What are the key features of the ECM-APL2-B 3.5-inch SBC?

The Avalue ECM-APL2-B features the Intel® Celeron® J3455 processor, 1x DDR3L 1600/1333MHz SO-DIMM socket supporting up to 8GB, triple display outputs (2x HDMI, 1x LVDS), dual Gigabit LAN ports, multiple USB ports (4x USB 3.1 Gen1, 2x USB 2.0), 2 COM ports, and operates with +12V to +24V DC input in a compact 146mm x 101mm form factor.

What display capabilities does the ECM-APL2-B offer?

The ECM-APL2-B supports triple display outputs through two HDMI 1.4b ports (up to 3840x2160@30Hz each) and one LVDS interface (up to 1920x1080@60Hz with dual channel 18/24-bits). It features Intel® HD Graphics 500, providing good graphical performance for industrial HMI applications.

What expansion options are available on the ECM-APL2-B?

The ECM-APL2-B offers expansion through dual Mini PCIe slots: one full-size Mini PCIe slot supporting mSATA for storage expansion, and one half-size Mini PCIe slot. It also includes a SATA III interface for connecting standard storage devices.

What are the networking capabilities of the ECM-APL2-B?

The ECM-APL2-B features dual Gigabit Ethernet with two Intel® I210AT controllers, providing 10/100/1000 Base-Tx GbE compatibility through two RJ-45 ports. This configuration offers reliable network connectivity with redundancy options.

What operating systems does the ECM-APL2-B support?

The ECM-APL2-B supports Windows 10 and Linux operating systems, providing flexibility for various industrial and embedded applications.

ECM-APL2-B

*Price on request. Contact us for a quote.

Manufacturer: Avalue

Bottom Layer Soldered
Intel® Pentium®/Celeron®/Atom™ BGA Processor
Intel® HD Graphics 500/505
Single DRAM Socket, Max. Up to 8GB DDR3L 1600&1333MHz
Triple Display: Dual HDMI, LVDS
Dual Mini PCIe Expansion Slot
DC in +12V ~ +24V

Product Description

The Avalue ECM-APL2-B is a 3.5-inch Single Board Computer designed for industrial and embedded applications. It integrates the Intel® Celeron® J3455 processor, supporting up to 8GB DDR3L 1600/1333MHz SO-DIMM memory.

Key features include triple display outputs (2 x HDMI 1.4b, 1 x LVDS), dual Gigabit LAN ports (Intel® I210IT and I211AT), multiple USB ports (4 x USB 3.1 Gen1, 2 x USB 2.0), serial interfaces (1 x RS-232, 1 x RS-232/422/485), GPIOs, and expansion options through dual Mini PCIe slots.

With a compact form factor of 146mm x 101mm, wide voltage input range of 12V to 24V DC, and support for Windows 10 and Linux operating systems, the ECM-APL2-B offers a robust solution for space-constrained environments.

Technical Specifications

System Information

Processor

Intel® Celeron® Processor J3455 (2M Cache, up to 2.30 GHz)

System Memory

1 x 204-Pin DDR3L 1600&1333MHz SO-DIMM Up to 8GB Max.

I/O Chipset

EC iTE IT8528VG

Watchdog Timer

H/W Reset: 1Sec. ~ 65535Sec./Min. and1 Sec. or 1Min./Step

BIOS

AMI BIOS, 128Mbit SPI Flash ROM

H/W Status Monitor

Monitoring System Temperature, Voltage and FAN Status with Auto Throttling Control

Board

3.5"

Storage

1 x mSATA from Mini PCIe

Display

Multiple Display

Triple Display

Graphic Chipset

Intel® HD Graphics

Spec. & Resolution

2 x HDMI (1.4b) : Max. Resolution 3840 x 2160@30Hz

LVDS: Max. Resolution 1920 x 1080@60Hz

LVDS

1 x LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS

Expansion

1 x Full Size Mini PCIe supports mSATA

1 x Half Size Mini PCIe

Audio

Audio Codec

Realtek ALC888S HD Audio Decoding Controller

Audio Interface

Line-in, Mic-in, Line-out

Ethernet

LAN Chipset

2 x Intel® I210AT

Ethernet Interface

10/100/1000 Base-Tx GbE compatible

LAN Port

2 x RJ-45

Power Requirement

Power Mode

AT/ATX (Default Setting: AT)

Software Support

OS

Windows 10, Linux

Certification

Certification Information

CE, FCC, RoHS Compliant

I/O

USB

4 x USB 3.1 (Gen1 5Gbps)

2 x USB 2.0

COM Port

1 x RS-232

1 x RS232 (Default)(JCOM2) or 1 x RS422/485 By GPIO (J422_485)

SATA

1 x SATA III

DIO

1 x 8-bit GPIO

MIO

1 x LPC

1 x SPI

Mechanical & Environmental

Operating Temp.

0°C ~ 60°C (32°F ~ 140°F) for & J Series

Storage Temp.

-40°C ~ 75°C (-40°F ~ 167°F)

Dimension (L x W)

5.7" x 4." (146mm x 101mm)

Weight

0.041lbs (0.03kg)

Operating Humidity

40°C @ 95% Relative Humidity, Non-condensing

Power Requirement

DC +12V ~ +24V

Ordering Information

ECM-APL2-J3455-C4R

3.5 W/F1 J3455/6USB/2COM/2LAN/LVDS/C4

ACC-ECMAPL2-SD-2R

Heat spreader for ECM-APL2 N/J series

What is ECM-APL2-B?

The ECM-APL2-B is a industrial & embedded motherboard manufactured by Avalue, designed specifically for 3.5inch-sbc applications. The Avalue ECM-APL2-B is a 3.5-inch Single Board Computer designed for industrial and embedded applications. It integrates the Intel® Celeron® J3455 processor, supporting up to 8GB DDR3L 1600/1333MHz SO-DIMM memory. Key features include triple display outputs (2 x HDMI 1.4b, 1 x LVDS), dual Gigabit LAN ports (Intel® I210IT and I211AT), multiple USB ports (4 x USB 3.1 Gen1, 2 x USB 2.0), serial interfaces (1 x RS-232, 1 x RS-232/422/485), GPIOs, and expansion options through dual Mini PCIe slots. With a compact form factor of 146mm x 101mm, wide voltage input range of 12V to 24V DC, and support for Windows 10 and Linux operating systems, the ECM-APL2-B offers a robust solution for space-constrained environments.

Key Features & Benefits

Bottom Layer Soldered
Intel® Pentium®/Celeron®/Atom™ BGA Processor
Intel® HD Graphics 500/505
Single DRAM Socket, Max. Up to 8GB DDR3L 1600&1333MHz
Triple Display: Dual HDMI, LVDS
Dual Mini PCIe Expansion Slot
DC in +12V ~ +24V

Applications & Use Cases

The ECM-APL2-B is ideal for various industrial automation applications:

DC-powered industrial installations and mobile applications
High-performance computing and data processing tasks
Memory-intensive applications and multitasking
Visual monitoring and data display systems
Custom industrial computing solutions
Industrial and embedded applications
Industrial automation platforms
Embedded system development

Frequently Asked Questions

3.5-inch SBCs (Single Board Computers) are compact embedded computers measuring approximately 146mm x 101mm (5.75" x 4"). Their versatile form factor makes them ideal for applications requiring a balance of performance, I/O options, and size constraints, including industrial automation, IoT gateways, edge computing, digital signage, medical devices, transportation systems, robotics, and industrial control systems.

3.5-inch SBCs offer several advantages: a balanced form factor between size and functionality; rich I/O options without requiring expansion cards; better thermal management than smaller boards; good performance-to-size ratio; flexibility with both soldered and socketed CPU options; simplified integration into mid-sized enclosures; good scalability for industrial applications; and long lifecycle support typical of industrial-grade components.

Different Intel processor generations provide varied capabilities: newer generations offer enhanced multi-core performance, AI acceleration, and support for faster memory; mid-range options balance performance and power efficiency for IoT and edge applications; while entry-level processors optimize for low power consumption and extended temperature ranges. The choice involves balancing processing requirements, power constraints, thermal considerations, and specific features needed for the target application.

Key factors include: processing requirements for your workload; memory and storage configurations; specific I/O interface requirements; networking needs; temperature operating range; power constraints; expansion capabilities; long-term availability guarantees; operating system support; ruggedness including shock and vibration resistance; certifications required for your industry; and total cost of ownership including maintenance and support.

Effective cooling strategies include: ensuring adequate airflow (at least 0.5 m/s); using conduction cooling with thermal pads connecting to the enclosure; implementing passive cooling solutions like aluminum enclosures with external fins; maintaining adequate clearance around heat-generating components; arranging components to create a natural convection path; implementing thermal monitoring; and for extreme environments, using specialized cooling techniques like heat pipes or forced air cooling.

Important power considerations include: providing stable DC input within the specified voltage range with proper regulation; understanding AT versus ATX power modes; implementing proper power sequencing; adding surge protection for industrial environments; implementing power filtering to eliminate electrical noise; calculating total power budget including peripherals; planning for power management; using high-quality power connectors; and potentially implementing backup power solutions for critical applications.

Expansion options include: utilizing M.2 or Mini PCIe slots for adding connectivity or storage; leveraging multiple display outputs; using USB expansion for additional peripherals; implementing I2C, SPI, or GPIO-based sensor networks; utilizing multiple Ethernet ports for network segregation; developing custom carrier boards; implementing software-based capabilities through virtualization; and considering network-based resources for functions that cannot be implemented locally.

Common bottlenecks include: thermal limitations (addressed through proper cooling); memory bandwidth constraints (mitigated by using faster memory); storage I/O (improved by using NVMe over PCIe); network congestion (overcome by using optimized networking); USB bus saturation (resolved by distributing devices across controllers); processor limitations in multi-threaded workloads (addressed through workload optimization); and display performance with multiple screens (managed by understanding bandwidth limitations).

Recommended mounting practices include: using the four corner mounting holes with appropriate standoffs; maintaining minimum clearances; ensuring proper thermal contact if using conduction cooling; considering orientation effects on cooling; using vibration-resistant fasteners for applications with vibration; implementing strain relief for cables; avoiding mounting near EMI sources; ensuring accessibility for maintenance; and verifying that the enclosure's thermal design is compatible with the board's cooling requirements.

Best handling practices include: using proper ESD protection; holding the board by its edges; avoiding flexing the PCB; ensuring power is off when connecting components; using appropriate torque for mounting screws; applying thermal compounds correctly; connecting cables with proper orientation; ensuring expansion cards and memory modules are properly seated; avoiding exposure to moisture or contaminants; and following proper packaging procedures for transportation.

Best practices include: using high-quality, shielded cables; implementing strain relief; connecting power supplies before signal cables; using locking connectors where available; avoiding exceeding maximum cable lengths; balancing loads across multiple ports; verifying peripheral power requirements; properly configuring serial port parameters before connecting devices; testing peripherals individually; and labeling all connections for maintenance.

Proper OS setup involves: obtaining manufacturer-recommended OS images; configuring BIOS/UEFI settings appropriately; optimizing partition layouts; installing essential drivers; disabling unnecessary services; configuring appropriate power management settings; implementing a backup strategy; establishing a procedure for OS updates that includes proper testing; and documenting the entire configuration process.

Troubleshooting steps include: verifying power supply voltage and current capability; checking for reverse polarity connection; examining power cables; inspecting for physical damage; testing with a known-good power supply; verifying the correct power mode configuration; checking power switches or jumpers; measuring voltage at test points; inspecting for short circuits; and checking status LEDs for error codes.

Diagnostic steps include: checking cable connections; verifying monitor power and input selection; confirming resolution compatibility; trying alternative display interfaces; updating display drivers; resetting BIOS display settings; testing with a known-working display; checking BIOS settings for primary display selection; verifying multi-display configuration; inspecting system logs; and potentially reinstalling graphics drivers or updating the BIOS.

Common causes include: physical connection problems; driver issues; incorrect IP configuration; firewall or security software blocking communication; conflicting IP addresses; switch or router configuration issues; hardware failure; incorrect gateway or DNS settings; disabled protocols; packet filtering rules; VLAN mismatches; and network congestion. Troubleshooting should include link status verification, ping tests, checking logs, and testing with alternative equipment.

Troubleshooting steps include: verifying proper insertion and securing; checking compatibility with the slot type; confirming BIOS recognition; verifying controller settings; updating BIOS; checking for required drivers; testing in another system if possible; verifying power management settings; checking thermal conditions; and for storage devices, running diagnostic tools to verify device health.

Product Features

Product Description

Technical Specifications

System Information

Processor

System Memory

I/O Chipset

Watchdog Timer

BIOS

H/W Status Monitor

Board

Storage

Storage

Display

Multiple Display

Graphic Chipset

Spec. & Resolution

LVDS

Expansion

Expansion

Audio

Audio Codec

Audio Interface

Ethernet

LAN Chipset

Ethernet Interface

LAN Port

Power Requirement

Power Mode

Software Support

OS

Certification

Certification Information

I/O

USB

COM Port

SATA

DIO

MIO

Mechanical & Environmental

Operating Temp.

Storage Temp.

Dimension (L x W)

Weight

Operating Humidity

Power Requirement

Ordering Information

Ordering Information

What is ECM-APL2-B?

Key Features & Benefits

Applications & Use Cases

Frequently Asked Questions