Fiche technique du produit
14 September 2026
Système informatique · Expandable-Computing-System
SLP-WHG-TSN
Série : SLP
Fabriqué parAvalue
The Avalue VMS-CFS-M12 is a modular computing system designed for vehicular applications, featuring M12 connectors for robust and secure connectivity. It supports a fanless design and operates over a wide temperature range, making it suitable for demanding environments. This system is ideal for applications that require durable, reliable connections and robust performance, especially in mobile and industrial settings.
Caractéristiques principales
- 8th Gen Intel Core SoC i7/i5/i3 & Celeron BGA Processor
- 2 x 260-pin DDR4 2133 MHz SO-DIMM Socket, up to 32GB Max (Non ECC Only)
- Rich I/O, 3-USB3.1, 3-HDMI, 4-COM, 3-LAN, 4-TSN Gigabit Ethernet
- 1 x Key A M.2 2230 supports Wi-Fi & BT Modulle, 1 x M.2 Key-B 3042/2242/2260/2280 with
- internal SIM slot
- Fanless operation temperature from -20°C ~ 50°C
- CE/FCC Class A
- Wide range DC power input from +12~24V
- Support TSN Timing and Synchronization for Time-Sensitive Applications compliant to IEEE 802.,1AS-Rev/AS, and IEEE 1588V2
Caractéristiques techniques
Informations système
| Processeur | Intel® Core™ i7-8665UE Processor (15W, 8M Cache, up to 2.0 GHz), Intel® Core™ i5-8365UE Processor (15W, 8M Cache, up to 1.8 GHz), Intel® Core™ i3-8145UE Processor (15W, 4M Cache, up to 1.6 GHz), Intel® Celeron® Processor 4305UE (15W, 2M Cache) |
|---|---|
| Mémoire système | 2 x 260-pin SODIMM socket Max. up to 32GB DDR4 2133MT/s |
| Informations BIOS | AMI uEFI BIOS 256 Mbit SPI Flash ROM |
| Chien de garde (watchdog) | H/W Reset, 1sec. ~ 65535sec. |
| Surveillance de l'état matériel | Monitoring CPU & System Temperature and Voltage |
| SBC | EMX-WHLGP |
| TPM | Onboard TPM 2.0 |
Mécanique et environnement
| Température de fonctionnement | -20~50°C (41˚F ~ 122˚F) w/Industrial SSD, ambient w/ 0.5m/s air flow |
|---|---|
| Température de stockage | -30°C ~ 70°C (-22°F ~ 158°F) |
| Humidité en fonctionnement | 40°C @ 95% Relative Humidity, Non-condensing |
| Dimensions (larg. x long. x haut.) | 217 mm x 115 mm x 220 mm |
| Poids | 2.6 kg (System), 3.4 kg (w_Package) |
| Test de vibrations | With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 1hr/axis |
| Test de chocs | With SSD : 10Grms, IEC 60068-2-29, Half Sine, 11ms |
| Test de chute | Complied with ISTA 2A |
Extension
| M.2 | 1 x M.2 Key-A 2230 for Wi-Fi & BT Module, 1 x M.2 Key-B 3042/2242/2260/2280, supports SATA 3/PCIe lll x 1/USB 2.0 and internal SIM slot 1 |
|---|---|
| PCIe | 1 x PCIe*1 slot, 1 x PCIe*4 slot, w/ASIX TSN Card: Quad Port TSN Gigabit Ethernet PCIe NIC Card |
Stockage
| M.2 | 1 x M.2 Key-B 3042/2242/2260/2280, support SSD(share with expansion slot) |
|---|---|
| Baie de disque 2,5 | 1 x 2.5” Drive Bay (internal) |
E/S en face arrière
| USB | 3 x USB3.1 Gen1, 1 x USB Type C w/o ALT mode |
|---|---|
| Port LAN | 3 x RJ-45 GbE, 4 x RJ45 for TSN Gigabit Ethernet |
| Bouton d'alimentation | 1 x Power On/Off |
| Port COM | 4 x RS-232 |
| Voyant LED | 1 x Power LED, 1 x HDD LED |
| Emplacement SIM | 1 x Internal SIM slot |
| Marche/arrêt par commande filaire | 2-Pin Terminal Block |
| Antenne | 2 x Antenna with dust cover |
| Entrée CA/CC | 3-Pin Terminal Block (V+. V-, GND) |
Écran
| Chipset graphique | Intel® Processor Graphics |
|---|---|
| Résolution | 3 x HDMI 1.4b: 3840 x 2160 @ 30 Hz |
Certifications
| Informations de certification | CE/FCC Class A |
|---|
Ethernet
| Chipset LAN | 1 x Intel® I219-LM, 2 x Intel® I210-IT |
|---|
Alimentation requise
| Mode d'alimentation | AT/ATX (ATX is default setting) |
|---|
Prise en charge logicielle
| OS | Win 10 64bit, Linux |
|---|
Informations de commande
| Informations de commande | 8th Gen Intel® Core™ Processor Core™ SoC i7/i5/i3 & Celeron® BGA Processor, Fanless Expandable Slot PC with TSN Gigabit Ethernet PCIe NIC Card, SLP-WHG-86-A1-2R (i7-8665UE), SLP-WHG-83-A1-2R (i5-8365UE), SLP-WHG-81-A1-2R (i3-8145UE) |
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