Avalue · Sistema di elaborazione

EMS-TGL-DVI

Scheda tecnica

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Produttore: Avalue

In evidenza

11th Gen. Intel® Core™ i7/i5/i3 BGA Processor
2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
Rich I/O, 4-USB3.1, 2-USB2.0, 1-DP, 1-HDMI, 1-DVI-D, 2-COM, 2-LAN, 1-8bit GPIO.
Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE
Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
CE, FCC Class B, IP50
Wide range DC power input from +9~36V
Support HW TPM 2.0

Descrizione del prodotto

The Avalue EMS-TGL-DVI is a modular industrial computing system powered by Intel® Tiger Lake processors, equipped with multiple DVI outputs for high-quality digital video. It features a fanless design and wide temperature support, making it ideal for harsh industrial environments.

This system is suitable for applications requiring reliable video output and robust performance, ensuring flexibility and scalability in demanding settings.

Specifiche tecniche

Processore

Intel® Core™ i7-1185GRE Processor (15W, 12M Cache, up to 2.80 GHz), WT

Intel® Core™ i5-1145GRE Processor (15W, 8M Cache, up to 2.60 GHz), WT

Intel® Core™ i3-1115GRE Processor (15W, 6M Cache, up to 3.00 GHz), WT

Intel® Core™ i7-1185G7E Processor (15W, 12M Cache, up to 2.80 GHz), ST

Intel® Core™ i5-1145G7E Processor (15W, 8M Cache, up to 2.60 GHz), ST

Intel® Core™ i3-1115G4E Processor (15W, 6M Cache, up to 3.00 GHz), ST

Memoria di sistema

2 x 260-pin SODIMM socket Max. up to 64GB DDR4 3200 MT/s

Chipset I/O

EC ITE IT8528E

Informazioni BIOS

AMI uEFI BIOS 256 Mbit SPI Flash ROM

Watchdog timer

H/W Reset, 1sec. ~ 65535sec.

Monitoraggio dello stato hardware

CPU & system temperature monitoring and Voltages monitoring

SBC

EBM-TGLS + EBM-CDVS DB-A

Temperatura di esercizio

-40°C ~ 70°C (w/SSD) ambient w/ air flow, WT sku

0°C ~ 70°C (w/SSD) ambient w/ air flow, ST sku

Temperatura di stoccaggio

-30°C ~ 70°C (-22°F ~ 158°F)

Umidità di esercizio

40°C @ 95% Relative Humidity, Non-condensing

Dimensioni (L x P x A)

240mm x 150mm x 69 mm (w/ IET module)

Peso

TBD

Test di vibrazione

With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 1hr/axis

Test di urto

With SSD : 55Grms, IEC 60068-2-27, Half Sine, 11ms

Grado di protezione IP

IP 50

Kit di montaggio

Wall mount kit (standard)

DIN RAIL (optional)

M.2

1 x M.2 Key-B 2242/3042/3052 support SATA3/ PCIeIII x1/ USB3.1 and SIM slot1

1 x M.2 Key-E 2230 for Wi-Fi & BT Module(CNVi)

M.2

1 x M.2 Key-M 2242/2280, support PCIe Gen. III x 4 (NVMe SSD)

1 x M.2 Key-B 2242, support SATA (share with expansion slot)

Pulsante di accensione

1 x Push Button for Power on/off

Pulsante di reset

1 x Push Button for Reset

Indicatore LED

1 x Power LED (Blue)

1 x Storage LED (Yellow)-M.2 B-key SATA

1 x LTE LED (Green)- M.2 B-key PCIe

1 x Wifi LED (Green)- M.2 E key

Porta COM

2 x COM RS232/422/485 (select via BIOS, auto flow control via HW)

I/O digitale

1 x 8-bit GPIO (DB9)

Accensione/spegnimento con comando via cavo

2-Pin Terminal Block

Antenna

2 x Antenna with dust cover

USB

2 x USB 3.1 Gen.2 (10Gbp/s)

2 x USB 3.1 Gen.1 (5Gbp/s)

2 x USB 2.0

Porta LAN

2 x RJ-45

Audio

Mic-In, Line-Out

DP

1 x DP 1.4

HDMI

1 x HDMI 2.0b

DVI

1 x DVI-D

Slot SIM

1 x internal SIM slot

Antenna

2 x Antenna with dust cover

Ingresso AC/DC

3-Pin Terminal Block (V+. V-, GND)

Antenna

2 x Antenna with dust cover

Antenna

2 x Antenna with dust cover

Codec audio

Realtek ALC888S HD codec

Chipset grafico

Intel® Iris® Xe Graphics (i7-1185GRE/i5-1145GRE/i7-1185G7E/i5-1145G7E)

Intel® UHD Graphics for 11th Gen Intel® Processors (i3-1115GRE/i3-1115G4E)

Risoluzione

DP++ 1.4: 4096x2304 @ 60Hz

HDMI 2.0b : Max. resolution 4096x2304 @ 60Hz

DVI-D: Max. resolution 1920x1200@ 60Hz

Informazioni sulle certificazioni

CE, FCC Class B

Chipset LAN

1 x Intel® I225-LM

1 x Intel® I219-LM

Specifiche

1 x 10/100/1000/2.5G Base-Tx GbE compatible

1 x 10/100/1000Base-Tx GbE compatible

Specifiche di ingresso tensione

DC in 12/24V (+9V ~ +36V), wide voltage single power input

TVS component for surge protection

Reverse current/voltage protection(Max. Currency: 13A)

Connettore di ingresso tensione

3-Pin Terminal Block (V+. V-, GND)

ACPI

Single power ATX Support S0,S3, S4, S5

ACPI 5.0 Compliant

Modalità di alimentazione

AT/ATX (ATX is default setting)

OS

Win 10 64bit, Linux

Informazioni per l'ordine

Intel® 11th Tiger Lake Core™ Processor i7/i5/i3 Fanless Rugged Embedded System, w_DVI IET Module

EMS-TGL-W85-A1-7R (i7-1185GRE)

EMS-TGL-W45-A1-7R (i5-1145GRE)

EMS-TGL-W15-A1-7R (i3-1115GRE)

EMS-TGL-S85-A1-7R (i7-1185G7E)

EMS-TGL-S45-A1-7R (i5-1145G7E)

EMS-TGL-S15-A1-7R (i3-1115G4E)

Che cos'è EMS-TGL-DVI?

The EMS-TGL-DVI is a sistema di elaborazione manufactured by Avalue, designed specifically for modular-computing-system applications. It features processore of Intel® Core™ i7-1185GRE Processor (15W, 12M Cache, up to 2.80 GHz), WT, Intel® Core™ i5-1145GRE Processor (…, rete of 2 x RJ-45 and sistema operativo of AMI uEFI BIOS 256 Mbit SPI Flash ROM. The Avalue EMS-TGL-DVI is a modular industrial computing system powered by Intel® Tiger Lake processors, equipped with multiple DVI outputs for high-quality digital video. It features a fanless design and wide temperature support, making it ideal for harsh industrial environments. This system is suitable for applications requiring reliable video output and robust performance, ensuring flexibility and scalability in demanding settings.

Caratteristiche e vantaggi principali

11th Gen. Intel® Core™ i7/i5/i3 BGA Processor
2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
Rich I/O, 4-USB3.1, 2-USB2.0, 1-DP, 1-HDMI, 1-DVI-D, 2-COM, 2-LAN, 1-8bit GPIO.
Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE
Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
CE, FCC Class B, IP50
Wide range DC power input from +9~36V
Support HW TPM 2.0

Applicazioni e casi d'uso

EMS-TGL-DVI è ideale per diverse applicazioni di automazione industriale:

Applications requiring reliable video output and robust performance
Dust-sensitive environments and silent operation requirements
DC-powered industrial installations and mobile applications
Extreme temperature environments and outdoor installations
High-performance computing and data processing tasks
Networked industrial systems and data communication
Peripheral device connectivity and data transfer
Memory-intensive applications and multitasking

Domande frequenti

The EMS-TGL-DVI features 11th Gen Intel® Tiger Lake processors (Core™ i7/i5/i3), up to 64GB DDR4 memory, and notably multiple DVI ports designed for industrial display connectivity. It leverages Intel Iris Xe graphics for reliable visual processing, offers comprehensive I/O including USB 3.1, COM ports, and dual LAN ports, supports 5G connectivity, operates fanless in wide temperature ranges (-40°C to 70°C for WT model), has IP50 protection, accepts wide voltage input (9-36V), and includes TPM 2.0 security. This system is particularly suitable for industrial and legacy display applications requiring reliable DVI connectivity combined with modern computing capabilities.

DVI connectivity remains preferred in many industrial applications due to its proven reliability, widespread adoption in existing equipment, inherent compatibility with industrial displays and KVM systems, support for both digital and analog signals (DVI-I), secure screw-in connectors preventing accidental disconnection in vibration-prone environments, and backward compatibility with legacy VGA displays via simple adapters. The EMS-TGL-DVI meets these requirements while providing the advanced processing capabilities of the Tiger Lake platform, offering an ideal solution for industrial environments with existing DVI infrastructure or specific reliability requirements.

The EMS-TGL-DVI strikes an optimal balance by combining cutting-edge Tiger Lake processing power (high-performance CPU cores, Intel Iris Xe graphics, PCIe 4.0 support, advanced security features) with industrial-focused DVI connectivity. This enables organizations to maintain compatibility with existing display infrastructure while gaining access to advanced computing capabilities for modern applications like AI processing, complex data analytics, virtualization, and sophisticated control systems. This approach protects existing investments in industrial displays while providing a path to implement next-generation industrial computing applications.

Applications benefiting from this combination include industrial control rooms with existing DVI display infrastructure, manufacturing systems requiring high reliability display connections, military and defense systems with strict compatibility requirements, medical equipment requiring proven display technologies, transportation control systems, power generation monitoring, industrial test and measurement equipment, process control in regulated industries, and any application where connecting to established DVI display systems while gaining access to powerful computing capabilities for advanced analytics and control algorithms is critical to operational success.

A Modular Computing System is an industrial-grade computer designed with modular components that can be interchanged or expanded to customize the system for specific applications. These systems typically feature a base unit with core processing capabilities and standardized interfaces for connecting specialized modules that add functionality such as additional I/O, communication protocols, or industry-specific features. This modularity provides flexibility, scalability, and future-proofing while maintaining the reliability and ruggedness required for industrial environments.

Modular Computing Systems offer several advantages over fixed-configuration computers: customization for specific application requirements, ability to adapt to changing needs without replacing the entire system, simpler upgrades by replacing only specific modules, reduced spare parts inventory, greater longevity as new technologies can be integrated via module updates, streamlined maintenance, and better return on investment through scalability. These benefits make modular systems particularly valuable in industrial environments where requirements evolve and system longevity is important.

An IET (Interface Extension Technology) module is a specialized expansion module used in systems like the EMS series to add specific functionality to the base computing platform. These modules connect to a standardized interface on the main system and provide additional capabilities such as extra COM ports, LAN ports, PoE functionality, or specialized interfaces like CAN bus. IET modules are important because they allow a single base system to be customized for diverse applications by simply changing the module, providing flexibility while maintaining a standardized core platform.

Industries benefiting from modular computing systems include manufacturing (automation control, data collection), transportation (fleet management, railway systems), utilities (substation monitoring, grid control), healthcare (medical equipment integration), retail (point-of-sale, inventory management), building automation (HVAC, access control), defense, aerospace, and smart city infrastructure. Applications requiring customization, future expansion, diverse I/O needs, or adaptation to legacy systems particularly benefit from the flexibility and scalability these systems provide while maintaining industrial-grade reliability.

Wide temperature operation (typically -40°C to 70°C for industrial systems) ensures reliable functioning in non-climate-controlled industrial environments like factory floors, outdoor installations, vehicles, and remote locations. This capability is achieved through careful component selection, thermal design, and elimination of moving parts like fans. Systems with wide temperature ranges can be deployed in harsh conditions without requiring expensive climate control systems, reducing installation and operating costs while improving reliability.

Fanless design means the computer uses passive cooling techniques with heat sinks and thermal engineering instead of active cooling fans. This design is crucial for industrial computers because it eliminates a common point of failure (the fan motor), prevents dust and contaminant ingress that could clog filters and cause overheating, enables sealed enclosures for harsh environments, reduces maintenance requirements, eliminates fan noise, and improves overall system reliability and longevity in challenging industrial conditions with dust, vibration, and temperature fluctuations.

TPM (Trusted Platform Module) 2.0 is a specialized security chip that provides hardware-based encryption capabilities, secure storage for authentication credentials, and system integrity verification. In industrial systems, TPM helps protect sensitive data, secure communication channels, prevent unauthorized access or tampering, and ensure the integrity of control systems. As industrial systems become more connected, TPM provides essential security features to protect against cyber threats targeting critical infrastructure and manufacturing systems.

Vibration and shock resistance are critical for industrial computing systems operating in environments with mechanical disturbances from machinery, vehicles, or handling. Systems are tested to standards like IEC 60068-2-64 (vibration) and IEC 60068-2-27 (shock) to ensure they can withstand these forces without component failure or connection issues. This resilience is achieved through solid-state storage, elimination of moving parts, reinforced component mounting, specialized chassis design, and industrial-grade components, ensuring reliable operation in mechanically challenging environments.

When installing modular computing systems, consider proper thermal management (ensuring adequate airflow around the unit), environmental protection (enclosures appropriate for dust/moisture levels), power quality (stable power source with appropriate voltage and backup options), EMI/RFI isolation (distance from high-interference sources), physical security, accessibility for module swapping and maintenance, proper grounding, cable management (strain relief and protection), and compliance with local regulations and industry standards. Proper planning ensures reliable operation and maximizes the benefits of the system's modular nature.

For fanless modular systems, proper thermal management is crucial: ensure adequate clearance around all sides (typically 5-10cm minimum), avoid enclosing in sealed cabinets without ventilation, mount vertically if possible to enhance natural convection cooling, install away from other heat-generating equipment, consider ambient temperature fluctuations in the installation location, follow manufacturer's mounting recommendations (which often include heat-dissipating brackets), and periodically check for dust accumulation on cooling surfaces. For high-temperature environments, consider additional passive cooling solutions or environmental controls.

For modular computing systems, select a power supply with sufficient wattage for the base system plus all modules (with 20-30% headroom for future expansion), ensure voltage matching the system's input range (typically 9-36V DC for industrial systems), implement surge protection for industrial environments with electrical noise, consider redundant power options for critical applications, use proper wire gauge for current requirements, and potentially include an uninterruptible power supply (UPS) for protection against power outages. The power system should account for the maximum possible configuration with all modules installed.

Best practices for cable management with modular systems include using appropriate cable types for the industrial environment (shielded where necessary), implementing strain relief to prevent connector damage, securing cables to prevent accidental disconnection due to vibration, labeling cables clearly for easier maintenance and troubleshooting, maintaining minimum bend radii to prevent internal damage, using cable trays or conduits for protection, separating power and data cables to minimize interference, allowing sufficient service loops for module replacement without disconnecting cables, and ensuring accessibility for future changes while maintaining a neat installation.

If the system fails to power on, check that the power supply provides the correct voltage within the system's input range (typically 9-36V DC), ensure connections are secure at both the power supply and system, verify any power switches or ignition control settings are correctly configured, check for tripped circuit breakers or blown fuses, inspect for visible damage to power connectors, test with an alternative known-good power supply if available, verify the power LED indicators, and check if the system is in AT mode requiring a specific power signal. For vehicle-mounted systems, ensure the ignition control is properly connected.

For issues with modules or expansion capabilities, verify the module is properly seated and secured, check power cycling the system after confirming connections, ensure any module-specific drivers are installed, check BIOS/UEFI settings for module-related options, inspect for physical damage to connectors, try an alternative slot if available, test with a known-working module to verify slot functionality, check system logs for error messages, and consult module-specific documentation for jumper settings or configuration requirements. After replacing modules, validate that the system recognizes the change through device manager or system information utilities.

For overheating issues, ensure adequate clearance around the system (minimum 5-10cm on all sides), check that the installation position allows for proper convection cooling (typically vertical mounting), clean dust from the chassis and heat sink fins using compressed air (when powered off), verify ambient temperature is within specifications, check system temperature through monitoring utilities or BIOS, ensure any thermal interface materials are properly applied if the system has been serviced, examine CPU usage for processes causing excessive load, and consider adding auxiliary passive cooling or relocating the system to a cooler environment if persistent.

To diagnose communication issues, first identify the specific interface (COM, LAN, USB, etc.) experiencing problems. Check physical connections and cables for damage, verify device driver installation and updates, confirm port configuration settings (baud rate, parity, etc. for serial connections; IP settings for network), try alternative cables or ports to isolate the issue, check for resource conflicts in Device Manager, test with a known-working device, verify any required protocol converters or adapters are functioning, and use diagnostic tools appropriate to the interface type (terminal emulator for serial, ping/traceroute for network) to identify where communication fails.

In evidenza

Descrizione del prodotto

Specifiche tecniche

Informazioni di sistema

Processore

Memoria di sistema

Chipset I/O

Informazioni BIOS

Watchdog timer

Monitoraggio dello stato hardware

SBC

Meccanica e ambiente

Temperatura di esercizio

Temperatura di stoccaggio

Umidità di esercizio

Dimensioni (L x P x A)

Peso

Test di vibrazione

Test di urto

Grado di protezione IP

Kit di montaggio

Espansione

M.2

Archiviazione

M.2

I/O frontale

Pulsante di accensione

Pulsante di reset

Indicatore LED

Porta COM

I/O digitale

Accensione/spegnimento con comando via cavo

Antenna

I/O posteriore

USB

Porta LAN

Audio

DP

HDMI

DVI

Slot SIM

Antenna

Ingresso AC/DC

I/O destro

Antenna

I/O sinistro

Antenna

Audio

Codec audio

Display

Chipset grafico

Risoluzione

Certificazioni

Informazioni sulle certificazioni

Ethernet

Chipset LAN

Specifiche

Requisiti di alimentazione

Specifiche di ingresso tensione

Connettore di ingresso tensione

ACPI

Modalità di alimentazione

Supporto software

OS

Informazioni per l'ordine

Informazioni per l'ordine

Che cos'è EMS-TGL-DVI?

Caratteristiche e vantaggi principali

Applicazioni e casi d'uso

Domande frequenti