ECM-APL2-B
ECM-APL2-B
*Price on request. Contact us for a quote.
Manufacturer: Avalue
- Bottom Layer Soldered
- Intel® Pentium®/Celeron®/Atom™ BGA Processor
- Intel® HD Graphics 500/505
- Single DRAM Socket, Max. Up to 8GB DDR3L 1600&1333MHz
- Triple Display: Dual HDMI, LVDS
- Dual Mini PCIe Expansion Slot
- DC in +12V ~ +24V
The Avalue ECM-APL2-B is a 3.5-inch Single Board Computer designed for industrial and embedded applications. It integrates the Intel® Celeron® J3455 processor, supporting up to 8GB DDR3L 1600/1333MHz SO-DIMM memory. Key features include triple display outputs (2 x HDMI 1.4b, 1 x LVDS), dual Gigabit LAN ports (Intel® I210IT and I211AT), multiple USB ports (4 x USB 3.1 Gen1, 2 x USB 2.0), serial interfaces (1 x RS-232, 1 x RS-232/422/485), GPIOs, and expansion options through dual Mini PCIe slots. With a compact form factor of 146mm x 101mm, wide voltage input range of 12V to 24V DC, and support for Windows 10 and Linux operating systems, the ECM-APL2-B offers a robust solution for space-constrained environments.
Processor
Intel® Celeron® Processor J3455 (2M Cache, up to 2.30 GHz)
System Memory
1 x 204-Pin DDR3L 1600&1333MHz SO-DIMM Up to 8GB Max.
I/O Chipset
EC iTE IT8528VG
Watchdog Timer
H/W Reset: 1Sec. ~ 65535Sec./Min. and1 Sec. or 1Min./Step
BIOS
AMI BIOS, 128Mbit SPI Flash ROM
H/W Status Monitor
Monitoring System Temperature, Voltage and FAN Status with Auto Throttling Control
Board
3.5"
Storage
1 x mSATA from Mini PCIe
Multiple Display
Triple Display
Graphic Chipset
Intel® HD Graphics
Spec. & Resolution
2 x HDMI (1.4b) : Max. Resolution 3840 x 2160@30Hz
LVDS: Max. Resolution 1920 x 1080@60Hz
LVDS
1 x LVDS: 1920 x 1080 Dual channel 18/24-bits LVDS
Expansion
1 x Full Size Mini PCIe supports mSATA
1 x Half Size Mini PCIe
Audio Codec
Realtek ALC888S HD Audio Decoding Controller
Audio Interface
Line-in, Mic-in, Line-out
LAN Chipset
2 x Intel® I210AT
Ethernet Interface
10/100/1000 Base-Tx GbE compatible
LAN Port
2 x RJ-45
Power Mode
AT/ATX (Default Setting: AT)
OS
Windows 10, Linux
Certification Information
CE, FCC, RoHS Compliant
USB
4 x USB 3.1 (Gen1 5Gbps)
2 x USB 2.0
COM Port
1 x RS-232
1 x RS232 (Default)(JCOM2) or 1 x RS422/485 By GPIO (J422_485)
SATA
1 x SATA III
DIO
1 x 8-bit GPIO
MIO
1 x LPC
1 x SPI
Operating Temp.
0°C ~ 60°C (32°F ~ 140°F) for & J Series
Storage Temp.
-40°C ~ 75°C (-40°F ~ 167°F)
Dimension (L x W)
5.7" x 4." (146mm x 101mm)
Weight
0.041lbs (0.03kg)
Operating Humidity
40°C @ 95% Relative Humidity, Non-condensing
Power Requirement
DC +12V ~ +24V
Ordering Information
ECM-APL2-J3455-C4R
3.5 W/F1 J3455/6USB/2COM/2LAN/LVDS/C4
ACC-ECMAPL2-SD-2R
Heat spreader for ECM-APL2 N/J series
Frequently Asked Questions
The Avalue ECM-APL2-B features the Intel® Celeron® J3455 processor, 1x DDR3L 1600/1333MHz SO-DIMM socket supporting up to 8GB, triple display outputs (2x HDMI, 1x LVDS), dual Gigabit LAN ports, multiple USB ports (4x USB 3.1 Gen1, 2x USB 2.0), 2 COM ports, and operates with +12V to +24V DC input in a compact 146mm x 101mm form factor.
The ECM-APL2-B supports triple display outputs through two HDMI 1.4b ports (up to 3840x2160@30Hz each) and one LVDS interface (up to 1920x1080@60Hz with dual channel 18/24-bits). It features Intel® HD Graphics 500, providing good graphical performance for industrial HMI applications.
The ECM-APL2-B offers expansion through dual Mini PCIe slots: one full-size Mini PCIe slot supporting mSATA for storage expansion, and one half-size Mini PCIe slot. It also includes a SATA III interface for connecting standard storage devices.
The ECM-APL2-B features dual Gigabit Ethernet with two Intel® I210AT controllers, providing 10/100/1000 Base-Tx GbE compatibility through two RJ-45 ports. This configuration offers reliable network connectivity with redundancy options.
The ECM-APL2-B supports Windows 10 and Linux operating systems, providing flexibility for various industrial and embedded applications.
3.5-inch SBCs (Single Board Computers) are compact embedded computers measuring approximately 146mm x 101mm (5.75" x 4"). Their versatile form factor makes them ideal for applications requiring a balance of performance, I/O options, and size constraints, including industrial automation, IoT gateways, edge computing, digital signage, medical devices, transportation systems, robotics, and industrial control systems.
3.5-inch SBCs offer several advantages: a balanced form factor between size and functionality; rich I/O options without requiring expansion cards; better thermal management than smaller boards; good performance-to-size ratio; flexibility with both soldered and socketed CPU options; simplified integration into mid-sized enclosures; good scalability for industrial applications; and long lifecycle support typical of industrial-grade components.
Different Intel processor generations provide varied capabilities: newer generations offer enhanced multi-core performance, AI acceleration, and support for faster memory; mid-range options balance performance and power efficiency for IoT and edge applications; while entry-level processors optimize for low power consumption and extended temperature ranges. The choice involves balancing processing requirements, power constraints, thermal considerations, and specific features needed for the target application.
Key factors include: processing requirements for your workload; memory and storage configurations; specific I/O interface requirements; networking needs; temperature operating range; power constraints; expansion capabilities; long-term availability guarantees; operating system support; ruggedness including shock and vibration resistance; certifications required for your industry; and total cost of ownership including maintenance and support.
Effective cooling strategies include: ensuring adequate airflow (at least 0.5 m/s); using conduction cooling with thermal pads connecting to the enclosure; implementing passive cooling solutions like aluminum enclosures with external fins; maintaining adequate clearance around heat-generating components; arranging components to create a natural convection path; implementing thermal monitoring; and for extreme environments, using specialized cooling techniques like heat pipes or forced air cooling.
Important power considerations include: providing stable DC input within the specified voltage range with proper regulation; understanding AT versus ATX power modes; implementing proper power sequencing; adding surge protection for industrial environments; implementing power filtering to eliminate electrical noise; calculating total power budget including peripherals; planning for power management; using high-quality power connectors; and potentially implementing backup power solutions for critical applications.
Expansion options include: utilizing M.2 or Mini PCIe slots for adding connectivity or storage; leveraging multiple display outputs; using USB expansion for additional peripherals; implementing I2C, SPI, or GPIO-based sensor networks; utilizing multiple Ethernet ports for network segregation; developing custom carrier boards; implementing software-based capabilities through virtualization; and considering network-based resources for functions that cannot be implemented locally.
Common bottlenecks include: thermal limitations (addressed through proper cooling); memory bandwidth constraints (mitigated by using faster memory); storage I/O (improved by using NVMe over PCIe); network congestion (overcome by using optimized networking); USB bus saturation (resolved by distributing devices across controllers); processor limitations in multi-threaded workloads (addressed through workload optimization); and display performance with multiple screens (managed by understanding bandwidth limitations).
Recommended mounting practices include: using the four corner mounting holes with appropriate standoffs; maintaining minimum clearances; ensuring proper thermal contact if using conduction cooling; considering orientation effects on cooling; using vibration-resistant fasteners for applications with vibration; implementing strain relief for cables; avoiding mounting near EMI sources; ensuring accessibility for maintenance; and verifying that the enclosure's thermal design is compatible with the board's cooling requirements.
Best handling practices include: using proper ESD protection; holding the board by its edges; avoiding flexing the PCB; ensuring power is off when connecting components; using appropriate torque for mounting screws; applying thermal compounds correctly; connecting cables with proper orientation; ensuring expansion cards and memory modules are properly seated; avoiding exposure to moisture or contaminants; and following proper packaging procedures for transportation.
Best practices include: using high-quality, shielded cables; implementing strain relief; connecting power supplies before signal cables; using locking connectors where available; avoiding exceeding maximum cable lengths; balancing loads across multiple ports; verifying peripheral power requirements; properly configuring serial port parameters before connecting devices; testing peripherals individually; and labeling all connections for maintenance.
Proper OS setup involves: obtaining manufacturer-recommended OS images; configuring BIOS/UEFI settings appropriately; optimizing partition layouts; installing essential drivers; disabling unnecessary services; configuring appropriate power management settings; implementing a backup strategy; establishing a procedure for OS updates that includes proper testing; and documenting the entire configuration process.
Troubleshooting steps include: verifying power supply voltage and current capability; checking for reverse polarity connection; examining power cables; inspecting for physical damage; testing with a known-good power supply; verifying the correct power mode configuration; checking power switches or jumpers; measuring voltage at test points; inspecting for short circuits; and checking status LEDs for error codes.
Diagnostic steps include: checking cable connections; verifying monitor power and input selection; confirming resolution compatibility; trying alternative display interfaces; updating display drivers; resetting BIOS display settings; testing with a known-working display; checking BIOS settings for primary display selection; verifying multi-display configuration; inspecting system logs; and potentially reinstalling graphics drivers or updating the BIOS.
Common causes include: physical connection problems; driver issues; incorrect IP configuration; firewall or security software blocking communication; conflicting IP addresses; switch or router configuration issues; hardware failure; incorrect gateway or DNS settings; disabled protocols; packet filtering rules; VLAN mismatches; and network congestion. Troubleshooting should include link status verification, ping tests, checking logs, and testing with alternative equipment.
Troubleshooting steps include: verifying proper insertion and securing; checking compatibility with the slot type; confirming BIOS recognition; verifying controller settings; updating BIOS; checking for required drivers; testing in another system if possible; verifying power management settings; checking thermal conditions; and for storage devices, running diagnostic tools to verify device health.