Avalue · Système informatique

EMS-TGL-4COM isolation

Fiche technique

*Prix sur demande. Contactez-nous pour un devis.

Fabricant : Avalue

Points forts

11th Gen. Intel® Core™ i7/i5/i3 BGA Processor
2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
Rich I/O, 4-USB3.1, 2-USB2.0, 1-DP, 1-HDMI, 6-COM (4COM w/2.5KV isolation), 2-LAN, 1-8bit GPIO.
Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE
Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
CE, FCC Class B, IP50
Wide range DC power input from +9~36V
Support HW TPM 2.0

Description du produit

The Avalue EMS-TGL-4COM-isolation is a modular industrial computing system equipped with Intel® Tiger Lake processors and 4 isolated COM ports for secure serial communication. Designed for reliability in harsh environments, it features a fanless design and supports wide temperature ranges.

This system is ideal for industrial applications that require secure and robust communication capabilities, ensuring stable performance and flexibility.

Caractéristiques techniques

Processeur

Intel® Core™ i7-1185GRE Processor (15W, 12M Cache, up to 2.80 GHz), WT

Intel® Core™ i5-1145GRE Processor (15W, 8M Cache, up to 2.60 GHz), WT

Intel® Core™ i3-1115GRE Processor (15W, 6M Cache, up to 3.00 GHz), WT

Intel® Core™ i7-1185G7E Processor (15W, 12M Cache, up to 2.80 GHz), ST

Intel® Core™ i5-1145G7E Processor (15W, 8M Cache, up to 2.60 GHz), ST

Intel® Core™ i3-1115G4E Processor (15W, 6M Cache, up to 3.00 GHz), ST

Mémoire système

2 x 260-pin SODIMM socket Max. up to 64GB DDR4 3200 MT/s

Chipset E/S

EC ITE IT8528E

Informations BIOS

AMI uEFI BIOS 256 Mbit SPI Flash ROM

Chien de garde (watchdog)

H/W Reset, 1sec. ~ 65535sec.

Surveillance de l'état matériel

CPU & system temperature monitoring and Voltages monitoring

SBC

EBM-TGLS + AUX-M07

Température de fonctionnement

-40°C ~ 70°C (w/SSD) ambient w/ air flow, WT sku

0°C ~ 70°C (w/SSD) ambient w/ air flow, ST sku

Température de stockage

-30°C ~ 70°C (-22°F ~ 158°F)

Humidité en fonctionnement

40°C @ 95% Relative Humidity, Non-condensing

Dimensions (larg. x long. x haut.)

240mm x 150mm x 69 mm (w/ IET module)

Poids

TBD

Test de vibrations

With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 1hr/axis

Test de chocs

With SSD : 55Grms, IEC 60068-2-27, Half Sine, 11ms

Indice de protection

IP 50

Kit de montage

Wall mount kit (standard)

DIN RAIL (optional)

M.2

1 x M.2 Key-B 2242/3042/3052 support SATA3/ PCIeIII x1/ USB3.1 and SIM slot1

1 x M.2 Key-E 2230 for Wi-Fi & BT Module(CNVi)

M.2

1 x M.2 Key-M 2242/2280, support PCIe Gen. III x 4 (NVMe SSD)

1 x M.2 Key-B 2242, support SATA (share with expansion slot)

Bouton d'alimentation

1 x Push Button for Power on/off

Bouton de réinitialisation

1 x Push Button for Reset

Voyant LED

1 x Power LED (Blue)

1 x Storage LED (Yellow)-M.2 B-key SATA

1 x LTE LED (Green)- M.2 B-key PCIe

1 x Wifi LED (Green)- M.2 E key

Port COM

2 x COM RS232/422/485 (select via BIOS, auto flow control via HW)

E/S numériques

1 x 8-bit GPIO (DB9)

Marche/arrêt par commande filaire

2-Pin Terminal Block

Antenne

2 x Antenna with dust cover

USB

2 x USB 3.1 Gen.2 (10Gbp/s)

2 x USB 3.1 Gen.1 (5Gbp/s)

2 x USB 2.0

Port COM

4 x COM RS232/422/485, w/2.5KV isolation

Port LAN

2 x RJ-45

Audio

Mic-In, Line-Out

Emplacement SIM

1 x internal SIM slot

Antenne

2 x Antenna with dust cover

Entrée CA/CC

3-Pin Terminal Block (V+. V-, GND)

Antenne

2 x Antenna with dust cover

Antenne

2 x Antenna with dust cover

Codec audio

Realtek ALC888S HD codec

Chipset graphique

Intel® Iris® Xe Graphics (i7-1185GRE/i5-1145GRE/i7-1185G7E/i5-1145G7E)

Intel® UHD Graphics for 11th Gen Intel® Processors (i3-1115GRE/i3-1115G4E)

Résolution

DP++ 1.4: 4096x2304 @ 60Hz

HDMI 2.0b : Max. resolution 4096x2304 @ 60Hz

Informations de certification

CE, FCC Class B

Chipset LAN

1 x Intel® I225-LM

1 x Intel® I219-LM

Spécifications

1 x 10/100/1000/2.5G Base-Tx GbE compatible

1 x 10/100/1000Base-Tx GbE compatible.

ACPI

Single power ATX Support S0,S3, S4, S5

ACPI 5.0 Compliant

Mode d'alimentation

AT/ATX (ATX is default setting)

OS

Win 10 64bit , Linux

Informations de commande

Intel® 11th Tiger Lake Core™ Processor i7/i5/i3 Fanless Rugged Embedded System, w_4COM Isolation IET Module

EMS-TGL-W85-A1-4R (i7-1185GRE)

EMS-TGL-W45-A1-4R (i5-1145GRE)

EMS-TGL-W15-A1-4R (i3-1115GRE)

EMS-TGL-S85-A1-4R (i7-1185G7E)

EMS-TGL-S45-A1-4R (i5-1145G7E)

EMS-TGL-S15-A1-4R (i3-1115G4E)

Qu'est-ce que le EMS-TGL-4COM isolation ?

The EMS-TGL-4COM isolation is a système informatique manufactured by Avalue, designed specifically for modular-computing-system applications. It features réseau of CPU & system temperature monitoring and Voltages monitoring, os of AMI uEFI BIOS 256 Mbit SPI Flash ROM and certification of CE, FCC Class B. The Avalue EMS-TGL-4COM-isolation is a modular industrial computing system equipped with Intel® Tiger Lake processors and 4 isolated COM ports for secure serial communication. Designed for reliability in harsh environments, it features a fanless design and supports wide temperature ranges. This system is ideal for industrial applications that require secure and robust communication capabilities, ensuring stable performance and flexibility.

Caractéristiques et avantages clés

11th Gen. Intel® Core™ i7/i5/i3 BGA Processor
2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
Rich I/O, 4-USB3.1, 2-USB2.0, 1-DP, 1-HDMI, 6-COM (4COM w/2.5KV isolation), 2-LAN, 1-8bit GPIO.
Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE
Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
CE, FCC Class B, IP50
Wide range DC power input from +9~36V
Support HW TPM 2.0

Applications et cas d'usage

Le EMS-TGL-4COM isolation est idéal pour de nombreuses applications d'automatisation industrielle :

Industrial applications that require secure and robust communication capabilities
Dust-sensitive environments and silent operation requirements
DC-powered industrial installations and mobile applications
Extreme temperature environments and outdoor installations
High-performance computing and data processing tasks
Networked industrial systems and data communication
Peripheral device connectivity and data transfer
Memory-intensive applications and multitasking

Questions fréquentes

The EMS-TGL-4COM-isolation features 11th Gen Intel® Tiger Lake processors (Core™ i7/i5/i3), up to 64GB DDR4 memory, and notably 4 COM ports with 2.5KV isolation protection. It offers comprehensive I/O including USB 3.1, DisplayPort, HDMI, GPIO, and dual LAN ports, supports 5G connectivity, operates fanless in wide temperature ranges (-40°C to 70°C for WT model), has IP50 protection, accepts wide voltage input (9-36V), and includes TPM 2.0 security. This makes it ideal for industrial applications requiring protected serial communications in electrically noisy environments while providing high-performance computing capabilities.

The 2.5KV isolation on the 4 COM ports provides crucial electrical protection by creating a barrier that prevents current flow between the connected devices and the computing system. This isolation protects against ground loops, voltage spikes, common-mode noise, and electrical surges that can damage equipment. It's especially important in industrial environments with electrical noise, different ground potentials between equipment, or where lightning strikes and power surges are concerns. With the high-performance Tiger Lake processor, this system offers both robust protection and advanced computing capabilities for demanding industrial applications.

The Tiger Lake architecture enhances the EMS-TGL-4COM-isolation by providing significantly higher processing power (up to 2.8GHz, 12MB cache), advanced Intel Iris Xe graphics with machine learning acceleration, PCIe 4.0 support for faster peripherals, improved memory bandwidth with DDR4-3200, and enhanced security features. These capabilities enable the system to handle demanding workloads like real-time signal processing, complex data analysis, and AI-enhanced monitoring while still providing the isolation protection needed for reliable operation in electrically challenging industrial environments.

Applications benefiting most from this combination include industrial control systems in harsh electrical environments (steel mills, power plants), medical equipment requiring electrical safety and advanced processing, manufacturing systems connecting both modern and legacy equipment, laboratory automation with sensitive instrumentation, process control in chemical plants, critical infrastructure monitoring, transportation systems subject to electrical transients, and any application where both reliable isolated communication and high computational capabilities are required for advanced analytics, machine vision, or complex control algorithms.

A Modular Computing System is an industrial-grade computer designed with modular components that can be interchanged or expanded to customize the system for specific applications. These systems typically feature a base unit with core processing capabilities and standardized interfaces for connecting specialized modules that add functionality such as additional I/O, communication protocols, or industry-specific features. This modularity provides flexibility, scalability, and future-proofing while maintaining the reliability and ruggedness required for industrial environments.

Modular Computing Systems offer several advantages over fixed-configuration computers: customization for specific application requirements, ability to adapt to changing needs without replacing the entire system, simpler upgrades by replacing only specific modules, reduced spare parts inventory, greater longevity as new technologies can be integrated via module updates, streamlined maintenance, and better return on investment through scalability. These benefits make modular systems particularly valuable in industrial environments where requirements evolve and system longevity is important.

An IET (Interface Extension Technology) module is a specialized expansion module used in systems like the EMS series to add specific functionality to the base computing platform. These modules connect to a standardized interface on the main system and provide additional capabilities such as extra COM ports, LAN ports, PoE functionality, or specialized interfaces like CAN bus. IET modules are important because they allow a single base system to be customized for diverse applications by simply changing the module, providing flexibility while maintaining a standardized core platform.

Industries benefiting from modular computing systems include manufacturing (automation control, data collection), transportation (fleet management, railway systems), utilities (substation monitoring, grid control), healthcare (medical equipment integration), retail (point-of-sale, inventory management), building automation (HVAC, access control), defense, aerospace, and smart city infrastructure. Applications requiring customization, future expansion, diverse I/O needs, or adaptation to legacy systems particularly benefit from the flexibility and scalability these systems provide while maintaining industrial-grade reliability.

Wide temperature operation (typically -40°C to 70°C for industrial systems) ensures reliable functioning in non-climate-controlled industrial environments like factory floors, outdoor installations, vehicles, and remote locations. This capability is achieved through careful component selection, thermal design, and elimination of moving parts like fans. Systems with wide temperature ranges can be deployed in harsh conditions without requiring expensive climate control systems, reducing installation and operating costs while improving reliability.

Fanless design means the computer uses passive cooling techniques with heat sinks and thermal engineering instead of active cooling fans. This design is crucial for industrial computers because it eliminates a common point of failure (the fan motor), prevents dust and contaminant ingress that could clog filters and cause overheating, enables sealed enclosures for harsh environments, reduces maintenance requirements, eliminates fan noise, and improves overall system reliability and longevity in challenging industrial conditions with dust, vibration, and temperature fluctuations.

TPM (Trusted Platform Module) 2.0 is a specialized security chip that provides hardware-based encryption capabilities, secure storage for authentication credentials, and system integrity verification. In industrial systems, TPM helps protect sensitive data, secure communication channels, prevent unauthorized access or tampering, and ensure the integrity of control systems. As industrial systems become more connected, TPM provides essential security features to protect against cyber threats targeting critical infrastructure and manufacturing systems.

Vibration and shock resistance are critical for industrial computing systems operating in environments with mechanical disturbances from machinery, vehicles, or handling. Systems are tested to standards like IEC 60068-2-64 (vibration) and IEC 60068-2-27 (shock) to ensure they can withstand these forces without component failure or connection issues. This resilience is achieved through solid-state storage, elimination of moving parts, reinforced component mounting, specialized chassis design, and industrial-grade components, ensuring reliable operation in mechanically challenging environments.

When installing modular computing systems, consider proper thermal management (ensuring adequate airflow around the unit), environmental protection (enclosures appropriate for dust/moisture levels), power quality (stable power source with appropriate voltage and backup options), EMI/RFI isolation (distance from high-interference sources), physical security, accessibility for module swapping and maintenance, proper grounding, cable management (strain relief and protection), and compliance with local regulations and industry standards. Proper planning ensures reliable operation and maximizes the benefits of the system's modular nature.

For fanless modular systems, proper thermal management is crucial: ensure adequate clearance around all sides (typically 5-10cm minimum), avoid enclosing in sealed cabinets without ventilation, mount vertically if possible to enhance natural convection cooling, install away from other heat-generating equipment, consider ambient temperature fluctuations in the installation location, follow manufacturer's mounting recommendations (which often include heat-dissipating brackets), and periodically check for dust accumulation on cooling surfaces. For high-temperature environments, consider additional passive cooling solutions or environmental controls.

For modular computing systems, select a power supply with sufficient wattage for the base system plus all modules (with 20-30% headroom for future expansion), ensure voltage matching the system's input range (typically 9-36V DC for industrial systems), implement surge protection for industrial environments with electrical noise, consider redundant power options for critical applications, use proper wire gauge for current requirements, and potentially include an uninterruptible power supply (UPS) for protection against power outages. The power system should account for the maximum possible configuration with all modules installed.

Best practices for cable management with modular systems include using appropriate cable types for the industrial environment (shielded where necessary), implementing strain relief to prevent connector damage, securing cables to prevent accidental disconnection due to vibration, labeling cables clearly for easier maintenance and troubleshooting, maintaining minimum bend radii to prevent internal damage, using cable trays or conduits for protection, separating power and data cables to minimize interference, allowing sufficient service loops for module replacement without disconnecting cables, and ensuring accessibility for future changes while maintaining a neat installation.

If the system fails to power on, check that the power supply provides the correct voltage within the system's input range (typically 9-36V DC), ensure connections are secure at both the power supply and system, verify any power switches or ignition control settings are correctly configured, check for tripped circuit breakers or blown fuses, inspect for visible damage to power connectors, test with an alternative known-good power supply if available, verify the power LED indicators, and check if the system is in AT mode requiring a specific power signal. For vehicle-mounted systems, ensure the ignition control is properly connected.

For issues with modules or expansion capabilities, verify the module is properly seated and secured, check power cycling the system after confirming connections, ensure any module-specific drivers are installed, check BIOS/UEFI settings for module-related options, inspect for physical damage to connectors, try an alternative slot if available, test with a known-working module to verify slot functionality, check system logs for error messages, and consult module-specific documentation for jumper settings or configuration requirements. After replacing modules, validate that the system recognizes the change through device manager or system information utilities.

For overheating issues, ensure adequate clearance around the system (minimum 5-10cm on all sides), check that the installation position allows for proper convection cooling (typically vertical mounting), clean dust from the chassis and heat sink fins using compressed air (when powered off), verify ambient temperature is within specifications, check system temperature through monitoring utilities or BIOS, ensure any thermal interface materials are properly applied if the system has been serviced, examine CPU usage for processes causing excessive load, and consider adding auxiliary passive cooling or relocating the system to a cooler environment if persistent.

To diagnose communication issues, first identify the specific interface (COM, LAN, USB, etc.) experiencing problems. Check physical connections and cables for damage, verify device driver installation and updates, confirm port configuration settings (baud rate, parity, etc. for serial connections; IP settings for network), try alternative cables or ports to isolate the issue, check for resource conflicts in Device Manager, test with a known-working device, verify any required protocol converters or adapters are functioning, and use diagnostic tools appropriate to the interface type (terminal emulator for serial, ping/traceroute for network) to identify where communication fails.

Points forts

Description du produit

Caractéristiques techniques

Informations système

Processeur

Mémoire système

Chipset E/S

Informations BIOS

Chien de garde (watchdog)

Surveillance de l'état matériel

SBC

Mécanique et environnement

Température de fonctionnement

Température de stockage

Humidité en fonctionnement

Dimensions (larg. x long. x haut.)

Poids

Test de vibrations

Test de chocs

Indice de protection

Kit de montage

Extension

M.2

Stockage

M.2

E/S en face avant

Bouton d'alimentation

Bouton de réinitialisation

Voyant LED

Port COM

E/S numériques

Marche/arrêt par commande filaire

Antenne

E/S en face arrière

USB

Port COM

Port LAN

Audio

Emplacement SIM

Antenne

Entrée CA/CC

E/S côté droit

Antenne

E/S côté gauche

Antenne

Audio

Codec audio

Écran

Chipset graphique

Résolution

Certifications

Informations de certification

Ethernet

Chipset LAN

Spécifications

Alimentation requise

ACPI

Mode d'alimentation

Prise en charge logicielle

OS

Informations de commande

Informations de commande

Qu'est-ce que le EMS-TGL-4COM isolation ?

Caractéristiques et avantages clés

Applications et cas d'usage

Questions fréquentes