Avalue · Système informatique

EMS-EHL-4COM isolation

EMS-EHL-4COM isolation, avantEMS-EHL-4COM isolation, avant
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Fiche technique

*Prix sur demande. Contactez-nous pour un devis.

Fabricant : Avalue

Points forts

  • Intel® Celeron®/Atom™ J6413/x6425E SoC BGA Processor
  • 1 x 260-pin SODIMM socket Max. up to 32GB DDR4 3200MT/s
  • Rich I/O, 4-USB3.2, 2-USB2.0, 1-DP, 1-HDMI, 6-COM (4COM w/2.5KV isolation), 2-LAN, 1-8bit GPIO
  • Support 5G (Sub-6G) module, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE
  • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 65°C (ST)
  • CE, FCC Class B, LVD 62368-1, IP50
  • Wide range DC power input from +9~36V
  • Support HW TPM 2.0
  • Support IET modules

Description du produit

The Avalue EMS-EHL-4COM-isolation is a modular industrial computing system featuring Intel® Elkhart Lake processors. It is designed with 4 isolated COM ports, making it ideal for applications that require secure and stable serial communication.

The fanless design and wide operating temperature support ensure reliability in harsh industrial environments. Its modular design allows for flexible configuration, making it suitable for various industrial applications.

Caractéristiques techniques

Processeur

Intel® Celeron® Processor J6413 (1.5M Cache, up to 3.00Ghz), ST, Tj=105°C

Intel® Atom® Processor x6425E(1.5M Cache, up to 3.00Ghz), WT, Tj=-40°C ~105°C

Mémoire système

1 x 260-pin SODIMM socket Max. Up to 32GB DDR4 3200 MT/s

Chien de garde (watchdog)

H/W Reset, 1sec. ~ 65535sec.

Surveillance de l'état matériel

CPU & system temperature monitoring and Voltages monitoring

SBC

EBM-EHLS

TPM

TPM 2.0

Température de fonctionnement

-40°C ~ 70°C (w/SSD) ambient w/ 0.5 air flow, WT sku, x6425E

-40°C ~ 60°C (w/SSD) ambient w/ 0.2 air flow, WT sku, x6425E

0°C ~ 65°C (w/SSD) ambient w/ 0.5 air flow, ST sku, J6413

0°C ~ 55°C (w/SSD) ambient w/ 0.2 air flow, ST sku, J6413

Température de stockage

-30°C ~ 70°C (-22°F ~ 158°F)

Humidité en fonctionnement

40°C @ 95% Relative Humidity, Non-condensing

Dimensions (larg. x long. x haut.)

240mm x 150mm x 64 mm (w/ IET module)

Poids

1.9 kg (System)

2.7 kg (w_Package)

Test de vibrations

With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 1hr/axis

Test de chocs

With SSD : 55Grms, IEC 60068-2-27, Half Sine, 11ms

Indice de protection

IP 50

Kit de montage

Wall mount kit (standard)

DIN RAIL (optional)

M.2

1 x M.2 (Key-B, 2242/3042, PCIex2, or ( PCIex1+USB3.1 GEN1), or (SATAIII + USB 3.1 GEN2), USB2.0, SIM Slot for LTE Cards)

*Default is PCIex1/SATAIII+USB3.1 GEN1, others through BIOS Modification.

1 x M.2 (Key-E, 2230, PCIex1, USB2.0)

M.2

1 x M.2 Key-B 2242/2280, support SATA

1 x M.2 Key-B 2242, support SATA (share with expansion slot)

Bouton d'alimentation

1 x Push Button for Power on/off

Bouton de réinitialisation

1 x Push Button for Reset

Voyant LED

1 x Power LED (Blue)

1 x Storage LED (Yellow)- M.2 B-key SATA

1 x LTE LED (Green)- M.2 B-key PCIe

1 x Wifi LED (Green)- M.2 E key

Port COM

2 x COM RS232/422/485 (select via BIOS, auto flow control via HW)

E/S numériques

1 x 8-bit GPIO (DB9)

Audio

1 x Mic-In, 1 x Line-Out

Marche/arrêt par commande filaire

1 x 2-Pin Terminal Block for wire-control power on/off

Antenne

2 x Antenna with dust cover

USB

2 x USB 2.0

2 x USB 3.1 Gen.2 (10Gbp/s)

2 x USB 3.1 Gen.1 (5Gbp/s), via USB Hub

Port COM

4x RS232/422/485 (2.5KV isolation)

Port LAN

2 x RJ45

Audio

1 x Mic-in,1 x Line-out

DP

1 x DP 1.4

HDMI

1 x HDMI 2.0b

Antenne

2 x Antenna with dust cover

Entrée CA/CC

3-Pin Terminal Block (V+. V-, GND)

Antenne

2 x Antenna with dust cover

Antenne

2 x Antenna with dust cover

Codec audio

Realtek ALC888S (co-lay with ALC897) HD codec

Chipset graphique

Intel® UHD Graphics for 10th Gen Intel® Processors

Résolution

DP++ 1.4: 4096x2304 @ 60Hz

HDMI 2.0b : Max. resolution 4096x2304 @ 60Hz

Informations de certification

CE, FCC Class B, LVD 62368-1

Chipset LAN

2 x Intel I226-IT

Spécifications

2 x 10/100/1000/2.5G Base-Tx GbE compatible

ACPI

Single power ATX Support S0,S3, S4, S5

ACPI 5.0 Compliant

Mode d'alimentation

AT/ATX (ATX is default setting)

OS

Win 10 64bit / Win 11 64 bit/ Linux

Informations de commande

Intel® Elkhart Lake Atom®/Celeron® Processor Fanless Rugged Embedded System, w_4COM Isolation IET Module

EMS-EHL-X64-A1-4R (x6425E)

EMS-EHL-J64-A1-4R (J6413)

Qu'est-ce que le EMS-EHL-4COM isolation ?

The EMS-EHL-4COM isolation is a système informatique manufactured by Avalue, designed specifically for modular-computing-system applications. It features réseau of CPU & system temperature monitoring and Voltages monitoring, os of Win 10 64bit / Win 11 64 bit/ Linux and certification of CE, FCC Class B, LVD 62368-1. The Avalue EMS-EHL-4COM-isolation is a modular industrial computing system featuring Intel® Elkhart Lake processors. It is designed with 4 isolated COM ports, making it ideal for applications that require secure and stable serial communication. The fanless design and wide operating temperature support ensure reliability in harsh industrial environments. Its modular design allows for flexible configuration, making it suitable for various industrial applications.

Caractéristiques et avantages clés

  • Intel® Celeron®/Atom™ J6413/x6425E SoC BGA Processor
  • 1 x 260-pin SODIMM socket Max. up to 32GB DDR4 3200MT/s
  • Rich I/O, 4-USB3.2, 2-USB2.0, 1-DP, 1-HDMI, 6-COM (4COM w/2.5KV isolation), 2-LAN, 1-8bit GPIO
  • Support 5G (Sub-6G) module, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE
  • Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 65°C (ST)
  • CE, FCC Class B, LVD 62368-1, IP50
  • Wide range DC power input from +9~36V
  • Support HW TPM 2.0
  • Support IET modules

Applications et cas d'usage

Le EMS-EHL-4COM isolation est idéal pour de nombreuses applications d'automatisation industrielle :

  • Applications that require secure and stable serial communication
  • Dust-sensitive environments and silent operation requirements
  • DC-powered industrial installations and mobile applications
  • Extreme temperature environments and outdoor installations
  • High-performance computing and data processing tasks
  • Networked industrial systems and data communication
  • Peripheral device connectivity and data transfer
  • Memory-intensive applications and multitasking

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