Avalue · System komputerowy

VMS-CFS

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Producent: Avalue

Najważniejsze informacje

8th/9th Gen Intel® Core™ i7/i5/i3/Pentium®/Celeron® Processors
Intel® Q370 Express Chipset
Intel® UHD Graphics 630/610
Memory Max. Up to 64GB DDR4 2666
mPCIe,M.2 Key-E, M.2 Key-B Expansion Slots
-25~70/-40C~70C Operating Temperature
9~36Vdc DC Input, with Vehicle Power Management
Support RAID 0/1/5/10, Firmware TPM 2.0, iATM 12.0
CE, FCC, IP50, E Mark, ISO7637-2 Certified

Opis produktu

The Avalue VMS-CFS is a modular computing system designed for vehicular and mobile applications. It features a fanless design, multiple I/O interfaces, and supports a wide temperature range, making it suitable for use in harsh environments.

This system is ideal for applications that require reliable, robust performance, such as fleet management and industrial automation.

Dane techniczne

Procesor

Intel® Core™ i7-8700T Processor (12M Cache, up to 4.00 GHz)

Intel® Core™ i5-8500T Processor (9M Cache, up to 3.50 GHz)

Intel® Core™ i3-8100T Processor (6M Cache, 3.10 GHz)

Intel® Pentium® Gold G5400T Processor (4M Cache, 3.10 GHz)

Intel® Celeron® G4900T Processor (2M Cache, 2.90 GHz)

Intel® Core™ i7-9700TE Processor (12M Cache, up to 3.80 GHz)

Intel® Core™ i5-9500TE Processor (9M Cache, up to 3.60 GHz)

Intel® Core™ i3-9100TE Processor (6M Cache, up to 3.20 GHz)

Platform Controller Hub

Intel® Q370 Express Chipset

Pamięć systemowa

2 x 260-pin DDR4 SODIMM 2400/2666MHz up to 64 GB

Watchdog

H/W Reset, 1sec. ~ 65535min.

Monitor stanu sprzętu

Monitoring CPU & System Temperature and Voltage

RAID

Support RAID 0/1/5/10

iAMT

iATM 12.0

SBC

EBM-CFSV

TPM

TPM 2.0 (Firmware)

Temperatura pracy

-40°C ~ 70C (-40°F ~ 158°F) with 0.5m/s air flow, extended temperature peripherals

Temperatura przechowywania

-30°C ~ 70°C (-22°F ~ 158°F)

Wilgotność pracy

40°C @ 95% Relative Humidity, Non-condensing

Wymiary (szer. x dł. x wys.)

239.4mm x 210mm x 110 mm(w/o wall mount)

Masa

5.4KG (w/packing)

4.5KG (System)

Test wibracyjny

Operating with SSD : MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure

Non-Operating with SSD : MIL-STD-810G, Method 514.6, Category 24, minimum integrity test

Test udarowy

Operating with SSD : MIL-STD-810H, Method 516.8, Procedure I, functional shock=20G

Non-Operating with SSD: MIL-STD-810H, Method 516.8, Procedure V, crash hazard shock test=75G

Zestaw montażowy

Wall mount kit (standard)

M.2

1 x M.2 Key-E 2230 for Wi-Fi & BT Module

2 x M.2 Key-B 2242/3042/2280 w/ push-push SIM slot for SSD/ LTE/ I/O Modules

mPCIe

1 x Full Size Mini PCIe (w/ push-push SIM Slot)

IET

1 x Avalue 80-Pin IET Interface (4 x Gen.3 PCIex1, 3 x USB2.0, 1 x LPC, 1 x Line-Out (R/L), 1 x SMBus)

Rozszerzenia

1 x CANBus module Interface (UART), supports ATBS Module (Factory Option)

M.2

2 x M.2 Key-B SSD (SATA III, Max. up to 2280)

Kieszeń na dysk 2,5

2 x 2.5” Drive Bay (SATA III, Max. up to 12,5mm Height Storage)

Przycisk zasilania

1 x Push Button for Power on/off w/ LED

Przycisk resetu

1 x Push Button for Reset in hiding

Wskaźnik LED

1 x Power LED (Blue)

1 x Storage LED (Yellow)

1 x WLAN LED (Green)

1 x WWAN LED (Green)

USB

2 x USB 3.2 Gen. 1

Cyfrowe I/O

1 x 8bit GPIO, w/1.5KV isolation

Audio

1 x Mic-In

1 x Line-Out

Gniazdo SIM

3 x SIM Card Slot (External Accessible w/Dust Protection Cover)

USB

4 x USB 3.2 Gen.1

Port COM

2 x RS232/422/485, (Jumper + DIP switch), with +5V and +12V support on Pin-9 via Jumper + DIP switch, support auto-flow

1 x RS-232 (COM3), with +5V and +12V support on Pin-9 via Jumper + DIP switch

Port LAN

2 x RJ-45

Magistrala CAN

CANbus modules supports OBDII, SAE J1939/J1708 (Factory Option)

Audio

1 x Mic-In

1 x Line-Out

DP

1 x DP

HDMI

2 x HDMI

LVDS

1 x DB26 LVDS interface with 12V and USB2.0

Antena

5x Antenna Mounting Hole

Wejście AC/DC

3-Pin Terminal Block

Wyjście DC

2-Pin Terminal Block

Chipset

Onboard u-blox NEO-M8N module supports GPS/ Gloness/ QZSS/ Galileo/ Beidou

Kodek audio

Realtek ALC888S

supports 2-CH

Chipset graficzny

Intel® UHD Graphics 630 (i7-8700T, i5-8500T, i3-8100T)

Intel® UHD Graphics 610 (Pentium G5400T, Celeron G4900T)

Rozdzielczość

DP: Max. resolution 4096x2160 @ 60Hz

HDMI: Max. resolution 4096x2160 @ 30Hz

LVDS: Max. resolution 1920x1200 @ 60Hz

Informacje o certyfikacji

CE, FCC Class A, E13 Mark, ISO 7637-2, IP50

Chipset LAN

1 x Intel® I211AT

1 x Intel® I219LM

Specyfikacja

10/100/1000 Base-Tx GbE compatible

Specyfikacja wejścia napięciowego

Typical 12/24Vdc ( +9~ 36Vdc )

Złącze wejścia napięcia

3-Pin Terminal Block

Specyfikacja wyjścia DC

12Vdc/4A

Złącze wyjścia DC

2-Pin Terminal Block

ACPI

Single Power ATX Support S0, S3, S4, S5

ACPI 5.0 Compliant

Tryb zasilania

Vehicle Power Mode (Default Setting)

Industrial PC Power Mode supports AT/ATX

OS

Win10, Linux

Informacje o zamawianiu

Intel® 8th/9th Coffee Lake Rugged Fanless Vehicle Telematics System

With Intel® Q370 Chipset

VMS-CFS-87-B1-1R (i7-8700T)

VMS-CFS-85-B1-1R (i5-8500T)

VMS-CFS-81-B1-1R (i3-8100T)

VMS-CFS-54-B1-1R (Pentium Gold G5400T)

VMS-CFS-49-B1-1R (Celeron G4900T)

VMS-CFS-97-B1-1R (i7-9700TE)

VMS-CFS-95-B1-1R (i5-9500TE)

VMS-CFS-91-B1-1R (i3-9100TE)

Czym jest VMS-CFS?

The VMS-CFS is a system komputerowy manufactured by Avalue, designed specifically for modular-computing-system applications. It features sieć of 1 x Push Button for Power on/off w/ LED and system operacyjny of Win10, Linux. The Avalue VMS-CFS is a modular computing system designed for vehicular and mobile applications. It features a fanless design, multiple I/O interfaces, and supports a wide temperature range, making it suitable for use in harsh environments. This system is ideal for applications that require reliable, robust performance, such as fleet management and industrial automation.

Najważniejsze cechy i korzyści

8th/9th Gen Intel® Core™ i7/i5/i3/Pentium®/Celeron® Processors
Intel® Q370 Express Chipset
Intel® UHD Graphics 630/610
Memory Max. Up to 64GB DDR4 2666
mPCIe,M.2 Key-E, M.2 Key-B Expansion Slots
-25~70/-40C~70C Operating Temperature
9~36Vdc DC Input, with Vehicle Power Management
Support RAID 0/1/5/10, Firmware TPM 2.0, iATM 12.0
CE, FCC, IP50, E Mark, ISO7637-2 Certified

Zastosowania i przykłady użycia

Model VMS-CFS doskonale sprawdza się w różnych zastosowaniach automatyki przemysłowej:

DC-powered industrial installations and mobile applications
Extreme temperature environments and outdoor installations
High-performance computing and data processing tasks
Memory-intensive applications and multitasking
Industrial computing and data processing
Edge computing and IoT applications
Applications that require reliable
Vehicular and mobile applications

Często zadawane pytania

The VMS-CFS (Vehicle-Mounted Computing System - Compact Form Factor Series) is a specialized computing platform designed specifically for vehicular applications, featuring robust construction for extreme vibration/shock resistance, wide temperature operation, protected circuitry for automotive power environments, ignition control for proper power management with vehicle operation, multiple vehicle-focused I/O options, wireless connectivity optimized for mobile applications, and compact dimensions for installation in space-constrained vehicle locations. The system's design focuses on reliable performance in the challenging electrical, thermal, and mechanical environments found in vehicles, making it ideal for fleet management, mobile workforce applications, public transportation, emergency services, and specialized vehicle installations.

The VMS-CFS offers comprehensive vehicle integration capabilities including ignition control for coordinating system operation with vehicle power states, wide voltage input range (typically 9-36V) supporting both 12V and 24V vehicle electrical systems, power conditioning protecting against vehicular power anomalies (load dump, cold crank, reverse polarity), integrated CAN bus interface for vehicle data access, optional OBD-II connectivity, GPS/GNSS integration for location awareness, cellular connectivity for remote management, and power state retention for fast boot during brief power interruptions. These features enable seamless integration with vehicle electrical and data systems while protecting the computing platform from the harsh electrical environment characteristic of vehicular applications.

The VMS-CFS addresses vehicle-mounted operational challenges through specialized design features including reinforced chassis construction withstanding high vibration/shock levels (meeting military standards for vehicle mounting), fanless thermal design eliminating a common failure point while preventing dust ingestion, sealed connectors with retention mechanisms preventing disconnection during vibration, conformal coating on electronics for humidity and condensation protection, wide temperature operation encompassing extreme hot/cold conditions vehicles experience when parked or operating, EMI/RFI hardening preventing interference from vehicle systems, and power protection features guarding against the electrical transients common in vehicle power systems. These features ensure reliable operation despite the harsh conditions encountered in vehicular deployments.

The VMS-CFS is best suited for applications including commercial fleet management systems tracking vehicle performance and driver behavior, public transit information and ticketing systems, emergency services mobile computing platforms, delivery and logistics management systems, mobile point-of-sale for field service organizations, utility and service vehicle computing, construction and mining equipment control systems, specialized vehicle automation (agriculture, warehousing), mobile surveillance and security systems, field data collection platforms, and any application requiring computing capabilities in vehicles operating in challenging environments where consumer or standard industrial computers would fail due to vehicular environmental stresses.

A Modular Computing System is an industrial-grade computer designed with modular components that can be interchanged or expanded to customize the system for specific applications. These systems typically feature a base unit with core processing capabilities and standardized interfaces for connecting specialized modules that add functionality such as additional I/O, communication protocols, or industry-specific features. This modularity provides flexibility, scalability, and future-proofing while maintaining the reliability and ruggedness required for industrial environments.

Modular Computing Systems offer several advantages over fixed-configuration computers: customization for specific application requirements, ability to adapt to changing needs without replacing the entire system, simpler upgrades by replacing only specific modules, reduced spare parts inventory, greater longevity as new technologies can be integrated via module updates, streamlined maintenance, and better return on investment through scalability. These benefits make modular systems particularly valuable in industrial environments where requirements evolve and system longevity is important.

An IET (Interface Extension Technology) module is a specialized expansion module used in systems like the EMS series to add specific functionality to the base computing platform. These modules connect to a standardized interface on the main system and provide additional capabilities such as extra COM ports, LAN ports, PoE functionality, or specialized interfaces like CAN bus. IET modules are important because they allow a single base system to be customized for diverse applications by simply changing the module, providing flexibility while maintaining a standardized core platform.

Industries benefiting from modular computing systems include manufacturing (automation control, data collection), transportation (fleet management, railway systems), utilities (substation monitoring, grid control), healthcare (medical equipment integration), retail (point-of-sale, inventory management), building automation (HVAC, access control), defense, aerospace, and smart city infrastructure. Applications requiring customization, future expansion, diverse I/O needs, or adaptation to legacy systems particularly benefit from the flexibility and scalability these systems provide while maintaining industrial-grade reliability.

Wide temperature operation (typically -40Â°C to 70Â°C for industrial systems) ensures reliable functioning in non-climate-controlled industrial environments like factory floors, outdoor installations, vehicles, and remote locations. This capability is achieved through careful component selection, thermal design, and elimination of moving parts like fans. Systems with wide temperature ranges can be deployed in harsh conditions without requiring expensive climate control systems, reducing installation and operating costs while improving reliability.

Fanless design means the computer uses passive cooling techniques with heat sinks and thermal engineering instead of active cooling fans. This design is crucial for industrial computers because it eliminates a common point of failure (the fan motor), prevents dust and contaminant ingress that could clog filters and cause overheating, enables sealed enclosures for harsh environments, reduces maintenance requirements, eliminates fan noise, and improves overall system reliability and longevity in challenging industrial conditions with dust, vibration, and temperature fluctuations.

TPM (Trusted Platform Module) 2.0 is a specialized security chip that provides hardware-based encryption capabilities, secure storage for authentication credentials, and system integrity verification. In industrial systems, TPM helps protect sensitive data, secure communication channels, prevent unauthorized access or tampering, and ensure the integrity of control systems. As industrial systems become more connected, TPM provides essential security features to protect against cyber threats targeting critical infrastructure and manufacturing systems.

Vibration and shock resistance are critical for industrial computing systems operating in environments with mechanical disturbances from machinery, vehicles, or handling. Systems are tested to standards like IEC 60068-2-64 (vibration) and IEC 60068-2-27 (shock) to ensure they can withstand these forces without component failure or connection issues. This resilience is achieved through solid-state storage, elimination of moving parts, reinforced component mounting, specialized chassis design, and industrial-grade components, ensuring reliable operation in mechanically challenging environments.

When installing modular computing systems, consider proper thermal management (ensuring adequate airflow around the unit), environmental protection (enclosures appropriate for dust/moisture levels), power quality (stable power source with appropriate voltage and backup options), EMI/RFI isolation (distance from high-interference sources), physical security, accessibility for module swapping and maintenance, proper grounding, cable management (strain relief and protection), and compliance with local regulations and industry standards. Proper planning ensures reliable operation and maximizes the benefits of the system's modular nature.

For fanless modular systems, proper thermal management is crucial: ensure adequate clearance around all sides (typically 5-10cm minimum), avoid enclosing in sealed cabinets without ventilation, mount vertically if possible to enhance natural convection cooling, install away from other heat-generating equipment, consider ambient temperature fluctuations in the installation location, follow manufacturer's mounting recommendations (which often include heat-dissipating brackets), and periodically check for dust accumulation on cooling surfaces. For high-temperature environments, consider additional passive cooling solutions or environmental controls.

For modular computing systems, select a power supply with sufficient wattage for the base system plus all modules (with 20-30% headroom for future expansion), ensure voltage matching the system's input range (typically 9-36V DC for industrial systems), implement surge protection for industrial environments with electrical noise, consider redundant power options for critical applications, use proper wire gauge for current requirements, and potentially include an uninterruptible power supply (UPS) for protection against power outages. The power system should account for the maximum possible configuration with all modules installed.

Best practices for cable management with modular systems include using appropriate cable types for the industrial environment (shielded where necessary), implementing strain relief to prevent connector damage, securing cables to prevent accidental disconnection due to vibration, labeling cables clearly for easier maintenance and troubleshooting, maintaining minimum bend radii to prevent internal damage, using cable trays or conduits for protection, separating power and data cables to minimize interference, allowing sufficient service loops for module replacement without disconnecting cables, and ensuring accessibility for future changes while maintaining a neat installation.

If the system fails to power on, check that the power supply provides the correct voltage within the system's input range (typically 9-36V DC), ensure connections are secure at both the power supply and system, verify any power switches or ignition control settings are correctly configured, check for tripped circuit breakers or blown fuses, inspect for visible damage to power connectors, test with an alternative known-good power supply if available, verify the power LED indicators, and check if the system is in AT mode requiring a specific power signal. For vehicle-mounted systems, ensure the ignition control is properly connected.

For issues with modules or expansion capabilities, verify the module is properly seated and secured, check power cycling the system after confirming connections, ensure any module-specific drivers are installed, check BIOS/UEFI settings for module-related options, inspect for physical damage to connectors, try an alternative slot if available, test with a known-working module to verify slot functionality, check system logs for error messages, and consult module-specific documentation for jumper settings or configuration requirements. After replacing modules, validate that the system recognizes the change through device manager or system information utilities.

For overheating issues, ensure adequate clearance around the system (minimum 5-10cm on all sides), check that the installation position allows for proper convection cooling (typically vertical mounting), clean dust from the chassis and heat sink fins using compressed air (when powered off), verify ambient temperature is within specifications, check system temperature through monitoring utilities or BIOS, ensure any thermal interface materials are properly applied if the system has been serviced, examine CPU usage for processes causing excessive load, and consider adding auxiliary passive cooling or relocating the system to a cooler environment if persistent.

To diagnose communication issues, first identify the specific interface (COM, LAN, USB, etc.) experiencing problems. Check physical connections and cables for damage, verify device driver installation and updates, confirm port configuration settings (baud rate, parity, etc. for serial connections; IP settings for network), try alternative cables or ports to isolate the issue, check for resource conflicts in Device Manager, test with a known-working device, verify any required protocol converters or adapters are functioning, and use diagnostic tools appropriate to the interface type (terminal emulator for serial, ping/traceroute for network) to identify where communication fails.

Najważniejsze informacje

Opis produktu

Dane techniczne

Informacje o systemie

Procesor

Platform Controller Hub

Pamięć systemowa

Watchdog

Monitor stanu sprzętu

RAID

iAMT

SBC

TPM

Parametry mechaniczne i środowiskowe

Temperatura pracy

Temperatura przechowywania

Wilgotność pracy

Wymiary (szer. x dł. x wys.)

Masa

Test wibracyjny

Test udarowy

Zestaw montażowy

Rozszerzenia

M.2

mPCIe

IET

Rozszerzenia

Pamięć masowa

M.2

Kieszeń na dysk 2,5

I/O z przodu

Przycisk zasilania

Przycisk resetu

Wskaźnik LED

USB

Cyfrowe I/O

Audio

Gniazdo SIM

I/O z tyłu

USB

Port COM

Port LAN

Magistrala CAN

Audio

DP

HDMI

LVDS

Antena

Wejście AC/DC

Wyjście DC

GPS

Chipset

Audio

Kodek audio

Wyświetlacz

Chipset graficzny

Rozdzielczość

Certyfikaty

Informacje o certyfikacji

Ethernet

Chipset LAN

Specyfikacja

Wymagania dotyczące zasilania

Specyfikacja wejścia napięciowego

Złącze wejścia napięcia

Specyfikacja wyjścia DC

Złącze wyjścia DC

ACPI

Tryb zasilania

Wsparcie programowe

OS

Informacje o zamawianiu

Informacje o zamawianiu

Czym jest VMS-CFS?

Najważniejsze cechy i korzyści

Zastosowania i przykłady użycia

Często zadawane pytania