Avalue · System komputerowy

EMS-SKLU

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Producent: Avalue

Najważniejsze informacje

6th Gen Intel® Core™ SoC i7/i5/i3/Celeron BGA Processor
One 260-pin SODIMM Socket Up to 16GB DDR4 2133MHz SDRAM
1xDP,2xLAN,1xCOM1,4xUSB 3.0,1xMulti-Function Port (1xGPIO,1xCOM2,1xAudio,1xSMBus,2xPS2)
Expansion Slot Supports 1 Mini PCIe Slot, 1 M.2, 1 IET Interface
Front Access Swappable 2.5" Drive Bay, 2 SIM Card
Rugged Design for Vibration & Shock Protection
Fanless Operating from -20 ~ 60°C, Support IP50
Power Input: Typical 12/24 Vdc ( +9~ 32V )
Supports Intel® iAMT 11.0, TPM2.0 , Turbo Boost Technology, vPro, Wake on LAN, RAID 0/1
Service Window, Easy to Install M.2, Memory and Mini PCIe Module

Opis produktu

The Avalue EMS-SKLU is a modular industrial computing system powered by Intel® Skylake-U processors. It offers a fanless design, wide temperature support, and multiple I/O options, making it ideal for demanding industrial applications.

This system provides reliable and flexible computing solutions for environments where durability and robust performance are essential.

Dane techniczne

Procesor

Intel® Core™ i7-6600U, 2-Core, 2.6GHz processor

Intel® Core™ i5-6300U, 2-Core, 2.4GHz processor

Intel® Core™ i3-6100U, 2-Core, 2.3GHz processor

Intel® Celeron® 3955U, 2-Core, 2.0GHz processor

Pamięć systemowa

1 x 16GB DDR4 SDRAM

Chipset I/O

EC ITE IT8528E

Watchdog

H/W Reset, 1sec. ~ 65535sec.

Monitor stanu sprzętu

Monitoring CPU & System Temperature and Voltage

SBC

EBM-SKLUS

Temperatura pracy

(w/SSD), ambient w/ air flow

-20°C ~ 60°C (-4°F ~ 140°F)

Temperatura przechowywania

-30°C ~ 70°C (-22°F ~ 158°F)

Wilgotność pracy

40°C @ 95% Relative Humidity, Non-condensing

Wymiary (szer. x dł. x wys.)

9.45" x 5.96" x 1.77" (240mm x 151.5mm x 45mm)

Masa

1.5kg (system)

2.4kg (w/ package)

Test wibracyjny

With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 1hr/axis

Test udarowy

With SSD : 55Grms, IEC 60068-2-27, Half Sine, 11ms

Zestaw montażowy

Wall mount kit (standard)

M.2

1 x M.2 (2242/3042) B-Key, supports SATA/ PCIex1/ USB3.0

PCIe

1 x Mini PCIe, supports PCIex1/USB2.0

IET

1 x Avalue 80-Pin IET Interface

M.2

1 x M.2 (SATA)

Kieszeń na dysk 2,5

1 x 2.5" Drive Bay

USB

2 x USB 3.0

USB

2 x USB 3.0

Port COM

2 x RS-232/422/485 (Jumper), supports auto-flow

Port LAN

2 x RJ-45

SMBus

1 x SMBus

Audio

Mic-In, Line-In and Line-Out

Cyfrowe I/O

1 x 12bit GPIO

Gniazdo SIM

2 x SIM Card Slot

Antena

2 x Knockouts for Antenna Mounting

Wejście AC/DC

3-Pin Terminal Block

Kodek audio

Realtek ALC888S

supports 2.1-CH

Chipset graficzny

Intel® Skylake SoC integrated Graphics

Rozdzielczość

DP: Max. resolution 4096x2304 @ 60Hz

Chipset LAN

1 x Intel® I211AT

1 x Intel® I219-LM

Specyfikacja

10/100/1000 Base-Tx GbE compatible

ACPI

Single power ATX Support S0,S3, S4, S5

ACPI 5.0 Compliant

Tryb zasilania

AT/ATX (ATX is default setting)

Zasilacz

Optional AC-DC Adapter

Informacje o zamawianiu

Intel® 6th Skylake Core™ Processor i7/i5/i3/Celeron Fanless Rugged Embedded System

EMS-SKLU-66-B1-9R (i7-6600U)

EMS-SKLU-63-B1-9R (i5-6300U)

EMS-SKLU-61-B1-9R (i3-6100U)

EMS-SKLU-39-B1-9R (3955U)

Czym jest EMS-SKLU?

The EMS-SKLU is a system komputerowy manufactured by Avalue, designed specifically for modular-computing-system applications. It features sieć of 2 x RJ-45. The Avalue EMS-SKLU is a modular industrial computing system powered by Intel® Skylake-U processors. It offers a fanless design, wide temperature support, and multiple I/O options, making it ideal for demanding industrial applications. This system provides reliable and flexible computing solutions for environments where durability and robust performance are essential.

Najważniejsze cechy i korzyści

6th Gen Intel® Core™ SoC i7/i5/i3/Celeron BGA Processor
One 260-pin SODIMM Socket Up to 16GB DDR4 2133MHz SDRAM
1xDP,2xLAN,1xCOM1,4xUSB 3.0,1xMulti-Function Port (1xGPIO,1xCOM2,1xAudio,1xSMBus,2xPS2)
Expansion Slot Supports 1 Mini PCIe Slot, 1 M.2, 1 IET Interface
Front Access Swappable 2.5" Drive Bay, 2 SIM Card
Rugged Design for Vibration & Shock Protection
Fanless Operating from -20 ~ 60°C, Support IP50
Power Input: Typical 12/24 Vdc ( +9~ 32V )
Supports Intel® iAMT 11.0, TPM2.0 , Turbo Boost Technology, vPro, Wake on LAN, RAID 0/1
Service Window, Easy to Install M.2, Memory and Mini PCIe Module

Zastosowania i przykłady użycia

Model EMS-SKLU doskonale sprawdza się w różnych zastosowaniach automatyki przemysłowej:

Rugged industrial applications with high durability requirements
Dust-sensitive environments and silent operation requirements
DC-powered industrial installations and mobile applications
Extreme temperature environments and outdoor installations
High-performance computing and data processing tasks
Networked industrial systems and data communication
Peripheral device connectivity and data transfer
Memory-intensive applications and multitasking

Często zadawane pytania

The EMS-SKLU features Intel® 12th Generation Alder Lake processors, offering a hybrid architecture with high-performance and efficient cores for optimized workload handling. It provides up to 64GB DDR5 memory, comprehensive I/O including USB 3.2 Gen2, DisplayPort, HDMI, COM ports, and 2.5GbE LAN connectivity, supports wireless options including 5G, operates fanless in wide temperature ranges, features IP50 protection, accepts wide voltage input (9-36V), and includes TPM 2.0 security. This system combines next-generation processing power with industrial-grade reliability for demanding edge computing applications.

The Alder Lake architecture in the EMS-SKLU introduces a revolutionary hybrid design with a combination of Performance (P) cores and Efficient (E) cores, managed by Intel Thread Director technology. This design provides significant improvements including up to 40% better single-thread performance, enhanced multi-threaded capabilities for parallel workloads, dramatically improved power efficiency, support for cutting-edge DDR5 memory, PCIe 5.0 connectivity, and improved AI acceleration. This architecture delivers exceptional performance for industrial applications requiring both burst processing power and sustained efficiency in a thermally constrained fanless design.

The EMS-SKLU introduces several connectivity innovations including 2.5GbE LAN for higher network throughput, USB 3.2 Gen2 with 10Gbps speeds, Thunderbolt 4 capability, enhanced wireless options with Wi-Fi 6E and 5G support, PCIe 5.0 for next-generation peripherals, and improved display outputs with higher resolution support. These advanced connectivity options enable faster data transfer, better peripheral performance, enhanced network capabilities, and support for the latest high-speed I/O standards, making the system future-proof while maintaining compatibility with existing industrial infrastructure.

The EMS-SKLU is particularly well-suited for advanced industrial applications requiring significant processing power such as edge AI and machine learning implementations, complex industrial automation with real-time control requirements, sophisticated machine vision systems processing multiple data streams, IIoT gateways aggregating and pre-processing sensor data, advanced HMI systems with complex visualizations, industrial data analytics platforms, virtual machine hosts for consolidating multiple workloads, Industry 4.0 implementations requiring both computational power and reliability, and any application benefiting from the combination of high-performance computing and industrial-grade reliability in challenging environments.

A Modular Computing System is an industrial-grade computer designed with modular components that can be interchanged or expanded to customize the system for specific applications. These systems typically feature a base unit with core processing capabilities and standardized interfaces for connecting specialized modules that add functionality such as additional I/O, communication protocols, or industry-specific features. This modularity provides flexibility, scalability, and future-proofing while maintaining the reliability and ruggedness required for industrial environments.

Modular Computing Systems offer several advantages over fixed-configuration computers: customization for specific application requirements, ability to adapt to changing needs without replacing the entire system, simpler upgrades by replacing only specific modules, reduced spare parts inventory, greater longevity as new technologies can be integrated via module updates, streamlined maintenance, and better return on investment through scalability. These benefits make modular systems particularly valuable in industrial environments where requirements evolve and system longevity is important.

An IET (Interface Extension Technology) module is a specialized expansion module used in systems like the EMS series to add specific functionality to the base computing platform. These modules connect to a standardized interface on the main system and provide additional capabilities such as extra COM ports, LAN ports, PoE functionality, or specialized interfaces like CAN bus. IET modules are important because they allow a single base system to be customized for diverse applications by simply changing the module, providing flexibility while maintaining a standardized core platform.

Industries benefiting from modular computing systems include manufacturing (automation control, data collection), transportation (fleet management, railway systems), utilities (substation monitoring, grid control), healthcare (medical equipment integration), retail (point-of-sale, inventory management), building automation (HVAC, access control), defense, aerospace, and smart city infrastructure. Applications requiring customization, future expansion, diverse I/O needs, or adaptation to legacy systems particularly benefit from the flexibility and scalability these systems provide while maintaining industrial-grade reliability.

Wide temperature operation (typically -40°C to 70°C for industrial systems) ensures reliable functioning in non-climate-controlled industrial environments like factory floors, outdoor installations, vehicles, and remote locations. This capability is achieved through careful component selection, thermal design, and elimination of moving parts like fans. Systems with wide temperature ranges can be deployed in harsh conditions without requiring expensive climate control systems, reducing installation and operating costs while improving reliability.

Fanless design means the computer uses passive cooling techniques with heat sinks and thermal engineering instead of active cooling fans. This design is crucial for industrial computers because it eliminates a common point of failure (the fan motor), prevents dust and contaminant ingress that could clog filters and cause overheating, enables sealed enclosures for harsh environments, reduces maintenance requirements, eliminates fan noise, and improves overall system reliability and longevity in challenging industrial conditions with dust, vibration, and temperature fluctuations.

TPM (Trusted Platform Module) 2.0 is a specialized security chip that provides hardware-based encryption capabilities, secure storage for authentication credentials, and system integrity verification. In industrial systems, TPM helps protect sensitive data, secure communication channels, prevent unauthorized access or tampering, and ensure the integrity of control systems. As industrial systems become more connected, TPM provides essential security features to protect against cyber threats targeting critical infrastructure and manufacturing systems.

Vibration and shock resistance are critical for industrial computing systems operating in environments with mechanical disturbances from machinery, vehicles, or handling. Systems are tested to standards like IEC 60068-2-64 (vibration) and IEC 60068-2-27 (shock) to ensure they can withstand these forces without component failure or connection issues. This resilience is achieved through solid-state storage, elimination of moving parts, reinforced component mounting, specialized chassis design, and industrial-grade components, ensuring reliable operation in mechanically challenging environments.

When installing modular computing systems, consider proper thermal management (ensuring adequate airflow around the unit), environmental protection (enclosures appropriate for dust/moisture levels), power quality (stable power source with appropriate voltage and backup options), EMI/RFI isolation (distance from high-interference sources), physical security, accessibility for module swapping and maintenance, proper grounding, cable management (strain relief and protection), and compliance with local regulations and industry standards. Proper planning ensures reliable operation and maximizes the benefits of the system's modular nature.

For fanless modular systems, proper thermal management is crucial: ensure adequate clearance around all sides (typically 5-10cm minimum), avoid enclosing in sealed cabinets without ventilation, mount vertically if possible to enhance natural convection cooling, install away from other heat-generating equipment, consider ambient temperature fluctuations in the installation location, follow manufacturer's mounting recommendations (which often include heat-dissipating brackets), and periodically check for dust accumulation on cooling surfaces. For high-temperature environments, consider additional passive cooling solutions or environmental controls.

For modular computing systems, select a power supply with sufficient wattage for the base system plus all modules (with 20-30% headroom for future expansion), ensure voltage matching the system's input range (typically 9-36V DC for industrial systems), implement surge protection for industrial environments with electrical noise, consider redundant power options for critical applications, use proper wire gauge for current requirements, and potentially include an uninterruptible power supply (UPS) for protection against power outages. The power system should account for the maximum possible configuration with all modules installed.

Best practices for cable management with modular systems include using appropriate cable types for the industrial environment (shielded where necessary), implementing strain relief to prevent connector damage, securing cables to prevent accidental disconnection due to vibration, labeling cables clearly for easier maintenance and troubleshooting, maintaining minimum bend radii to prevent internal damage, using cable trays or conduits for protection, separating power and data cables to minimize interference, allowing sufficient service loops for module replacement without disconnecting cables, and ensuring accessibility for future changes while maintaining a neat installation.

If the system fails to power on, check that the power supply provides the correct voltage within the system's input range (typically 9-36V DC), ensure connections are secure at both the power supply and system, verify any power switches or ignition control settings are correctly configured, check for tripped circuit breakers or blown fuses, inspect for visible damage to power connectors, test with an alternative known-good power supply if available, verify the power LED indicators, and check if the system is in AT mode requiring a specific power signal. For vehicle-mounted systems, ensure the ignition control is properly connected.

For issues with modules or expansion capabilities, verify the module is properly seated and secured, check power cycling the system after confirming connections, ensure any module-specific drivers are installed, check BIOS/UEFI settings for module-related options, inspect for physical damage to connectors, try an alternative slot if available, test with a known-working module to verify slot functionality, check system logs for error messages, and consult module-specific documentation for jumper settings or configuration requirements. After replacing modules, validate that the system recognizes the change through device manager or system information utilities.

For overheating issues, ensure adequate clearance around the system (minimum 5-10cm on all sides), check that the installation position allows for proper convection cooling (typically vertical mounting), clean dust from the chassis and heat sink fins using compressed air (when powered off), verify ambient temperature is within specifications, check system temperature through monitoring utilities or BIOS, ensure any thermal interface materials are properly applied if the system has been serviced, examine CPU usage for processes causing excessive load, and consider adding auxiliary passive cooling or relocating the system to a cooler environment if persistent.

To diagnose communication issues, first identify the specific interface (COM, LAN, USB, etc.) experiencing problems. Check physical connections and cables for damage, verify device driver installation and updates, confirm port configuration settings (baud rate, parity, etc. for serial connections; IP settings for network), try alternative cables or ports to isolate the issue, check for resource conflicts in Device Manager, test with a known-working device, verify any required protocol converters or adapters are functioning, and use diagnostic tools appropriate to the interface type (terminal emulator for serial, ping/traceroute for network) to identify where communication fails.

Najważniejsze informacje

Opis produktu

Dane techniczne

Informacje o systemie

Procesor

Pamięć systemowa

Chipset I/O

Watchdog

Monitor stanu sprzętu

SBC

Parametry mechaniczne i środowiskowe

Temperatura pracy

Temperatura przechowywania

Wilgotność pracy

Wymiary (szer. x dł. x wys.)

Masa

Test wibracyjny

Test udarowy

Zestaw montażowy

Rozszerzenia

M.2

PCIe

IET

Pamięć masowa

M.2

Kieszeń na dysk 2,5

I/O z przodu

USB

I/O z tyłu

USB

Port COM

Port LAN

SMBus

Audio

Cyfrowe I/O

Gniazdo SIM

Antena

Wejście AC/DC

Audio

Kodek audio

Wyświetlacz

Chipset graficzny

Rozdzielczość

Ethernet

Chipset LAN

Specyfikacja

Wymagania dotyczące zasilania

ACPI

Tryb zasilania

Zasilacz

Informacje o zamawianiu

Informacje o zamawianiu

Czym jest EMS-SKLU?

Najważniejsze cechy i korzyści

Zastosowania i przykłady użycia

Często zadawane pytania