What are the key features of the ACP-IMX6POS ARM-based SBC?

The ACP-IMX6POS features an NXP i.MX6 Dual Lite or Quad-Core 1GHz processor, 1GB DDR3 (Dual Lite) or 2GB DDR3 (Quad Core) memory, 4GB eMMC storage, multiple display configurations (VGA + HDMI, LVDS + HDMI, or VGA + LVDS), Wolfson WM8962 audio codec, dual Gigabit LAN, rich I/O interfaces, wide power input (12V ~ 24V DC), and supports Android 4.4 and Yocto 1.7 operating systems.

What display options does the ACP-IMX6POS support?

The ACP-IMX6POS supports multiple display configurations: Quad Core version supports VGA + HDMI, LVDS + HDMI, or VGA + LVDS, while the Dual Lite version supports LVDS + HDMI. These flexible display options make it suitable for various applications including digital signage, point-of-sale systems, and industrial control panels requiring different display interfaces.

What are the networking capabilities of the ACP-IMX6POS?

The ACP-IMX6POS features dual Gigabit LAN with 2 x RJ45 connectors. The first LAN uses a Micrel KSZ9031RNX PHY connected to the i.MX6 MAC, while the second LAN optionally uses an Intel 82574L controller connected via PCIe. This dual LAN configuration enables network redundancy or segmentation between different network domains for enhanced security and reliability.

ACP-IMX6POS

*Price on request. Contact us for a quote.

Manufacturer: Avalue

NXP i.MX6 Dual Lite or Quad-Core 1GHz Processor
1GB DDR3 (Dual Lite) / 2GB DDR3 (Quad Core), expandable to 2GB
Onboard 4GB eMMC Storage
Multiple Display Support: VGA + HDMI or LVDS + HDMI or VGA + LVDS
Audio Codec: Wolfson WM8962
Dual Gigabit LAN (RJ45 Connectors)
Rich I/O: USB, HDMI, RJ11 Cash Drawer, RS232/485 Ports
12V ~ 24V DC Wide Power Input
Android 4.4, Yocto 1.7 OS Support
CE, FCC Class B Certified

Product Description

The Avalue ACP-IMX6POS is a compact ARM-based SBC powered by the NXP i.MX6 Dual Lite or Quad-Core processor.

Featuring DDR3 memory, onboard eMMC storage, multiple display configurations (VGA, HDMI, LVDS), dual Gigabit LAN, and versatile I/O interfaces, it is ideal for embedded and industrial applications.

Technical Specifications

System Information

Processor

NXP i.MX 6 Dual Lite

NXP i.MX 6 Quad Core

System Memory

1GB DDR3 (Dual Lite)

2GB DDR3 (Quad Core)

(Expandable to 2GB)

Storage

4GB eMMC

Display

Multiple Display

Quad (VGA + HDMI or LVDS + HDMI or VGA + LVDS) - Quad Core

Dual Lite (LVDS + HDMI)

Audio

Audio Codec

Wolfson WM8962

Audio Interface

2P Pin Header x2 (Speaker-out R & L) (Max 2W per channel)

Ethernet

Ethernet Interface

2 x RJ45 Connectors for Dual Gigabit LAN

LAN Chipset

LAN 1: Micrel KSZ9031RNX (from i.MX6 MAC)

LAN 2: Intel 82574L by PCIe (Optional)

Power Requirement

DC Input

12V ~ 24V DC Power Input

Power Mode

2.5mm DC Jack

Software Support

OS

Android 4.4

Yocto 1.7

Certification

Certification Information

FCC Class B

I/O

External I/O Connector

1 x USB2.0 Type A x2 (Double deck)

1 x 10/100/1000 LAN RJ45

Optional 2nd LAN (RJ45)

1 x HDMI Connector (Vertical Type)

1 x Mini USB Connector

1 x RJ11 Connector for Cash Drawer

2 x DB9 Male Connector (COM 1 & 2)

Internal I/O Connector

2 x RS232, 1 x debug port

1 x LVDS 24bit x2, 1 x Backlight control

1 x VGA, 1 x I2C

3 x USB pin header

1 x 5-wire Resistive Touch Interface

1 x Dual Channel 24-bit LVDS

1 x Stereo Speaker-out

1 x Mini PCIe (Full size)

1 x SIM Socket

1 x Front Panel Connector

with Power Button & Indicate

LED for Power & WIFI

1 x Battery connector for RTC

USB

3 x USB 2.0 Port (1x OTG)

COM Port

2 x RS232

Mechanical & Environmental

Operating Temp.

A Version 0°C ~ 60°C (32°F ~ 140°F)

B Version -20°C ~ 85°C (-4°F ~ 185°F)

Storage Temp.

-40°C ~ 85°C (-40°F ~ 185°F)

Dimension (L x W)

(175mm x 110mm)

Weight

0.16kg

Operating Humidity

0% ~ 90% Relative Humidity, Non-condensing

Power Requirement

DC 12 ~ 24V Power Input

Ordering Information

ACP-X6Q12J-A1R-00

ACP-IMX6POS Rev.A1 Qual CPU, DDR3 2GB, 4GB eMMC, 0 ~ 60°C

ACP-X6L12H-A1R-00

ACP-IMX6POS Rev.A1 Dual Lite CPU, DDR3 1GB, 4GB eMMC, 0 ~ 60°C

BCC-WLAN-04R

Wi-Fi 802.11a/b/g/n/ac + Bluetooth4.1 Module with PCI-e Half-Mini Card

What is ACP-IMX6POS?

The ACP-IMX6POS is a industrial & embedded motherboard manufactured by Avalue, designed specifically for arm-based-sbc applications. The Avalue ACP-IMX6POS is a compact ARM-based SBC powered by the NXP i.MX6 Dual Lite or Quad-Core processor. Featuring DDR3 memory, onboard eMMC storage, multiple display configurations (VGA, HDMI, LVDS), dual Gigabit LAN, and versatile I/O interfaces, it is ideal for embedded and industrial applications.

Key Features & Benefits

NXP i.MX6 Dual Lite or Quad-Core 1GHz Processor
1GB DDR3 (Dual Lite) / 2GB DDR3 (Quad Core), expandable to 2GB
Onboard 4GB eMMC Storage
Multiple Display Support: VGA + HDMI or LVDS + HDMI or VGA + LVDS
Audio Codec: Wolfson WM8962
Dual Gigabit LAN (RJ45 Connectors)
Rich I/O: USB, HDMI, RJ11 Cash Drawer, RS232/485 Ports
12V ~ 24V DC Wide Power Input
Android 4.4, Yocto 1.7 OS Support
CE, FCC Class B Certified

Applications & Use Cases

The ACP-IMX6POS is ideal for various industrial automation applications:

DC-powered industrial installations and mobile applications
High-performance computing and data processing tasks
Networked industrial systems and data communication
Peripheral device connectivity and data transfer
Memory-intensive applications and multitasking
Data logging and storage-intensive operations
Visual monitoring and data display systems
Custom industrial computing solutions

Frequently Asked Questions

The ACP-IMX6POS offers two temperature range versions: A Version operating from 0°C to 60°C (32°F to 140°F) and B Version with extended range from -20°C to 85°C (-4°F to 185°F). Storage temperature is rated from -40°C to 85°C (-40°F to 185°F), with 0-90% relative humidity (non-condensing) operation. The board measures 175mm x 110mm and weighs 0.16kg, making it suitable for various industrial environments.

ARM-based Single Board Computers (SBCs) use processors based on ARM architecture, known for excellent power efficiency and performance-per-watt ratio compared to x86 SBCs. ARM SBCs typically consume less power, generate less heat (often enabling fanless designs), and are more cost-effective for many applications. While traditionally providing lower raw processing power than x86 counterparts, modern ARM SoCs (especially those with multi-core designs) now offer competitive performance for many industrial and embedded applications while maintaining their efficiency advantages.

ARM-based SBCs excel in industrial applications including HMI (Human-Machine Interface) systems, IoT gateways, edge computing devices, industrial control panels, digital signage, point-of-sale systems, industrial automation, machine vision systems, robotics, medical devices, and transportation systems. Their low power consumption, wide temperature operation, compact form factors, and long lifecycle support make them ideal for environments where reliability, efficiency, and space constraints are critical factors.

ARM-based SBCs typically support a variety of operating systems including various Linux distributions (Debian, Ubuntu, Yocto Project), Android, and some specialized real-time operating systems (RTOS). Windows 10 IoT Core or Windows 11 for ARM is available on select platforms. For industrial applications, Linux-based systems (particularly Yocto) are popular due to their customizability, stability, and long-term support options, while Android is common for touch-based interactive applications.

ARM-based SBCs offer several advantages for industrial applications including lower power consumption (reducing cooling requirements and operating costs), fanless operation (enhancing reliability in dusty environments), wide temperature operation ranges, compact form factors, extended lifecycle support, diverse I/O options optimized for industrial use (like CAN, RS-485, and industrial Ethernet), competitive pricing, and increasingly powerful processing capabilities for edge computing and AI workloads.

When selecting an ARM-based SBC, consider: processing requirements (CPU/GPU capabilities for your workload); memory and storage needs; I/O requirements (specific interfaces like CAN, RS-485, industrial Ethernet); display requirements (resolution, number of displays, interface types); environmental specifications (temperature range, humidity, vibration resistance); power constraints; form factor and mechanical integration; long-term availability and support; operating system compatibility; and total cost of ownership. Prioritize industrial-grade components and wide temperature operation for demanding environments.

ARM Cortex-A53 is an older 64-bit core offering good power efficiency and reliability for basic tasks. Cortex-A55 is its successor, providing approximately 18% better performance at the same power level, with improved memory system. Cortex-A76 is a high-performance core with significantly higher processing power (2-3x over A55) but at higher power consumption, often used in big.LITTLE configurations where A76 cores handle intensive tasks while A55 cores manage background processes to balance performance and power efficiency in modern SoCs.

Common display interfaces on ARM-based SBCs include: HDMI (digital interface supporting high resolutions and audio); LVDS (differential signaling interface common in industrial panels); MIPI DSI (low-power interface for mobile/embedded displays); eDP (DisplayPort variant for embedded applications); and legacy interfaces like VGA (analog) or DVI. They differ in resolution support, cable length limitations, EMI characteristics, power consumption, and compatibility with industrial displays. Modern SBCs often include multiple interfaces to accommodate various display options.

To ensure reliability in harsh environments: select boards with appropriate temperature ratings; implement proper thermal management (heat sinks, enclosures with thermal design); protect against dust and moisture using appropriate IP-rated enclosures; use industrial-grade components and conformal coating where available; implement surge protection and proper grounding; select boards with vibration/shock resistance certifications for mobile applications; use locking connectors to prevent disconnection; implement watchdog timers and reliable power supplies with appropriate filtering; perform thorough environmental testing; and establish monitoring systems for predictive maintenance.

When installing ARM-based SBCs, consider: proper voltage range (typically 9-36V DC for industrial boards); sufficient power supply rating with headroom above maximum consumption; power supply quality (filtering, stability); surge and brownout protection; proper grounding and isolation in electrically noisy environments; cable gauge selection for power delivery; backup power options (UPS or battery) for critical applications; power sequencing requirements for attached peripherals; thermal implications of power consumption; and power management settings in the operating system to optimize efficiency while meeting performance requirements.

For effective thermal management of ARM-based SBCs: ensure adequate airflow around the board; use appropriate heat sinks or thermal pads on processors and other heat-generating components; maintain recommended clearance from other heat sources; consider ambient temperature in the installation environment; for higher-temperature environments, select boards with wider temperature ratings; implement temperature monitoring; in sealed enclosures, use thermal transfer techniques to conduct heat to the enclosure walls; and for outdoor installations, consider solar loading effects and use reflective or insulated enclosures.

For optimal connectivity with ARM-based SBCs: use high-quality, shielded cables for signal integrity; implement proper strain relief to prevent connector damage; use locking connectors where possible; separate signal cables from power cables to minimize interference; follow proper grounding practices; add surge protection for external connections; implement network security measures for connected systems; maintain proper cable lengths within specifications; label all connections clearly; document the complete connectivity scheme; and test all connections thoroughly before final deployment.

For first-time boot and configuration: verify proper power supply and connectivity before powering on; prepare the bootable media (microSD/eMMC) with the appropriate operating system image; connect essential peripherals (display, keyboard); power on and observe boot indicators; follow specific first-boot procedures for your OS (setting root password, network configuration); update the system to latest patches; configure system services as needed; implement required security measures; set up remote access if needed; configure automatic startup applications; establish monitoring and logging; create system backups; and document the complete configuration for future reference.

If an ARM-based SBC fails to boot: verify power supply voltage and polarity; check for power indicators on the board; inspect for physical damage or loose connections; try an alternative power supply; verify boot media (microSD/eMMC) is properly inserted and functional; connect a display to check for boot messages; check boot mode jumpers/switches if present; try a known-good operating system image; look for error codes or LED blink patterns indicating specific issues; disconnect all peripherals except essential ones; and check manufacturer-specific recovery mechanisms or boot options. Document what you've tried for more effective technical support if needed.

To diagnose network issues: check physical connections and link indicators; verify IP configuration (static/DHCP settings); use diagnostic commands (ping, ifconfig/ip addr, traceroute, nslookup); examine network services status; check firewall settings; verify DNS configuration; examine logs for network errors; test alternative network cables; confirm network switch port functionality; verify MAC address conflicts; check for overheating causing intermittent connectivity; test multiple network applications to isolate the issue; and capture network traffic with tools like tcpdump or Wireshark for deeper analysis if necessary.

Common causes of instability include: inadequate power supply (voltage drops under load); thermal issues (overheating due to inadequate cooling or ambient conditions); memory leaks in applications; storage device failures; incompatible drivers or kernel modules; hardware clock issues; excessive I/O operations overwhelming the system; corrupted operating system files; electromagnetic interference in industrial environments; insufficient RAM for workload; improper shutdown causing filesystem corruption; incompatible peripherals; and outdated firmware or operating system. Systematic testing and log analysis can help identify the specific cause.

To resolve display issues: verify physical connections and cable integrity; confirm monitor power and input selection; check supported resolutions and refresh rates; verify display interface configuration in the operating system; examine logs for graphics driver errors; test alternative cables or adapters; try different resolution/refresh settings; update graphics drivers if available; check for conflicting display settings when using multiple outputs; verify sufficient power for the display subsystem; review boot logs for early graphics initialization errors; and try alternative display devices to isolate whether the issue is with the SBC or the display device.

Product Features

Product Description

Technical Specifications

System Information

Processor

System Memory

Storage

Storage

Display

Multiple Display

Audio

Audio Codec

Audio Interface

Ethernet

Ethernet Interface

LAN Chipset

Power Requirement

DC Input

Power Mode

Software Support

OS

Certification

Certification Information

I/O

External I/O Connector

Internal I/O Connector

USB

COM Port

Mechanical & Environmental

Operating Temp.

Storage Temp.

Dimension (L x W)

Weight

Operating Humidity

Power Requirement

Ordering Information

Ordering Information

What is ACP-IMX6POS?

Key Features & Benefits

Applications & Use Cases

Frequently Asked Questions