What are the key features of the ECM-BSWA 3.5-inch SBC?

The Avalue ECM-BSWA features Intel® Pentium®/Celeron® SoC BGA processors, 1x DDR3L 1600MHz SO-DIMM socket supporting up to 8GB, triple display support (HDMI, dual LVDS), dual Gigabit LAN ports, expansion via dual Mini PCIe slots, multiple USB ports, 6 COM ports, and operates with +12V to +24V DC input.

What processor options are available for the ECM-BSWA?

The ECM-BSWA offers Intel® Pentium® and Celeron® processor options from the Braswell family, with the N3160 quad-core being the primary option listed. These processors provide good performance-per-watt ratio for embedded applications requiring a balance of processing capabilities and energy efficiency.

What display capabilities does the ECM-BSWA offer?

The ECM-BSWA supports triple display outputs through one HDMI port (up to 1920x1080@60Hz), two LVDS interfaces (up to 1920x1080@60Hz each), and VGA via pin-header. It features Intel® Integrated Graphics, providing suitable visual performance for industrial HMI applications and multi-display control systems.

What expansion options are available on the ECM-BSWA?

The ECM-BSWA offers expansion through two Mini PCIe slots: one full-size Mini PCIe slot on the solder side with mSATA support, and one half-size Mini PCIe slot. It also includes a SATA III interface for connecting standard storage devices. This configuration provides flexibility for adding storage, wireless capabilities, or other specialized functionality.

Avalue · Scheda madre industriale ed embedded

ECM-BSWA

Scheda tecnica

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Produttore: Avalue

In evidenza

Onboard Intel® Pentium®/Celeron® SoC BGA Processor
One 204-pin DDR3L SO-DIMM Socket Supports Up to 8GB DDR3L 1600 SDRAM
Triple Display (HDMI, LVDS, LVDS)
1 SATA III, 4 USB 3.0, 2 USB 2.0 ,6 COM, 2 x Mini-PCIe, 8-bit GPIO
DC in +12V ~ +24V

Descrizione del prodotto

The Avalue ECM-BSWA is a 3.5-inch Single Board Computer designed for industrial and embedded applications. It integrates Intel® Pentium®/Celeron® SoC BGA processors, supporting up to 8GB DDR3L 1600MHz SO-DIMM memory.

Key features include triple display outputs (1 x HDMI, 2 x LVDS), dual Gigabit LAN ports (Intel® I211AT), multiple USB ports (4 x USB 3.0, 2 x USB 2.0), serial interfaces (1 x RS-232/422/485, 5 x RS-232), GPIOs, and expansion options through 2 x Mini PCIe slots (1 full-size with mSATA support, 1 half-size).

With a compact form factor of 146mm x 101mm, wide voltage input range of 12V to 26V DC, and support for Windows 7, Windows 10, and Linux operating systems, the ECM-BSWA offers a robust solution for space-constrained environments.

Specifiche tecniche

Processore

Intel® Pentium®/ Celeron® Processor

Memoria di sistema

1 x 204-Pin DDR3L 1600MHz SO-DIMM Up to 8GB Max.

Chipset I/O

ITE_iT8528VG/FX

Watchdog timer

H/W Reset: 1Sec. ~ 65535Sec./Min. and1 Sec. or 1Min./Step

BIOS

AMI BIOS, 64Mbit SPI Flash ROM

Monitoraggio dello stato hardware

Monitoring SYSTEM Temperature, Voltage and FAN Status with Auto Throttling Control

Scheda

3.5"

Archiviazione

1 x mSATA supported from Mini PCIe

Display multipli

Triple Display

Chipset grafico

Intel® Integrated Graphics

Specifiche e risoluzione

HDMI: Max resolution 1920 x 1080@60Hz

LVDS: Max resolution 1920 x 1080@60Hz

LVDS + HDMI+ VGA(by Pin-header)

Dual-channel 18/ 24-bit LVDS

LVDS

1 x LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS

Espansione

2 x Mini PCIe (1 x Full size Mini PCIe on solder side & with mSATA supported,1 x Half-size Mini PCIe)

Codec audio

Realtek ALC888S HD Audio Decoding Controller

Interfaccia audio

Line-in, Mic-in, Line-out

Chipset LAN

2 x Intel® I210AT

Interfaccia Ethernet

10/100/1000 Base-Tx GbE compatible

Porta LAN

2 x RJ-45

Modalità di alimentazione

AT/ATX (Default Setting: AT)

OS

Windows 7, Windows 10, Linux

Informazioni sulle certificazioni

CE, FCC, RoHS Compliant

USB

4 x USB 3.0

2 x USB 2.0

Porta COM

5 x RS-232

1 x RS-232/422/485

SATA

1 x SATA III

DIO

1 x 8-bit GPIO

MIO

1 x LPC, 1 x SPI

Temp. di esercizio

0°C ~ 60°C (32°F ~ 140°F)

Temp. di stoccaggio

-40°C ~ 75°C (-40°F ~ 167°F)

Dimensioni (Lung. x L)

5.7" x 4." (146mm x 101mm)

Peso

0.44lb (0.2kg)

Umidità di esercizio

40°C @ 95% Relative Humidity, Non-condensing

Requisiti di alimentazione

DC in +12V ~ +24V

Informazioni per l'ordine

ECM-BSWA-N3160-B2R

3.5 W/N3160/1SATA/ALC888S/I210/B2

Che cos'è ECM-BSWA?

The ECM-BSWA is a scheda madre industriale ed embedded manufactured by Avalue, designed specifically for 3.5inch-sbc applications. It features processore of Intel® Pentium®/ Celeron® Processor, display of Triple Display and rete of 2 x Intel® I210AT. The Avalue ECM-BSWA is a 3.5-inch Single Board Computer designed for industrial and embedded applications. It integrates Intel® Pentium®/Celeron® SoC BGA processors, supporting up to 8GB DDR3L 1600MHz SO-DIMM memory. Key features include triple display outputs (1 x HDMI, 2 x LVDS), dual Gigabit LAN ports (Intel® I211AT), multiple USB ports (4 x USB 3.0, 2 x USB 2.0), serial interfaces (1 x RS-232/422/485, 5 x RS-232), GPIOs, and expansion options through 2 x Mini PCIe slots (1 full-size with mSATA support, 1 half-size). With a compact form factor of 146mm x 101mm, wide voltage input range of 12V to 26V DC, and support for Windows 7, Windows 10, and Linux operating systems, the ECM-BSWA offers a robust solution for space-constrained environments.

Caratteristiche e vantaggi principali

Onboard Intel® Pentium®/Celeron® SoC BGA Processor
One 204-pin DDR3L SO-DIMM Socket Supports Up to 8GB DDR3L 1600 SDRAM
Triple Display (HDMI, LVDS, LVDS)
1 SATA III, 4 USB 3.0, 2 USB 2.0 ,6 COM, 2 x Mini-PCIe, 8-bit GPIO
DC in +12V ~ +24V

Applicazioni e casi d'uso

ECM-BSWA è ideale per diverse applicazioni di automazione industriale:

DC-powered industrial installations and mobile applications
High-performance computing and data processing tasks
Peripheral device connectivity and data transfer
Memory-intensive applications and multitasking
Visual monitoring and data display systems
Custom industrial computing solutions
Industrial and embedded applications
Industrial automation platforms

Domande frequenti

The Braswell processors in the ECM-BSWA offer several improvements over the Bay Trail processors in the ECM-BYT: enhanced CPU performance with newer architecture; improved graphic capabilities with better hardware acceleration; support for more efficient memory; lower power consumption; better multimedia performance; and native support for HDMI 1.4. These improvements make the ECM-BSWA better suited for applications requiring improved graphical performance while maintaining low power consumption.

3.5-inch SBCs (Single Board Computers) are compact embedded computers measuring approximately 146mm x 101mm (5.75" x 4"). Their versatile form factor makes them ideal for applications requiring a balance of performance, I/O options, and size constraints, including industrial automation, IoT gateways, edge computing, digital signage, medical devices, transportation systems, robotics, and industrial control systems.

3.5-inch SBCs offer several advantages: a balanced form factor between size and functionality; rich I/O options without requiring expansion cards; better thermal management than smaller boards; good performance-to-size ratio; flexibility with both soldered and socketed CPU options; simplified integration into mid-sized enclosures; good scalability for industrial applications; and long lifecycle support typical of industrial-grade components.

Different Intel processor generations provide varied capabilities: newer generations offer enhanced multi-core performance, AI acceleration, and support for faster memory; mid-range options balance performance and power efficiency for IoT and edge applications; while entry-level processors optimize for low power consumption and extended temperature ranges. The choice involves balancing processing requirements, power constraints, thermal considerations, and specific features needed for the target application.

Key factors include: processing requirements for your workload; memory and storage configurations; specific I/O interface requirements; networking needs; temperature operating range; power constraints; expansion capabilities; long-term availability guarantees; operating system support; ruggedness including shock and vibration resistance; certifications required for your industry; and total cost of ownership including maintenance and support.

Effective cooling strategies include: ensuring adequate airflow (at least 0.5 m/s); using conduction cooling with thermal pads connecting to the enclosure; implementing passive cooling solutions like aluminum enclosures with external fins; maintaining adequate clearance around heat-generating components; arranging components to create a natural convection path; implementing thermal monitoring; and for extreme environments, using specialized cooling techniques like heat pipes or forced air cooling.

Important power considerations include: providing stable DC input within the specified voltage range with proper regulation; understanding AT versus ATX power modes; implementing proper power sequencing; adding surge protection for industrial environments; implementing power filtering to eliminate electrical noise; calculating total power budget including peripherals; planning for power management; using high-quality power connectors; and potentially implementing backup power solutions for critical applications.

Expansion options include: utilizing M.2 or Mini PCIe slots for adding connectivity or storage; leveraging multiple display outputs; using USB expansion for additional peripherals; implementing I2C, SPI, or GPIO-based sensor networks; utilizing multiple Ethernet ports for network segregation; developing custom carrier boards; implementing software-based capabilities through virtualization; and considering network-based resources for functions that cannot be implemented locally.

Common bottlenecks include: thermal limitations (addressed through proper cooling); memory bandwidth constraints (mitigated by using faster memory); storage I/O (improved by using NVMe over PCIe); network congestion (overcome by using optimized networking); USB bus saturation (resolved by distributing devices across controllers); processor limitations in multi-threaded workloads (addressed through workload optimization); and display performance with multiple screens (managed by understanding bandwidth limitations).

Recommended mounting practices include: using the four corner mounting holes with appropriate standoffs; maintaining minimum clearances; ensuring proper thermal contact if using conduction cooling; considering orientation effects on cooling; using vibration-resistant fasteners for applications with vibration; implementing strain relief for cables; avoiding mounting near EMI sources; ensuring accessibility for maintenance; and verifying that the enclosure's thermal design is compatible with the board's cooling requirements.

Best handling practices include: using proper ESD protection; holding the board by its edges; avoiding flexing the PCB; ensuring power is off when connecting components; using appropriate torque for mounting screws; applying thermal compounds correctly; connecting cables with proper orientation; ensuring expansion cards and memory modules are properly seated; avoiding exposure to moisture or contaminants; and following proper packaging procedures for transportation.

Best practices include: using high-quality, shielded cables; implementing strain relief; connecting power supplies before signal cables; using locking connectors where available; avoiding exceeding maximum cable lengths; balancing loads across multiple ports; verifying peripheral power requirements; properly configuring serial port parameters before connecting devices; testing peripherals individually; and labeling all connections for maintenance.

Proper OS setup involves: obtaining manufacturer-recommended OS images; configuring BIOS/UEFI settings appropriately; optimizing partition layouts; installing essential drivers; disabling unnecessary services; configuring appropriate power management settings; implementing a backup strategy; establishing a procedure for OS updates that includes proper testing; and documenting the entire configuration process.

Troubleshooting steps include: verifying power supply voltage and current capability; checking for reverse polarity connection; examining power cables; inspecting for physical damage; testing with a known-good power supply; verifying the correct power mode configuration; checking power switches or jumpers; measuring voltage at test points; inspecting for short circuits; and checking status LEDs for error codes.

Diagnostic steps include: checking cable connections; verifying monitor power and input selection; confirming resolution compatibility; trying alternative display interfaces; updating display drivers; resetting BIOS display settings; testing with a known-working display; checking BIOS settings for primary display selection; verifying multi-display configuration; inspecting system logs; and potentially reinstalling graphics drivers or updating the BIOS.

Common causes include: physical connection problems; driver issues; incorrect IP configuration; firewall or security software blocking communication; conflicting IP addresses; switch or router configuration issues; hardware failure; incorrect gateway or DNS settings; disabled protocols; packet filtering rules; VLAN mismatches; and network congestion. Troubleshooting should include link status verification, ping tests, checking logs, and testing with alternative equipment.

Troubleshooting steps include: verifying proper insertion and securing; checking compatibility with the slot type; confirming BIOS recognition; verifying controller settings; updating BIOS; checking for required drivers; testing in another system if possible; verifying power management settings; checking thermal conditions; and for storage devices, running diagnostic tools to verify device health.

In evidenza

Descrizione del prodotto

Specifiche tecniche

Informazioni di sistema

Processore

Memoria di sistema

Chipset I/O

Watchdog timer

BIOS

Monitoraggio dello stato hardware

Scheda

Archiviazione

Archiviazione

Display

Display multipli

Chipset grafico

Specifiche e risoluzione

LVDS

Espansione

Espansione

Audio

Codec audio

Interfaccia audio

Ethernet

Chipset LAN

Interfaccia Ethernet

Porta LAN

Requisiti di alimentazione

Modalità di alimentazione

Supporto software

OS

Certificazione

Informazioni sulle certificazioni

I/O

USB

Porta COM

SATA

DIO

MIO

Meccanica e ambiente

Temp. di esercizio

Temp. di stoccaggio

Dimensioni (Lung. x L)

Peso

Umidità di esercizio

Requisiti di alimentazione

Informazioni per l'ordine

Informazioni per l'ordine

Che cos'è ECM-BSWA?

Caratteristiche e vantaggi principali

Applicazioni e casi d'uso

Domande frequenti