirm the monitor supports the resolution being used; try alternative display interfaces if available (switch between DisplayPort, HDMI, or LVDS/eDP); update display drivers; reset BIOS/UEFI display settings to defaults; test with a known-working display; check BIOS settings for primary display selection; verify multi-display configuration is properly set up; inspect system logs for graphics initialization errors; ensure correct display output is enabled in BIOS if multiple are available; try booting in safe mode; and for persistent issues, try reinstalling graphics drivers or updating the BIOS.

Common network issues include: physical connection problems (check cables and connectors); driver-related issues (update or reinstall network drivers); incorrect IP configuration (verify static/DHCP settings); firewall or security software blocking communication; conflicting IP addresses on the network; switch or router configuration issues; network interface hardware failure; incorrect gateway or DNS settings; specific protocol not enabled or configured; packet filtering rules blocking traffic; VLAN configuration mismatches; and network congestion or bandwidth limitations. Systematic troubleshooting should include link status verification, ping tests to various targets, checking system logs, and testing with alternative cables and network equipment.

For M.2 device issues: verify the card is properly inserted and secured; check that the M.2 card type matches the slot (Key-B, Key-E, Key-M, etc.); confirm the BIOS recognizes the device during POST; verify BIOS storage controller settings (NVMe, SATA, or PCIe mode); update BIOS to the latest version that may include improved device compatibility; check for driver requirements for the specific device; test the M.2 device in another system if possible; verify power management settings aren't affecting device operation; check thermal conditions as M.2 devices can throttle or fail under excessive heat; and for storage devices, run diagnostic tools to verify device health.

Aspectos destacados

Descripción del producto

Especificaciones técnicas

Información del sistema

Procesador

Memoria del sistema

Chipset de E/S

Temporizador watchdog

BIOS

Monitor de estado del hardware

TPM

Placa

Almacenamiento

Almacenamiento

Pantalla

Pantallas múltiples

Chipset gráfico

Espec. y resolución

LVDS

Expansión

Expansión

Audio

Códec de audio

Interfaz de audio

Amplificador de audio

Ethernet

Chipset LAN

Interfaz Ethernet

Puerto LAN

Requisitos de alimentación

Modo de alimentación

Soporte de software

SO

Certificación

Información de certificación

E/S

USB

Puerto COM

SATA

MIO

DIO

Mecánica y condiciones ambientales

Temp. de funcionamiento

Temp. de almacenamiento

Dimensiones (L x An)

Peso

Humedad en funcionamiento

Requisitos de alimentación

Información de pedido

Información de pedido

¿Qué es ECM-RPL?

Características y ventajas principales

Aplicaciones y casos de uso

Preguntas frecuentes