EPC-EHL

Série : EPC

Fabriqué parAvalue

The Avalue EPC-EHL is a compact computing system designed for industrial applications, featuring Intel® Elkhart Lake processors. It offers a fanless design, multiple I/O ports, and supports a wide range of temperatures, making it ideal for use in demanding environments. The system is built for reliability, providing robust performance in a compact form factor with versatile connectivity options.

Caractéristiques principales

Intel Atom® x6413E Processor
Intel® UHD Graphics, Max. Up to 32EU
1-Memory Socket, Max. Up to 32GB DDR4 3200
Rich I/O, 4-USB, 1-HDMI, 1-DP, 2-LAN, 4-RS232, 1-Mic-in, 1-Line-out
2-M.2, Key-E/B for Wi-Fi, LTE, SSD, I/O module
Fanless Operating Temp, -40 ~ 70°C
Wide Range DC Power Input, +9V~36V
Default dTPM 2.0, Wall Mount Kit

Caractéristiques techniques

Informations système

Processeur	Intel Atom® x6413E Processor, 1.5M Cache, up to 3.00 GHz, 9W
Mémoire système	1 x 260-Pin SO-DIMM Socket, Max. Up to 32GB DDR4 3200MTs
Chien de garde (watchdog)	H/W Reset, 1sec. ~ 65535sec.
Informations BIOS	AMI uEFI BIOS, 128Mbit SPI Flash ROM
Surveillance de l'état matériel	Monitoring System Temperature and Voltage with Auto Throttling Control
SBC	ECM-EHL
TPM	TPM 2.0

Mécanique et environnement

Température de fonctionnement	-40°C ~ 60°C (-40°F ~ 140°F) with 0.2m/s air flow, -40°C ~ 70°C (-40°F ~ 158°F) with 0.5m/s air flow
Température de stockage	-20°C ~ 60°C (-4°F ~ 140°F)
Humidité en fonctionnement	40°C @ 95% Relative Humidity, Non-condensing
Dimensions (larg. x long. x haut.)	177 x 123 x 65mm
Test de vibrations	With SSD: 5Grms, IEC 60068-2-64, Random, 10 ~ 500Hz, 30min/Axis, 3 Axis
Test de chocs	With SDD : 55G, IEC 60068-2-27, Half Sine, 11ms, 3Axis, 6 Face
Test de chute	ISTA 2A, IEC-60068-2-32 Test : Ed, 1 Corner, 3 Edges, 6 Faces
Kit de montage	Wall Mount Kit (Default)

Extension

M.2	1 x M.2 (Key-B, 2242/3042, PCIex2, or ( PCIex1+USB3.1 GEN1), or (SATAIII + USB 3.1 GEN2), USB2.0, SIM Slot for LTE Cards), *Default is PCIex1/SATAIII+USB3.1 GEN1, others through BIOS Modification., 1 x M.2 (Key-E, 2230, PCIex1, USB2.0)

Stockage

M.2	1 x M.2 (Key-B, 2242)
Baie de disque 2,5	1 x 2.5 Drive Bay (7mm)

E/S en face avant

Bouton d'alimentation	1 x Power Button
Voyant LED	1 x Power on/off LED, 1 x Storage Access LED

E/S en face arrière

USB	2 x USB 3.1 Gen2 (10Gbps), 2 x USB2.0
Port COM	4 x RS232
Voyant LED	1 x Power on/off LED, 1 x Storage Access LED
Port LAN	2 x RJ45
Audio	1 x Mic-in, 1 x Line-out
DP	1 x DP 1.4a
HDMI	1 x HDMI 2.0b
Antenne	2 x Antenna Mounting with Dust Protection Cover
Entrée CA/CC	1 x Lockable DC Jack

E/S côté droit

Antenne	2 x Antenna Mounting with Dust Protection Cover

Audio

Codec audio	Realtek ALC888S

Écran

Chipset graphique	Intel® UHD Graphics for 10th Gen Intel® Processors
Résolution	1 x HDMI 2.0b Max resolution 4096x2160@60Hz, 1 x DP 1.4a Max resolution 4096x2160@60Hz

Certifications

Informations de certification	CE, FCC Class B

Ethernet

Chipset LAN	2 x Intel® I226IT
Spécifications	2x 10/100/1000/2.5G Base-Tx GbE compatible

Alimentation requise

Adaptateur	Input: 100 ~ 240Vdc/ 50 ~ 60Hz, Output: 12V/5A AC-DC 60W Adapter

Prise en charge logicielle

OS	Win10, Win11, Linux

Informations de commande

Informations de commande	EPC-EHL-X13-B1-1R：Intel® ATOM® Processor x6413E Fanless Compact System