Avalue · Computing System
EMS-MTH
*Price on request. Contact us for a quote.
Manufacturer: Avalue
Highlights
- Intel® Meteor Lake-H Core™ Ultra 7/5 Processor
- 2 x 262-pin SODIMM socket Max. up to 64GB DDR5 5600MT/s
- Rich I/O, 4-USB3.2, 2-USB2.0, 1-DP, 2-HDMI, 2-COM, 2-LAN, 1-8bit GPIO
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen4 x 4
- Fanless operation Temperature from -40°C ~ 50°C
- CE, FCC Class B, IP50
- Wide range DC power input from +9~36V
- Support HW TPM 2.0
Product Description
The Avalue EMS-MTH is a modular industrial computing system designed for flexibility and scalability in various industrial applications. It offers fanless operation, wide temperature support, and versatile connectivity options, making it suitable for demanding environments.
Powered by Intel processors, this system provides reliable performance for automation, transportation, and other industrial tasks requiring robust and adaptable computing solutions.
Technical Specifications
Processor
Meteor Lake-H
Intel® Core™ Ultra 7 Processor
Intel® Core™ Ultra 5 Processor
System Memory
2 x 262-pin SODIMM socket Max. up to 64GB DDR5 5600 MT/s
BIOS Information
AMI uEFI BIOS 256 Mbit SPI Flash ROM
Watchdog Timer
H/W Reset, 1sec. ~ 65535sec.
H/W Status Monitor
CPU & system temperature monitoring and Voltages monitoring
TPM
dTPM 2.0
iAMT
Selected SKUs
SBC
EMS-MTH
Operating Temperature
-40°C ~ 50°C (w/SSD) ambient w/ air flow
Storage Temperature
-30°C ~ 70°C (-22°F ~ 158°F)
Operating Humidity
40°C @ 95% Relative Humidity, Non-condensing
Dimension (W x L x H)
240mm x 150mm x 49 mm (Standard)
240mm x 150mm x 75 mm (w/ IET module)
Weight
2.1 kg (System)
2.9 kg (w_Package)
Vibration Test
With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 0.5hr/axis
Shock Test
With SSD : 55Grms, IEC 60068-2-27, Half Sine, 11ms
IP Rating
IP 50
Mounting Kit
Wall mount kit (standard)
DIN RAIL (optional)
M.2
1 x M.2 Key-B 2242/3042/3052 support SATA3 / PCIe Gen4x1/ USB3.2 Gen2 and SIM slot1 (internal)
1 x M.2 Key-E 2230 for Wi-Fi & BT Module (USB2.0 / PCIe Gen4x1)
IET
1 x IET interface (1 x DDI, 4 x PCIe Gen4x1, 3 x USB2.0, 1 x SMBus, eSPI)
M.2
1 x M.2 Key-M 2280 (1 x PCIe Gen4x4), support NVMe
1 x M.2 Key-B 2242, support SATA (share with expansion slot)
Power Button
1 x Push Button for Power on/off
Reset Button
1 x Push Button for Reset
LED Indicator
1 x Power LED (Blue)
1 x Storage LED (Yellow)
1 x LTE LED (Green)
1 x Wifi LED (Green)
USB
2 x USB 3.0
COM Port
2 x COM RS232/422/485 (select via BIOS, auto flow control via HW)
Digital I/O
1 x 8-bit GPIO (DB9)
SIM Slot
1 x Internal SIM slot
Wire-Control Power On/Off
1 x 2-Pin Terminal Block
Antenna
2 x Antenna with dust cover
USB
4 x USB 3.2 Gen.1 (5Gbp/s)(w/ USB 2.0)
LAN Port
2 x RJ-45
DP
1 x DP++1.4
Audio
Mic-In,Line-Out
HDMI
2 x HDMI 2.0b
Antenna
2 x Knockouts for Antenna Mounting
AC/DC Input
1 x 3-Pin Terminal Block (V+. V-, GND)
Antenna
2 x Antenna with dust cover
Antenna
2 x Antenna with dust cover
Audio Codec
Realtek ALC888S HD codec
Graphic Chipset
Xe LPG Graphics
Resolution
DP++ 1.4: 4096x2304 @ 60Hz
HDMI 2.0b : Max. resolution 4096x2304 @ 60Hz
Certification Information
CE, FCC Class B
LAN Chipset
2 x Intel I226-IT
Specification
2 x 10/100/1000/2.5G GbE compatible
Voltage Input Spec.
DC in typical 12/24V (+9V ~ +36V), wide voltage single power input
TVS component for surge protection
Reverse current/voltage protection(Max. Currency: 13A)
Voltage Input Connector
3-Pin Terminal Block
ACPI
Single power ATX Support S0,S3, S4, S5
ACPI 5.0 Compliant
Power Mode
AT/ATX (ATX is default setting)
OS
Win 10 / Win 11/ Linux
What is EMS-MTH?
The EMS-MTH is a computing system manufactured by Avalue, designed specifically for modular-computing-system applications. The Avalue EMS-MTH is a modular industrial computing system designed for flexibility and scalability in various industrial applications. It offers fanless operation, wide temperature support, and versatile connectivity options, making it suitable for demanding environments. Powered by Intel processors, this system provides reliable performance for automation, transportation, and other industrial tasks requiring robust and adaptable computing solutions.
Key Features & Benefits
- Intel® Meteor Lake-H Core™ Ultra 7/5 Processor
- 2 x 262-pin SODIMM socket Max. up to 64GB DDR5 5600MT/s
- Rich I/O, 4-USB3.2, 2-USB2.0, 1-DP, 2-HDMI, 2-COM, 2-LAN, 1-8bit GPIO
- Support 5G (Sub-6G) module, M.2 NVMe SSD Gen4 x 4
- Fanless operation Temperature from -40°C ~ 50°C
- CE, FCC Class B, IP50
- Wide range DC power input from +9~36V
- Support HW TPM 2.0
Applications & Use Cases
The EMS-MTH is ideal for various industrial automation applications:
- Flexibility and scalability in various industrial applications
- Dust-sensitive environments and silent operation requirements
- DC-powered industrial installations and mobile applications
- Extreme temperature environments and outdoor installations
- High-performance computing and data processing tasks
- Networked industrial systems and data communication
- Peripheral device connectivity and data transfer
- Memory-intensive applications and multitasking
Frequently Asked Questions
The EMS-MTH features high-performance Intel processors with enhanced thermal design for sustained performance in demanding applications, combined with a modular expansion architecture. It offers comprehensive I/O capabilities, multiple expansion options via PCIe, M.2, and custom interfaces, and robust industrial-grade construction with fanless cooling capability. The system operates in wide temperature ranges, has environmental protection ratings suitable for harsh industrial environments, accepts wide voltage input, and includes advanced security features. This high-performance modular platform is designed for computationally intensive industrial applications requiring reliable operation in challenging environments with flexible expansion capabilities.
The EMS-MTH offers substantial computational capabilities with high-performance Intel processors supporting multi-core, multi-threading operation with advanced thermal design that allows sustained high-performance workloads in a compact industrial form factor. The system supports high-bandwidth memory configurations, hardware-accelerated processing for specialized workloads, and sophisticated power management to balance performance and thermal constraints. These capabilities enable the EMS-MTH to handle demanding industrial computing tasks like complex data analysis, machine learning inference, multi-stream video processing, virtualization of multiple workloads, and sophisticated control algorithms that require significant computing power delivered reliably in industrial environments.
The modular expansion architecture of the EMS-MTH provides significant flexibility through PCIe expansion slots, M.2 interfaces, and custom industrial expansion interfaces that can accommodate specialized I/O cards, networking modules, storage systems, graphics accelerators, FPGA modules, and application-specific hardware. This modularity allows the system to be precisely configured for specific industrial requirements, enables phased deployment with future upgrade paths, simplifies maintenance by allowing module replacement without system redesign, and provides pathways to integrate with both legacy industrial interfaces and emerging technologies within a single robust computing platform.
The EMS-MTH is particularly well-suited for applications such as edge AI and machine learning systems requiring local processing of complex algorithms, sophisticated machine vision systems performing real-time inspection and analysis, industrial IoT gateway applications aggregating and processing data from hundreds of sensors, complex industrial control systems managing multiple synchronized processes, manufacturing execution systems running virtualized workloads, industrial simulation and digital twin applications, medical imaging processing, high-resolution multi-display visualization systems, and any industrial application requiring significant computing performance with expansion flexibility in a reliable industrial-grade platform capable of operation in challenging environmental conditions.
A Modular Computing System is an industrial-grade computer designed with modular components that can be interchanged or expanded to customize the system for specific applications. These systems typically feature a base unit with core processing capabilities and standardized interfaces for connecting specialized modules that add functionality such as additional I/O, communication protocols, or industry-specific features. This modularity provides flexibility, scalability, and future-proofing while maintaining the reliability and ruggedness required for industrial environments.
Modular Computing Systems offer several advantages over fixed-configuration computers: customization for specific application requirements, ability to adapt to changing needs without replacing the entire system, simpler upgrades by replacing only specific modules, reduced spare parts inventory, greater longevity as new technologies can be integrated via module updates, streamlined maintenance, and better return on investment through scalability. These benefits make modular systems particularly valuable in industrial environments where requirements evolve and system longevity is important.
An IET (Interface Extension Technology) module is a specialized expansion module used in systems like the EMS series to add specific functionality to the base computing platform. These modules connect to a standardized interface on the main system and provide additional capabilities such as extra COM ports, LAN ports, PoE functionality, or specialized interfaces like CAN bus. IET modules are important because they allow a single base system to be customized for diverse applications by simply changing the module, providing flexibility while maintaining a standardized core platform.
Industries benefiting from modular computing systems include manufacturing (automation control, data collection), transportation (fleet management, railway systems), utilities (substation monitoring, grid control), healthcare (medical equipment integration), retail (point-of-sale, inventory management), building automation (HVAC, access control), defense, aerospace, and smart city infrastructure. Applications requiring customization, future expansion, diverse I/O needs, or adaptation to legacy systems particularly benefit from the flexibility and scalability these systems provide while maintaining industrial-grade reliability.
Wide temperature operation (typically -40°C to 70°C for industrial systems) ensures reliable functioning in non-climate-controlled industrial environments like factory floors, outdoor installations, vehicles, and remote locations. This capability is achieved through careful component selection, thermal design, and elimination of moving parts like fans. Systems with wide temperature ranges can be deployed in harsh conditions without requiring expensive climate control systems, reducing installation and operating costs while improving reliability.
Fanless design means the computer uses passive cooling techniques with heat sinks and thermal engineering instead of active cooling fans. This design is crucial for industrial computers because it eliminates a common point of failure (the fan motor), prevents dust and contaminant ingress that could clog filters and cause overheating, enables sealed enclosures for harsh environments, reduces maintenance requirements, eliminates fan noise, and improves overall system reliability and longevity in challenging industrial conditions with dust, vibration, and temperature fluctuations.
TPM (Trusted Platform Module) 2.0 is a specialized security chip that provides hardware-based encryption capabilities, secure storage for authentication credentials, and system integrity verification. In industrial systems, TPM helps protect sensitive data, secure communication channels, prevent unauthorized access or tampering, and ensure the integrity of control systems. As industrial systems become more connected, TPM provides essential security features to protect against cyber threats targeting critical infrastructure and manufacturing systems.
Vibration and shock resistance are critical for industrial computing systems operating in environments with mechanical disturbances from machinery, vehicles, or handling. Systems are tested to standards like IEC 60068-2-64 (vibration) and IEC 60068-2-27 (shock) to ensure they can withstand these forces without component failure or connection issues. This resilience is achieved through solid-state storage, elimination of moving parts, reinforced component mounting, specialized chassis design, and industrial-grade components, ensuring reliable operation in mechanically challenging environments.
When installing modular computing systems, consider proper thermal management (ensuring adequate airflow around the unit), environmental protection (enclosures appropriate for dust/moisture levels), power quality (stable power source with appropriate voltage and backup options), EMI/RFI isolation (distance from high-interference sources), physical security, accessibility for module swapping and maintenance, proper grounding, cable management (strain relief and protection), and compliance with local regulations and industry standards. Proper planning ensures reliable operation and maximizes the benefits of the system's modular nature.
For fanless modular systems, proper thermal management is crucial: ensure adequate clearance around all sides (typically 5-10cm minimum), avoid enclosing in sealed cabinets without ventilation, mount vertically if possible to enhance natural convection cooling, install away from other heat-generating equipment, consider ambient temperature fluctuations in the installation location, follow manufacturer's mounting recommendations (which often include heat-dissipating brackets), and periodically check for dust accumulation on cooling surfaces. For high-temperature environments, consider additional passive cooling solutions or environmental controls.
For modular computing systems, select a power supply with sufficient wattage for the base system plus all modules (with 20-30% headroom for future expansion), ensure voltage matching the system's input range (typically 9-36V DC for industrial systems), implement surge protection for industrial environments with electrical noise, consider redundant power options for critical applications, use proper wire gauge for current requirements, and potentially include an uninterruptible power supply (UPS) for protection against power outages. The power system should account for the maximum possible configuration with all modules installed.
Best practices for cable management with modular systems include using appropriate cable types for the industrial environment (shielded where necessary), implementing strain relief to prevent connector damage, securing cables to prevent accidental disconnection due to vibration, labeling cables clearly for easier maintenance and troubleshooting, maintaining minimum bend radii to prevent internal damage, using cable trays or conduits for protection, separating power and data cables to minimize interference, allowing sufficient service loops for module replacement without disconnecting cables, and ensuring accessibility for future changes while maintaining a neat installation.
If the system fails to power on, check that the power supply provides the correct voltage within the system's input range (typically 9-36V DC), ensure connections are secure at both the power supply and system, verify any power switches or ignition control settings are correctly configured, check for tripped circuit breakers or blown fuses, inspect for visible damage to power connectors, test with an alternative known-good power supply if available, verify the power LED indicators, and check if the system is in AT mode requiring a specific power signal. For vehicle-mounted systems, ensure the ignition control is properly connected.
For issues with modules or expansion capabilities, verify the module is properly seated and secured, check power cycling the system after confirming connections, ensure any module-specific drivers are installed, check BIOS/UEFI settings for module-related options, inspect for physical damage to connectors, try an alternative slot if available, test with a known-working module to verify slot functionality, check system logs for error messages, and consult module-specific documentation for jumper settings or configuration requirements. After replacing modules, validate that the system recognizes the change through device manager or system information utilities.
For overheating issues, ensure adequate clearance around the system (minimum 5-10cm on all sides), check that the installation position allows for proper convection cooling (typically vertical mounting), clean dust from the chassis and heat sink fins using compressed air (when powered off), verify ambient temperature is within specifications, check system temperature through monitoring utilities or BIOS, ensure any thermal interface materials are properly applied if the system has been serviced, examine CPU usage for processes causing excessive load, and consider adding auxiliary passive cooling or relocating the system to a cooler environment if persistent.
To diagnose communication issues, first identify the specific interface (COM, LAN, USB, etc.) experiencing problems. Check physical connections and cables for damage, verify device driver installation and updates, confirm port configuration settings (baud rate, parity, etc. for serial connections; IP settings for network), try alternative cables or ports to isolate the issue, check for resource conflicts in Device Manager, test with a known-working device, verify any required protocol converters or adapters are functioning, and use diagnostic tools appropriate to the interface type (terminal emulator for serial, ping/traceroute for network) to identify where communication fails.