What are the key features of the ACP-Q6490 ARM-based SBC?

The ACP-Q6490 is a high-performance 2.5" SBC featuring the Qualcomm QCS6490 SoC with 8-core Kryo 670 CPU (up to 2.7GHz), 8GB LPDDR4 memory (optionally 4GB/16GB), UFS 3.1 storage (default 128GB), HDMI 1.4 display output, diverse I/O including USB 3.1/2.0/Type-C, dual MIPI-CSI2 camera interfaces, GbE LAN, 802.11ax WiFi, and operates in temperatures from -20°C to 70°C.

What are the processing capabilities of the ACP-Q6490?

The ACP-Q6490 features the powerful Qualcomm QCS6490 processor with 8-core Kryo 670 CPU reaching speeds up to 2.7GHz, delivering 12 TOPS (INT8) of AI performance. This high-performance SoC makes the board suitable for AI edge computing, computer vision applications, and other demanding workloads that require significant processing power in a compact form factor.

What expansion options does the ACP-Q6490 provide?

The ACP-Q6490 offers expansion through 1 x M.2 B-key 3052 slot (USB 3.1) for additional storage or connectivity modules, 1 x Nano SIM slot for cellular connectivity, UFS 3.1 storage, 1 x uSD 3.0 card slot, and comprehensive I/O including USB ports, HDMI, audio interfaces, and camera connections, providing considerable flexibility for various applications.

What operating systems does the ACP-Q6490 support?

The ACP-Q6490 primarily supports Android, with Ubuntu and Windows available by demand. This flexibility in operating system support makes it suitable for a wide range of applications, from consumer-facing kiosks and digital signage (Android) to more specialized industrial computing applications (Ubuntu) or enterprise deployments requiring Windows compatibility.

Avalue · Placa base industrial y embebida

ACP-Q6490

Ficha técnica

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Fabricante: Avalue

Aspectos destacados

Qualcomm® QCS6490, 8-core Kryo™ 670 CPU up to 2.7GHz
8GB LPDDR4 Memory (optional 4GB/16GB)
Supports UFS 3.1, Default 128GB Storage
1x HDMI 1.4 Display Output
2x USB 3.1, 3x USB 2.0, 1x USB Type-C
Dual MIPI-CSI2 Camera Interface
1x GbE LAN (RJ-45)
802.11ax WiFi
DC 12V Input
Operating Temperature: -20°C ~ 70°C

Descripción del producto

The Avalue ACP-Q6490 is a high-performance 2.5" ARM-based SBC powered by the Qualcomm QCS6490 SoC.

Featuring 8-core Kryo 670 CPU, up to 16GB LPDDR4 memory, UFS 3.1 storage, triple USB ports, HDMI display, dual MIPI-CSI2 camera support, and 802.11ax Wi-Fi, it is designed for AI edge computing and industrial embedded applications.

Especificaciones técnicas

Procesador

QCS6490

Qualcomm® Kryo™ 670, 8 cores, up to 2.7GHz, 12 TOPS (INT8)

Memoria del sistema

LPDDR4, 8GB (Optional 4GB to 16GB)

Expansión

1 x M.2 B key 3052 (USB 3.1)

1 x Nano SIM slot (Push and Pull)

Almacenamiento UFS

Supports UFS 3.1, Default 128GB

Entrada de CC

DC 12V

SO

Android (primary)

Ubuntu (by demand)

Windows (by demand)

UART

1 x Debug UART (TX, RX)

GPIO

1 x 16-bit DIO

RS232

1 x RS-232 (RX, TX, RTS, CTS)

RS485

1 x RS485

USB

3 x USB 2.0

1 x USB Type-C (Download Only)

2 x USB 3.1 Gen1 Type-A

Pantalla

1 x HDMI 1.4

Audio

1 x Line-Out (Stereo)

1 x Mic-In (Mono)

Red

1 x GbE (RJ-45)

WiFi

802.11ax WiFi

Cámara

2 x MIPI-CSI2 (4-lane) for Camera (IMX577, GC5035)

I2C

1 x I2C

SD

1 x uSD 3.0 Card Slot

Indicador LED

1 x Power LED

Temperatura de funcionamiento

-20°C ~ 70°C

Temperatura de almacenamiento

-40°C ~ 85°C

Dimensiones (L x An)

2.5'' SBC 100mm x 72mm

¿Qué es ACP-Q6490?

The ACP-Q6490 is a placa base industrial y embebida manufactured by Avalue, designed specifically for arm-based-sbc applications. The Avalue ACP-Q6490 is a high-performance 2.5" ARM-based SBC powered by the Qualcomm QCS6490 SoC. Featuring 8-core Kryo 670 CPU, up to 16GB LPDDR4 memory, UFS 3.1 storage, triple USB ports, HDMI display, dual MIPI-CSI2 camera support, and 802.11ax Wi-Fi, it is designed for AI edge computing and industrial embedded applications.

Características y ventajas principales

Qualcomm® QCS6490, 8-core Kryo™ 670 CPU up to 2.7GHz
8GB LPDDR4 Memory (optional 4GB/16GB)
Supports UFS 3.1, Default 128GB Storage
1x HDMI 1.4 Display Output
2x USB 3.1, 3x USB 2.0, 1x USB Type-C
Dual MIPI-CSI2 Camera Interface
1x GbE LAN (RJ-45)
802.11ax WiFi
DC 12V Input
Operating Temperature: -20°C ~ 70°C

Aplicaciones y casos de uso

El ACP-Q6490 es ideal para numerosas aplicaciones de automatización industrial:

DC-powered industrial installations and mobile applications
Extreme temperature environments and outdoor installations
Wireless connectivity and remote monitoring applications
Ai edge computing and industrial embedded applications
High-performance computing and data processing tasks
Networked industrial systems and data communication
Peripheral device connectivity and data transfer
Memory-intensive applications and multitasking

Preguntas frecuentes

ARM-based Single Board Computers (SBCs) use processors based on ARM architecture, known for excellent power efficiency and performance-per-watt ratio compared to x86 SBCs. ARM SBCs typically consume less power, generate less heat (often enabling fanless designs), and are more cost-effective for many applications. While traditionally providing lower raw processing power than x86 counterparts, modern ARM SoCs (especially those with multi-core designs) now offer competitive performance for many industrial and embedded applications while maintaining their efficiency advantages.

ARM-based SBCs excel in industrial applications including HMI (Human-Machine Interface) systems, IoT gateways, edge computing devices, industrial control panels, digital signage, point-of-sale systems, industrial automation, machine vision systems, robotics, medical devices, and transportation systems. Their low power consumption, wide temperature operation, compact form factors, and long lifecycle support make them ideal for environments where reliability, efficiency, and space constraints are critical factors.

ARM-based SBCs typically support a variety of operating systems including various Linux distributions (Debian, Ubuntu, Yocto Project), Android, and some specialized real-time operating systems (RTOS). Windows 10 IoT Core or Windows 11 for ARM is available on select platforms. For industrial applications, Linux-based systems (particularly Yocto) are popular due to their customizability, stability, and long-term support options, while Android is common for touch-based interactive applications.

ARM-based SBCs offer several advantages for industrial applications including lower power consumption (reducing cooling requirements and operating costs), fanless operation (enhancing reliability in dusty environments), wide temperature operation ranges, compact form factors, extended lifecycle support, diverse I/O options optimized for industrial use (like CAN, RS-485, and industrial Ethernet), competitive pricing, and increasingly powerful processing capabilities for edge computing and AI workloads.

When selecting an ARM-based SBC, consider: processing requirements (CPU/GPU capabilities for your workload); memory and storage needs; I/O requirements (specific interfaces like CAN, RS-485, industrial Ethernet); display requirements (resolution, number of displays, interface types); environmental specifications (temperature range, humidity, vibration resistance); power constraints; form factor and mechanical integration; long-term availability and support; operating system compatibility; and total cost of ownership. Prioritize industrial-grade components and wide temperature operation for demanding environments.

ARM Cortex-A53 is an older 64-bit core offering good power efficiency and reliability for basic tasks. Cortex-A55 is its successor, providing approximately 18% better performance at the same power level, with improved memory system. Cortex-A76 is a high-performance core with significantly higher processing power (2-3x over A55) but at higher power consumption, often used in big.LITTLE configurations where A76 cores handle intensive tasks while A55 cores manage background processes to balance performance and power efficiency in modern SoCs.

Common display interfaces on ARM-based SBCs include: HDMI (digital interface supporting high resolutions and audio); LVDS (differential signaling interface common in industrial panels); MIPI DSI (low-power interface for mobile/embedded displays); eDP (DisplayPort variant for embedded applications); and legacy interfaces like VGA (analog) or DVI. They differ in resolution support, cable length limitations, EMI characteristics, power consumption, and compatibility with industrial displays. Modern SBCs often include multiple interfaces to accommodate various display options.

To ensure reliability in harsh environments: select boards with appropriate temperature ratings; implement proper thermal management (heat sinks, enclosures with thermal design); protect against dust and moisture using appropriate IP-rated enclosures; use industrial-grade components and conformal coating where available; implement surge protection and proper grounding; select boards with vibration/shock resistance certifications for mobile applications; use locking connectors to prevent disconnection; implement watchdog timers and reliable power supplies with appropriate filtering; perform thorough environmental testing; and establish monitoring systems for predictive maintenance.

When installing ARM-based SBCs, consider: proper voltage range (typically 9-36V DC for industrial boards); sufficient power supply rating with headroom above maximum consumption; power supply quality (filtering, stability); surge and brownout protection; proper grounding and isolation in electrically noisy environments; cable gauge selection for power delivery; backup power options (UPS or battery) for critical applications; power sequencing requirements for attached peripherals; thermal implications of power consumption; and power management settings in the operating system to optimize efficiency while meeting performance requirements.

For effective thermal management of ARM-based SBCs: ensure adequate airflow around the board; use appropriate heat sinks or thermal pads on processors and other heat-generating components; maintain recommended clearance from other heat sources; consider ambient temperature in the installation environment; for higher-temperature environments, select boards with wider temperature ratings; implement temperature monitoring; in sealed enclosures, use thermal transfer techniques to conduct heat to the enclosure walls; and for outdoor installations, consider solar loading effects and use reflective or insulated enclosures.

For optimal connectivity with ARM-based SBCs: use high-quality, shielded cables for signal integrity; implement proper strain relief to prevent connector damage; use locking connectors where possible; separate signal cables from power cables to minimize interference; follow proper grounding practices; add surge protection for external connections; implement network security measures for connected systems; maintain proper cable lengths within specifications; label all connections clearly; document the complete connectivity scheme; and test all connections thoroughly before final deployment.

For first-time boot and configuration: verify proper power supply and connectivity before powering on; prepare the bootable media (microSD/eMMC) with the appropriate operating system image; connect essential peripherals (display, keyboard); power on and observe boot indicators; follow specific first-boot procedures for your OS (setting root password, network configuration); update the system to latest patches; configure system services as needed; implement required security measures; set up remote access if needed; configure automatic startup applications; establish monitoring and logging; create system backups; and document the complete configuration for future reference.

If an ARM-based SBC fails to boot: verify power supply voltage and polarity; check for power indicators on the board; inspect for physical damage or loose connections; try an alternative power supply; verify boot media (microSD/eMMC) is properly inserted and functional; connect a display to check for boot messages; check boot mode jumpers/switches if present; try a known-good operating system image; look for error codes or LED blink patterns indicating specific issues; disconnect all peripherals except essential ones; and check manufacturer-specific recovery mechanisms or boot options. Document what you've tried for more effective technical support if needed.

To diagnose network issues: check physical connections and link indicators; verify IP configuration (static/DHCP settings); use diagnostic commands (ping, ifconfig/ip addr, traceroute, nslookup); examine network services status; check firewall settings; verify DNS configuration; examine logs for network errors; test alternative network cables; confirm network switch port functionality; verify MAC address conflicts; check for overheating causing intermittent connectivity; test multiple network applications to isolate the issue; and capture network traffic with tools like tcpdump or Wireshark for deeper analysis if necessary.

Common causes of instability include: inadequate power supply (voltage drops under load); thermal issues (overheating due to inadequate cooling or ambient conditions); memory leaks in applications; storage device failures; incompatible drivers or kernel modules; hardware clock issues; excessive I/O operations overwhelming the system; corrupted operating system files; electromagnetic interference in industrial environments; insufficient RAM for workload; improper shutdown causing filesystem corruption; incompatible peripherals; and outdated firmware or operating system. Systematic testing and log analysis can help identify the specific cause.

To resolve display issues: verify physical connections and cable integrity; confirm monitor power and input selection; check supported resolutions and refresh rates; verify display interface configuration in the operating system; examine logs for graphics driver errors; test alternative cables or adapters; try different resolution/refresh settings; update graphics drivers if available; check for conflicting display settings when using multiple outputs; verify sufficient power for the display subsystem; review boot logs for early graphics initialization errors; and try alternative display devices to isolate whether the issue is with the SBC or the display device.

ACP-Q6490

Aspectos destacados

Descripción del producto

Especificaciones técnicas

Información del sistema

Procesador

Memoria del sistema

Expansión

Expansión

Almacenamiento

Almacenamiento UFS

Requisitos de alimentación

Entrada de CC

Soporte de software

SO

E/S

UART

GPIO

RS232

RS485

USB

Pantalla

Audio

Red

WiFi

Cámara

I2C

SD

Control del sistema

Indicador LED

Mecánica y condiciones ambientales

Temperatura de funcionamiento

Temperatura de almacenamiento

Dimensiones (L x An)

¿Qué es ACP-Q6490?

Características y ventajas principales

Aplicaciones y casos de uso

Preguntas frecuentes