ECM-ADLS
ECM-ADLS
*Price on request. Contact us for a quote.
Manufacturer: Avalue
- Top Layer Soldered Socket
- Intel® 12th/13th Gen Core™ i9/i7/i5/i3/Pentium®/Celeron® Processor, supports LGA 1700 CPU Up ,to 35W Max; 13th does not support i7, i9 CPU.
- Intel® Q670E/H610E Chipsets
- Single DDR5 4800MHz SO-DIMM Socket, Supports up to 32GB
- Triple Display: 1 x DP++, 1 x HDMI, 1 x 2CH LVDS or 1x eDP (Default LVDS)
- Expansion Slot M.2 Key-E, M.2 Key-M
- Dual 2.5G Gigabit Ethernet
- 2 x RS-232/422/485
- DC in +12V Note: Only Use DC IN 12V for ECM-ADLS, Please Do Not Use Switching Power Supply.
The Avalue ECM-ADLS is a 3.5-inch Single Board Computer designed for industrial and embedded applications. It supports 12th Gen Intel® Core™ i9/i7/i5/i3/Pentium®/Celeron® processors and 13th Gen Intel® Core™ i3 processors (up to 35W TDP) via the LGA 1700 socket. Equipped with Intel® Q670E or H610E chipsets, it supports up to 32GB DDR5 4800MHz SO-DIMM memory. Key features include triple display outputs (DP++, HDMI, LVDS/eDP), dual 2.5GbE LAN ports, multiple USB ports, serial interfaces, GPIOs, and expansion options through M.2 Key-E and Key-M slots. With a compact form factor of 146mm x 101mm and support for Windows and Linux operating systems, the ECM-ADLS offers a robust solution for space-constrained environments.
Processor
Intel® LGA 1700 socket supports 12th/13th Gen Core™ i9/i7/i5/i3/Pentium®/Celeron® Processor Up to 35W Max *13th does not support i7 & i9 CPU
Platform Controller Hub
Intel® Q670E Chipset
Intel® H610E Chipset
System Memory
1 x 262-pin DDR5 4800MHz SO-DIMM socket, support up to 32GB (Non ECC for Chipset Q670E & H610E)
I/O Chipset
EC iTE IT5782VG
Watchdog Timer
H/W Reset, 1sec. ~ 65535sec and 1sec. or 1min./step
BIOS
AMI BIOS, 256Mbit SPI Flash ROM
H/W Status Monitor
CPU & system temperature monitoring Voltages monitoring
TPM
fTPM
Board
3.5"
Storage
1 x M.2 (Key M 2280), support PCI-e x 4 Gen 3 NVMe or SATA device
Multiple Display
Triple Display
Graphic Chipset
Intel® 12th Generation CPU integrated
Spec. & Resolution
1 x DP 1.4b : 4096 x 2304@60 Hz, support DP++
1 x HDMI 2.0 : 4096 x 2304@60 Hz
1 x LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS (Chrontel CH7513A-BF eDP to LVDS)
or 1 x eDP 1920 x 1080@60Hz (2 Lanes), default LVDS
Note: JLVDS1 Support 1 x LVDS or 1 x eDP, share the same connector.
LVDS
1 x LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS (Chrontel CH7513A-BF eDP to LVDS)
Expansion
1 x M.2 Key E 2230, supports Wi-Fi module, supports 2x PCIe x1 Gen 3, USB 2.0
1 x M.2 Key M 2280, supports PCIe x4 Gen3 NVMe or SATA device
Audio Codec
Realtek ALC888S HD Audio Decoding Controller
Audio Interface
Line-in, Mic-in, Line-out
LAN Chipset
2 x Intel® I226LM 2.5 Gigabit Controller
Ethernet Interface
10/100/1000/2.5G Base-Tx GbE compatible
LAN Port
2 x RJ-45
Power Mode
AT/ATX (Default Setting: AT)
OS
Windows 11, Linux
Certification Information
CE, FCC, RoHS Compliant
USB
4 x USB 3.2 Gen2 (Note: H610E USB 3.2 Support 2 x Gen2 & 2 x Gen1)
4 x USB 2.0
COM Port
2 x RS-232/422/485
MIO
1 x eSPI
DIO
1 x 8-bit GPIO
Operating Temp.
0~60°C (32~140°F) with 0.5m/s Air Flow
Storage Temp.
-40°C ~ 75°C (-40°F ~ 167°F)
Dimension (L x W)
5.7" x 4" (146mm x 101mm)
Weight
0.44lbs (0.2kg)
Operating Humidity
40°C @ 95% Relative Humidity, Non-condensing
Power Requirement
DC in +12V
Note: Only use DC IN 12V for ECM-ADLS, please do not use Switching Power Supply.
Ordering Information
ECM-ADLS-Q67-A1R
3.5 Q670E micro module w/CPU socket/A1
ECM-ADLS-H61-A1R
3.5 H610E micro module w/CPU socket/A1
ACC-CPU-G6900TER, Intel Celeron G6900TE 2.4GHz Processor
ACC-CPU-G7400TER, Intel Pentium G7400TE 3.0GHz Processor
ACC-CPU-12100TER, Intel Core I3-12100TE 4.0GHz Processor
ACC-CPU-12500TER, Intel Core I5-12500TE 4.5GHz Processor
ACC-CPU-12700TER, Intel Core I7-12700TE 4.6GHz Processor
ACC-CPU-12900TER, Intel Core I9-12900TE 4.8GHz Processor
ACC-CPU-13100TER, Intel Core I3-13100TE 2.40GHz Processor
ACC-CPU-13500TER, Intel Core I5-13500TE 1.30GHz Processor
Frequently Asked Questions
The Avalue ECM-ADLS features Intel® Alder Lake-S processors with LGA 1700 socket, supporting DDR5 memory, multiple display interfaces, Intel® 2.5Gbps Ethernet connectivity, versatile expansion via M.2 slots, comprehensive I/O including USB and COM ports, industrial-grade reliability features, and a compact 146mm x 101mm form factor. The board is designed for high-performance computing in industrial environments requiring robust processing power.
The ECM-ADLS is optimized for industrial computing with features including industrial temperature range support, wide voltage input capability, resistance to shock and vibration per industrial standards, long product life cycle support, high reliability design with industrial-grade components, fanless operation capability (depending on processor TDP), extensive I/O options for connecting industrial equipment, and certification to industrial standards. These characteristics make it suitable for applications like factory automation, machine vision systems, edge computing, and industrial control systems.
3.5-inch SBCs (Single Board Computers) are compact embedded computers measuring approximately 146mm x 101mm (5.75" x 4"). Their versatile form factor makes them ideal for applications requiring a balance of performance, I/O options, and size constraints, including industrial automation, IoT gateways, edge computing, digital signage, medical devices, transportation systems, robotics, and industrial control systems. These boards offer significant processing capabilities, multiple I/O options, and industrial-grade reliability for demanding environments.
3.5-inch SBCs offer several advantages including: a balanced form factor between size and functionality (smaller than Mini-ITX but with more features than smaller form factors); rich I/O options without requiring expansion cards; better thermal management than smaller boards due to larger surface area; good performance-to-size ratio; flexibility with both soldered and socketed CPU options depending on model; simplified integration into mid-sized enclosures; good scalability for industrial applications; and long lifecycle support typical of industrial-grade components.
Different Intel processor generations provide varied capabilities to 3.5-inch SBCs: newer generations (Meteor Lake, Raptor Lake, Alder Lake) offer hybrid architecture with enhanced multi-core performance, AI acceleration, and support for DDR5 memory; mid-range options (Elkhart Lake) balance performance and power efficiency for IoT and edge applications; while entry-level processors (Atom series) optimize for low power consumption and extended temperature ranges. The choice between processor generations involves balancing processing requirements, power constraints, thermal considerations, and specific features needed (like AI acceleration, TSN support, or extended lifecycle) for the target application.
When selecting a 3.5-inch SBC for industrial applications, consider: processing requirements for your workload; memory and storage configurations; specific I/O interface requirements (COM ports, USB, display outputs); networking needs (number of ports, speed, reliability); temperature operating range for the deployment environment; power constraints; expansion capabilities through M.2 or other slots; long-term availability guarantees; operating system support and driver availability; ruggedness including shock and vibration resistance; certifications required for your industry; and total cost of ownership including maintenance and support.
For cooling 3.5-inch SBCs in enclosed systems: ensure at least 0.5 m/s airflow as specified in thermal requirements; use conduction cooling with thermal pads connecting the processor to the enclosure acting as a heat sink; implement passive cooling solutions like aluminum enclosures with external fins to increase surface area; maintain adequate clearance around heat-generating components; arrange components to create a natural convection path; position the board away from other heat sources; implement thermal monitoring through the hardware monitoring features; and for extreme environments, use specialized cooling techniques like heat pipes or forced air cooling while maintaining the board's environmental ratings.
For 3.5-inch SBCs, power considerations include: providing stable DC input within the specified voltage range (typically 9-36V) with proper regulation and adequate current capacity; understanding the difference between AT and ATX power modes (with AT being the default for most industrial applications); implementing proper power sequencing during boot and shutdown; adding surge protection for industrial environments; considering power filtering to eliminate electrical noise; implementing brownout protection; calculating total power budget including peripherals; planning for power management; using high-quality power connectors; and potentially implementing backup power solutions for critical applications requiring high availability.
To expand 3.5-inch SBC functionality: utilize M.2 slots for adding WiFi/Bluetooth, cellular connectivity, or high-speed storage; leverage multiple display outputs for multi-screen applications; use USB expansion for additional peripherals; implement I2C, SPI, or GPIO-based sensor networks; utilize the multiple Ethernet ports for network segregation or redundancy; develop custom carrier boards for application-specific needs; implement software-based capabilities through virtualization if supported by the processor; utilize COM port expansion if more serial interfaces are needed; and consider network-based resources for functions that cannot be implemented locally.
Common 3.5-inch SBC performance bottlenecks include: thermal limitations (addressed through proper cooling solutions); memory bandwidth constraints (mitigated by utilizing the fastest supported memory, like DDR5); storage I/O (improved by using NVMe over PCIe rather than SATA); network congestion (overcome by using 2.5G interfaces and implementing proper network design); USB bus saturation (resolved by distributing devices across controllers and using USB 3.2 for high-bandwidth devices); processor limitations in multi-threaded workloads (addressed through workload optimization); and display performance with multiple screens (managed by understanding the display bandwidth limitations of each interface).
For mounting 3.5-inch SBCs: use the four corner mounting holes with appropriate standoffs (typically M3); maintain minimum clearances specified in the manual, especially above heat-generating components; ensure proper thermal contact if using conduction cooling; consider orientation effects on natural convection cooling; use vibration-resistant fasteners with thread-locking compound for applications with vibration; implement strain relief for all cables connected to the board; avoid mounting near sources of electro-magnetic interference; ensure accessibility for maintenance if needed; and verify that the enclosure's thermal design is compatible with the board's cooling requirements and airflow specifications.
When handling 3.5-inch SBCs: always use proper ESD protection including wrist straps and ESD mats; hold the board by its edges to avoid touching components or contacts; avoid flexing the PCB during installation; ensure power is off when connecting/disconnecting components; use appropriate torque when securing mounting screws (typically 0.5-0.7 Nm); apply thermal compounds correctly if required for thermal management; connect cables with proper orientation and avoid forcing connectors; ensure all expansion cards and memory modules are properly seated; avoid exposing the board to moisture or contaminants; and follow proper packaging procedures for transportation to prevent physical damage.
When connecting peripherals to 3.5-inch SBCs: use high-quality, properly shielded cables to minimize EMI/RFI; implement strain relief to prevent connector damage; connect power supplies before connecting signal cables; use locking connectors where available for industrial applications; avoid exceeding the maximum cable lengths specified for each interface; balance loads across multiple USB ports rather than concentrating on one port; verify peripheral power requirements against available supply; properly configure serial port parameters (baud rate, parity, etc.) before connecting serial devices; test peripherals individually before connecting multiple devices; and label all connections for easier maintenance.
For OS setup on 3.5-inch SBCs: obtain the manufacturer-recommended OS image or validated distribution for your specific model; configure BIOS/UEFI settings appropriately before installation, paying attention to boot order and storage controller modes; during installation, optimize partition layouts considering available storage; install essential drivers provided by the manufacturer, particularly chipset, network, and display drivers; disable unnecessary services to reduce resource usage; configure appropriate power management settings based on your application needs; implement a backup strategy for the system image; establish a procedure for OS updates that includes proper testing in a non-production environment first; and document the entire configuration process for future reference.
If a 3.5-inch SBC fails to power on: verify power supply voltage is within specified range (typically 9-36V DC) and current capability (typically 3-5A minimum); check for reverse polarity connection which can damage the board; examine power cables for damage or loose connections; inspect the board for physical damage or burnt components; test with a known-good power supply; verify that the board is configured for the correct power mode (AT or ATX as specified in the documentation); check any power switches or jumpers; measure voltage at test points if available; inspect for short circuits or improperly seated components; and check status LEDs for error codes if present.
For display output issues: check cable connections and integrity; verify monitor power and input selection; confirm the monitor supports the resolution being used; try alternative display interfaces if available (switch between DisplayPort, HDMI, or LVDS/eDP); update display drivers; reset BIOS/UEFI display settings to defaults; test with a known-working display; check BIOS settings for primary display selection; verify multi-display configuration is properly set up; inspect system logs for graphics initialization errors; ensure correct display output is enabled in BIOS if multiple are available; try booting in safe mode; and for persistent issues, try reinstalling graphics drivers or updating the BIOS.
Common network issues include: physical connection problems (check cables and connectors); driver-related issues (update or reinstall network drivers); incorrect IP configuration (verify static/DHCP settings); firewall or security software blocking communication; conflicting IP addresses on the network; switch or router configuration issues; network interface hardware failure; incorrect gateway or DNS settings; specific protocol not enabled or configured; packet filtering rules blocking traffic; VLAN configuration mismatches; and network congestion or bandwidth limitations. Systematic troubleshooting should include link status verification, ping tests to various targets, checking system logs, and testing with alternative cables and network equipment.
For M.2 device issues: verify the card is properly inserted and secured; check that the M.2 card type matches the slot (Key-B, Key-E, Key-M, etc.); confirm the BIOS recognizes the device during POST; verify BIOS storage controller settings (NVMe, SATA, or PCIe mode); update BIOS to the latest version that may include improved device compatibility; check for driver requirements for the specific device; test the M.2 device in another system if possible; verify power management settings aren't affecting device operation; check thermal conditions as M.2 devices can throttle or fail under excessive heat; and for storage devices, run diagnostic tools to verify device health.