← Retour au produit

Fiche technique du produit

14 September 2026

Carte mère industrielle et embarquée · 2.5inch-SBC-Pico-ITX

EPX-EHLP

Série : EPX

Fabriqué parAvalue
EPX-EHLP vue de face

The Avalue EPX-EHLP is a 2.5-inch Pico-ITX Single Board Computer designed for industrial and embedded applications. It integrates Intel® Atom® x6000E and Celeron® processors, supporting up to 32GB DDR4 2666MHz SO-DIMM memory. Key features include dual DisplayPort and LVDS display outputs, dual Intel® 2.5GbE LAN ports, multiple USB ports, serial interfaces, GPIOs, and expansion options through M.2 Key-B and Key-E slots. With a compact form factor of 100mm x 72mm and support for Windows and Linux operating systems, the EPX-EHLP offers a robust solution for space-constrained environments.

Caractéristiques principales

  • Intel® Celeron® & Atom® x6000E series processors with CPU Bottom Mounted
  • 1 x 260-pin DDR4 2666 MHz SO-DIMM Supports Up to 32GB (Only Atom® x6000 Series Processors,Support IBECC) *Note: Due to mainboard design limitation, the mainboard is not recommend to,use DDR4 3200MHz SO-DIMM.
  • 1 x Dual Stack DP, Single Channel 18/24-bits LVDS
  • 2 x Intel® i226LM/IT 2.5G Gigabit Ethernet
  • 4 x USB 2.0 by Pin Header, 1 x Dual Stack USB 3.1 Gen2 at I/O
  • 1 x M.2 (2242/2260) B-Key, 1 x M.2 (2230) E-Key Support Wifi Module
  • 1 x RS232, 1 x RS232/422/485, 4-bit GPIO
  • DC in +12V

Caractéristiques techniques

Informations système

ProcesseurIntel® Celeron® and Atom® x6000E series processors
Mémoire système1 x 260-pin DDR4 2666MHz SO-DIMM socket, supports up to 32GB Max., *Note: Due to mainboard design limitation, the mainboard is not recommend to use DDR4 3200MHz SO-DIMM.
CartePICO ITX
Chipset E/SEC iTE IT5571 or Equivalent
Chien de garde (watchdog)H/W Reset: 1Sec. ~ 65535Sec./Min. and1 Sec. or 1Min./Step
BIOSAMI BIOS, 256Mbit SPI Flash ROM
Surveillance de l'état matérielCPU temperature monitoring, Voltages monitoring, CPU fan speed control

Stockage

Stockage1 x M.2 (Type B)

Écran

Affichage multipleTriple Display
Chipset graphiqueIntel® UHD Graphics
Spéc. et résolution2 x DP (Upper DP, Lower DP++): 4096 x 2160@60 Hz, LVDS: 1366x768 Single Channel 18/24-bits LVDS (Chrontel CH7511B-BF (CH7511B-BFI for Wide Temp Version) eDP to LVDS)
LVDS1CH 18/24bits LVDS 1366x768, Chrontel. CH7511B eDP to LVDS Converter

Extension

Extension1 x M.2 Type B 2242/2260 support SSD. (Default: PCIe) With (1 x PCIe x1 / SATA III + USB3.1 GEN 1 + USB 2.0) as Default or (1 x PCIe x2 + USB 2.0, via OEM BIOS request)

Ethernet

Chipset LAN2 x Intel® i226V (i226IT for wide temp version) 2.5 Gigabit Ethernet
Interface Ethernet2.5 Gigabit Ethernet
Port LAN2 x RJ45

Prise en charge logicielle

OSWindows 10, Linux

Certification

Informations de certificationCE, FCC, RoHS Compliant

E/S

USB2 x USB 3.1 Gen2 at IO, 4 x USB 2.0 by pin header
Port COM1 x RS-232, 1 x RS-232/422/485
DIO1 x 4-bit GPIO
SATA1 x SATA III

Mécanique et environnement

Temp. de fonctionnementStandard Temperature: 0°C ~ 60°C (-4°F ~ 140°F) with 0.5m/s Air Flow, Extend Temperature: -20°C ~ 60°C (-40°F ~ 140°F) with 0.5m/s Air Flow for Wide Temp CPU SKU
Temp. de stockage-40°C ~ 75°C (-40°F ~ 167°F)
Dimensions (long. x larg.)3.94" x 2.83" (100mm x 72mm)
Poids0.66lbs (0.3Kgs)
Humidité en fonctionnement40°C @ 95% Relative Humidity, Non-condensing
Alimentation requiseDC in +12V
Mode d'alimentationAT/ATX (Default Setting: ATX)

Informations de commande

Informations de commandeIntel® Celeron®/Atom™ SoC BGA Processor 2.5 Pico ITX SBC Motherboard, EPX-EHLP-J6412-A1R, EPX-EHLP/J6412/2COM/6USB/2LAN/A1, EPX-EHLP-J6413-A1R, EPX-EHLP/J6413/2COM/6USB/2LAN/A1, EPX-EHLP-X13E-A1R, EPX-EHLP/x6413E/2COM/6USB/2LAN/A1

Distributeur agréé, Inde

TSL Automation Solutions

Mumbai, Inde

Demander un devis

Pour les tarifs, les délais de livraison et les demandes d'approvisionnement en volume, consultez la page produit ou contactez notre équipe commerciale.

© 2026 TSL Automation Solutions. Caractéristiques susceptibles de modification sans préavis. Cette fiche technique a été générée à partir des données techniques fournies par le fabricant.