What are the key features of the ECM-BSWA 3.5-inch SBC?

The Avalue ECM-BSWA features Intel® Pentium®/Celeron® SoC BGA processors, 1x DDR3L 1600MHz SO-DIMM socket supporting up to 8GB, triple display support (HDMI, dual LVDS), dual Gigabit LAN ports, expansion via dual Mini PCIe slots, multiple USB ports, 6 COM ports, and operates with +12V to +24V DC input.

What processor options are available for the ECM-BSWA?

The ECM-BSWA offers Intel® Pentium® and Celeron® processor options from the Braswell family, with the N3160 quad-core being the primary option listed. These processors provide good performance-per-watt ratio for embedded applications requiring a balance of processing capabilities and energy efficiency.

What display capabilities does the ECM-BSWA offer?

The ECM-BSWA supports triple display outputs through one HDMI port (up to 1920x1080@60Hz), two LVDS interfaces (up to 1920x1080@60Hz each), and VGA via pin-header. It features Intel® Integrated Graphics, providing suitable visual performance for industrial HMI applications and multi-display control systems.

What expansion options are available on the ECM-BSWA?

The ECM-BSWA offers expansion through two Mini PCIe slots: one full-size Mini PCIe slot on the solder side with mSATA support, and one half-size Mini PCIe slot. It also includes a SATA III interface for connecting standard storage devices. This configuration provides flexibility for adding storage, wireless capabilities, or other specialized functionality.

Avalue · Przemysłowa i wbudowana płyta główna

ECM-BSWA

Karta katalogowa

*Cena na zapytanie. Prosimy o kontakt w sprawie wyceny.

Producent: Avalue

Najważniejsze informacje

Onboard Intel® Pentium®/Celeron® SoC BGA Processor
One 204-pin DDR3L SO-DIMM Socket Supports Up to 8GB DDR3L 1600 SDRAM
Triple Display (HDMI, LVDS, LVDS)
1 SATA III, 4 USB 3.0, 2 USB 2.0 ,6 COM, 2 x Mini-PCIe, 8-bit GPIO
DC in +12V ~ +24V

Opis produktu

The Avalue ECM-BSWA is a 3.5-inch Single Board Computer designed for industrial and embedded applications. It integrates Intel® Pentium®/Celeron® SoC BGA processors, supporting up to 8GB DDR3L 1600MHz SO-DIMM memory.

Key features include triple display outputs (1 x HDMI, 2 x LVDS), dual Gigabit LAN ports (Intel® I211AT), multiple USB ports (4 x USB 3.0, 2 x USB 2.0), serial interfaces (1 x RS-232/422/485, 5 x RS-232), GPIOs, and expansion options through 2 x Mini PCIe slots (1 full-size with mSATA support, 1 half-size).

With a compact form factor of 146mm x 101mm, wide voltage input range of 12V to 26V DC, and support for Windows 7, Windows 10, and Linux operating systems, the ECM-BSWA offers a robust solution for space-constrained environments.

Dane techniczne

Procesor

Intel® Pentium®/ Celeron® Processor

Pamięć systemowa

1 x 204-Pin DDR3L 1600MHz SO-DIMM Up to 8GB Max.

Chipset I/O

ITE_iT8528VG/FX

Watchdog

H/W Reset: 1Sec. ~ 65535Sec./Min. and1 Sec. or 1Min./Step

BIOS

AMI BIOS, 64Mbit SPI Flash ROM

Monitor stanu sprzętu

Monitoring SYSTEM Temperature, Voltage and FAN Status with Auto Throttling Control

Płyta

3.5"

Pamięć masowa

1 x mSATA supported from Mini PCIe

Wiele wyświetlaczy

Triple Display

Chipset graficzny

Intel® Integrated Graphics

Specyfikacja i rozdzielczość

HDMI: Max resolution 1920 x 1080@60Hz

LVDS: Max resolution 1920 x 1080@60Hz

LVDS + HDMI+ VGA(by Pin-header)

Dual-channel 18/ 24-bit LVDS

LVDS

1 x LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS

Rozszerzenia

2 x Mini PCIe (1 x Full size Mini PCIe on solder side & with mSATA supported,1 x Half-size Mini PCIe)

Kodek audio

Realtek ALC888S HD Audio Decoding Controller

Interfejs audio

Line-in, Mic-in, Line-out

Chipset LAN

2 x Intel® I210AT

Interfejs Ethernet

10/100/1000 Base-Tx GbE compatible

Port LAN

2 x RJ-45

Tryb zasilania

AT/ATX (Default Setting: AT)

OS

Windows 7, Windows 10, Linux

Informacje o certyfikacji

CE, FCC, RoHS Compliant

USB

4 x USB 3.0

2 x USB 2.0

Port COM

5 x RS-232

1 x RS-232/422/485

SATA

1 x SATA III

DIO

1 x 8-bit GPIO

MIO

1 x LPC, 1 x SPI

Temperatura pracy

0°C ~ 60°C (32°F ~ 140°F)

Temp. przechowywania

-40°C ~ 75°C (-40°F ~ 167°F)

Wymiary (dł. x szer.)

5.7" x 4." (146mm x 101mm)

Masa

0.44lb (0.2kg)

Wilgotność pracy

40°C @ 95% Relative Humidity, Non-condensing

Wymagania dotyczące zasilania

DC in +12V ~ +24V

Informacje o zamawianiu

ECM-BSWA-N3160-B2R

3.5 W/N3160/1SATA/ALC888S/I210/B2

Czym jest ECM-BSWA?

The ECM-BSWA is a przemysłowa i wbudowana płyta główna manufactured by Avalue, designed specifically for 3.5inch-sbc applications. It features sieć of 2 x Intel® I210AT and system operacyjny of AMI BIOS, 64Mbit SPI Flash ROM. The Avalue ECM-BSWA is a 3.5-inch Single Board Computer designed for industrial and embedded applications. It integrates Intel® Pentium®/Celeron® SoC BGA processors, supporting up to 8GB DDR3L 1600MHz SO-DIMM memory. Key features include triple display outputs (1 x HDMI, 2 x LVDS), dual Gigabit LAN ports (Intel® I211AT), multiple USB ports (4 x USB 3.0, 2 x USB 2.0), serial interfaces (1 x RS-232/422/485, 5 x RS-232), GPIOs, and expansion options through 2 x Mini PCIe slots (1 full-size with mSATA support, 1 half-size). With a compact form factor of 146mm x 101mm, wide voltage input range of 12V to 26V DC, and support for Windows 7, Windows 10, and Linux operating systems, the ECM-BSWA offers a robust solution for space-constrained environments.

Najważniejsze cechy i korzyści

Onboard Intel® Pentium®/Celeron® SoC BGA Processor
One 204-pin DDR3L SO-DIMM Socket Supports Up to 8GB DDR3L 1600 SDRAM
Triple Display (HDMI, LVDS, LVDS)
1 SATA III, 4 USB 3.0, 2 USB 2.0 ,6 COM, 2 x Mini-PCIe, 8-bit GPIO
DC in +12V ~ +24V

Zastosowania i przykłady użycia

Model ECM-BSWA doskonale sprawdza się w różnych zastosowaniach automatyki przemysłowej:

DC-powered industrial installations and mobile applications
High-performance computing and data processing tasks
Peripheral device connectivity and data transfer
Memory-intensive applications and multitasking
Visual monitoring and data display systems
Custom industrial computing solutions
Industrial and embedded applications
Industrial automation platforms

Często zadawane pytania

The Braswell processors in the ECM-BSWA offer several improvements over the Bay Trail processors in the ECM-BYT: enhanced CPU performance with newer architecture; improved graphic capabilities with better hardware acceleration; support for more efficient memory; lower power consumption; better multimedia performance; and native support for HDMI 1.4. These improvements make the ECM-BSWA better suited for applications requiring improved graphical performance while maintaining low power consumption.

3.5-inch SBCs (Single Board Computers) are compact embedded computers measuring approximately 146mm x 101mm (5.75" x 4"). Their versatile form factor makes them ideal for applications requiring a balance of performance, I/O options, and size constraints, including industrial automation, IoT gateways, edge computing, digital signage, medical devices, transportation systems, robotics, and industrial control systems.

3.5-inch SBCs offer several advantages: a balanced form factor between size and functionality; rich I/O options without requiring expansion cards; better thermal management than smaller boards; good performance-to-size ratio; flexibility with both soldered and socketed CPU options; simplified integration into mid-sized enclosures; good scalability for industrial applications; and long lifecycle support typical of industrial-grade components.

Different Intel processor generations provide varied capabilities: newer generations offer enhanced multi-core performance, AI acceleration, and support for faster memory; mid-range options balance performance and power efficiency for IoT and edge applications; while entry-level processors optimize for low power consumption and extended temperature ranges. The choice involves balancing processing requirements, power constraints, thermal considerations, and specific features needed for the target application.

Key factors include: processing requirements for your workload; memory and storage configurations; specific I/O interface requirements; networking needs; temperature operating range; power constraints; expansion capabilities; long-term availability guarantees; operating system support; ruggedness including shock and vibration resistance; certifications required for your industry; and total cost of ownership including maintenance and support.

Effective cooling strategies include: ensuring adequate airflow (at least 0.5 m/s); using conduction cooling with thermal pads connecting to the enclosure; implementing passive cooling solutions like aluminum enclosures with external fins; maintaining adequate clearance around heat-generating components; arranging components to create a natural convection path; implementing thermal monitoring; and for extreme environments, using specialized cooling techniques like heat pipes or forced air cooling.

Important power considerations include: providing stable DC input within the specified voltage range with proper regulation; understanding AT versus ATX power modes; implementing proper power sequencing; adding surge protection for industrial environments; implementing power filtering to eliminate electrical noise; calculating total power budget including peripherals; planning for power management; using high-quality power connectors; and potentially implementing backup power solutions for critical applications.

Expansion options include: utilizing M.2 or Mini PCIe slots for adding connectivity or storage; leveraging multiple display outputs; using USB expansion for additional peripherals; implementing I2C, SPI, or GPIO-based sensor networks; utilizing multiple Ethernet ports for network segregation; developing custom carrier boards; implementing software-based capabilities through virtualization; and considering network-based resources for functions that cannot be implemented locally.

Common bottlenecks include: thermal limitations (addressed through proper cooling); memory bandwidth constraints (mitigated by using faster memory); storage I/O (improved by using NVMe over PCIe); network congestion (overcome by using optimized networking); USB bus saturation (resolved by distributing devices across controllers); processor limitations in multi-threaded workloads (addressed through workload optimization); and display performance with multiple screens (managed by understanding bandwidth limitations).

Recommended mounting practices include: using the four corner mounting holes with appropriate standoffs; maintaining minimum clearances; ensuring proper thermal contact if using conduction cooling; considering orientation effects on cooling; using vibration-resistant fasteners for applications with vibration; implementing strain relief for cables; avoiding mounting near EMI sources; ensuring accessibility for maintenance; and verifying that the enclosure's thermal design is compatible with the board's cooling requirements.

Best handling practices include: using proper ESD protection; holding the board by its edges; avoiding flexing the PCB; ensuring power is off when connecting components; using appropriate torque for mounting screws; applying thermal compounds correctly; connecting cables with proper orientation; ensuring expansion cards and memory modules are properly seated; avoiding exposure to moisture or contaminants; and following proper packaging procedures for transportation.

Best practices include: using high-quality, shielded cables; implementing strain relief; connecting power supplies before signal cables; using locking connectors where available; avoiding exceeding maximum cable lengths; balancing loads across multiple ports; verifying peripheral power requirements; properly configuring serial port parameters before connecting devices; testing peripherals individually; and labeling all connections for maintenance.

Proper OS setup involves: obtaining manufacturer-recommended OS images; configuring BIOS/UEFI settings appropriately; optimizing partition layouts; installing essential drivers; disabling unnecessary services; configuring appropriate power management settings; implementing a backup strategy; establishing a procedure for OS updates that includes proper testing; and documenting the entire configuration process.

Troubleshooting steps include: verifying power supply voltage and current capability; checking for reverse polarity connection; examining power cables; inspecting for physical damage; testing with a known-good power supply; verifying the correct power mode configuration; checking power switches or jumpers; measuring voltage at test points; inspecting for short circuits; and checking status LEDs for error codes.

Diagnostic steps include: checking cable connections; verifying monitor power and input selection; confirming resolution compatibility; trying alternative display interfaces; updating display drivers; resetting BIOS display settings; testing with a known-working display; checking BIOS settings for primary display selection; verifying multi-display configuration; inspecting system logs; and potentially reinstalling graphics drivers or updating the BIOS.

Common causes include: physical connection problems; driver issues; incorrect IP configuration; firewall or security software blocking communication; conflicting IP addresses; switch or router configuration issues; hardware failure; incorrect gateway or DNS settings; disabled protocols; packet filtering rules; VLAN mismatches; and network congestion. Troubleshooting should include link status verification, ping tests, checking logs, and testing with alternative equipment.

Troubleshooting steps include: verifying proper insertion and securing; checking compatibility with the slot type; confirming BIOS recognition; verifying controller settings; updating BIOS; checking for required drivers; testing in another system if possible; verifying power management settings; checking thermal conditions; and for storage devices, running diagnostic tools to verify device health.

Najważniejsze informacje

Opis produktu

Dane techniczne

Informacje o systemie

Procesor

Pamięć systemowa

Chipset I/O

Watchdog

BIOS

Monitor stanu sprzętu

Płyta

Pamięć masowa

Pamięć masowa

Wyświetlacz

Wiele wyświetlaczy

Chipset graficzny

Specyfikacja i rozdzielczość

LVDS

Rozszerzenia

Rozszerzenia

Audio

Kodek audio

Interfejs audio

Ethernet

Chipset LAN

Interfejs Ethernet

Port LAN

Wymagania dotyczące zasilania

Tryb zasilania

Wsparcie programowe

OS

Certyfikacja

Informacje o certyfikacji

I/O

USB

Port COM

SATA

DIO

MIO

Parametry mechaniczne i środowiskowe

Temperatura pracy

Temp. przechowywania

Wymiary (dł. x szer.)

Masa

Wilgotność pracy

Wymagania dotyczące zasilania

Informacje o zamawianiu

Informacje o zamawianiu

Czym jest ECM-BSWA?

Najważniejsze cechy i korzyści

Zastosowania i przykłady użycia

Często zadawane pytania