RSC-3568J
RSC-3568J
*Price on request. Contact us for a quote.
Manufacturer: Avalue
- Rockchip RK3568J Quad-Core Cortex-A55 1.8GHz
- Fanless operation from -40°C ~ +85°C
- Support LCD Interface LVDS/MIPI/eDP
- 4GB LPDDR4 / 64GB eMMC
- Dual Gigabit Ethernet
- 2 x CAN, 1 x 16-bit GPIO
- M.2 Key E (2230, USB 2.0, supports Wi-Fi Module)
- M.2 Key B (3042, SATA3 / USB 2.0, support SSD/LTE Module)
The Avalue RSC-3568J is a rugged 3.5-inch ARM-based SBC powered by Rockchip RK3568J Quad-Core Cortex-A55 CPU. Featuring 4GB LPDDR4 memory, 64GB eMMC storage, dual Gigabit Ethernet ports, M.2 expansion slots, and multi-display support with HDMI, LVDS, MIPI and eDP, it is ideal for industrial IoT, smart displays, and embedded applications.
Processor
Rockchip RK3568J Quad-core Cortex-A55 1.8GHz
System Memory
4GB LPDDR4
Board
3.5" SBC
Expansion Slots
1 x M.2 Key E (2230, USB 2.0, supports Wi-Fi Module)
1 x M.2 Key B (3042, SATA3 / USB 2.0, supports SSD/LTE Module)
Storage
64GB eMMC
1 x Micro SD Card Slot
Multiple Display
Dual Display
HDMI + LVDS/MIPI
HDMI + eDP
Graphic Chipset
Mali-G52 GPU supporting OpenGL ES 1.1/2.0/3.2, Vulkan 1.0/1.1, OpenCL 2.0
Resolution
1 x HDMI: 4096 x 2160 @60Hz
1 x LVDS: 800x480, 1024x768, 1280x800
1 x MIPI: 1024x768
1 x eDP: 1920x1080
Ethernet Interface
10/100/1000 Base-Tx GbE compatible
LAN Chipset
2 x Realtek RTL8211FDI
LAN Port
2 x RJ45
DC Input
+12V ~ +24V
DC Input Connector
Lockable DC Jack
OS
Android 13
Debian 11
Certification Information
CE
FCC Class B
GPIO
1 x 16-bit GPIO by pin wafer
SIM Slot
1 x Nano SIM
Other
1 x Reset
COM Port
1 x RS232/422/485 DB9
3 x RS232 by pin header
1 x RS232/422/485 by pin header
USB
1 x USB 3.0 Type A
1 x USB 3.0 Type A supporting OTG
2 x USB 2.0 by pin header
Internal I/O Connector
1 x Backlight
1 x Debug
1 x I2C
1 x Speaker
1 x Touch Button
1 x DC-in by pin wafer
Communication
2 x CAN by pin header
Display Connector
1 x LVDS/MIPI co-lay
1 x eDP
Operating Temperature
-40°C ~ 85°C
Storage Temperature
-40°C ~ 85°C
Dimension (L x W)
146 x 101 mm
Weight
0.16 kg
Operating Humidity
40°C @ 95% RH, Non-condensing
Drop Test
ISTA 2A, IEC-60068-2-32 Test:Ed
Vibration Test
IEC 60068-2-64, 1.5 ~ 3.0 Grm, random, 5 ~ 500Hz, 30mins/axis
Ordering Information
RSC-3568J-6W-A104R
Frequently Asked Questions
The RSC-3568J is a rugged 3.5-inch SBC featuring the Rockchip RK3568J Quad-Core Cortex-A55 1.8GHz processor, 4GB LPDDR4 memory, 64GB eMMC storage, fanless operation from -40°C to +85°C, multiple display interfaces (LVDS/MIPI/eDP), dual Gigabit Ethernet, 2 x CAN and 1 x 16-bit GPIO, and expansion through M.2 Key E and Key B slots for WiFi, SSD, or LTE modules.
The RSC-3568J supports dual display configurations with HDMI + LVDS/MIPI or HDMI + eDP. The HDMI port supports 4096 x 2160 @60Hz resolution, LVDS supports 800x480, 1024x768, and 1280x800 resolutions, MIPI supports 1024x768, and eDP supports 1920x1080. This is powered by a Mali-G52 GPU supporting OpenGL ES 1.1/2.0/3.2, Vulkan 1.0/1.1, and OpenCL 2.0.
The RSC-3568J is designed for extreme conditions with an operating and storage temperature range of -40°C to 85°C, 40°C @ 95% RH (non-condensing) humidity tolerance, and passes rigorous tests including drop tests (ISTA 2A, IEC-60068-2-32) and vibration tests (IEC 60068-2-64, 1.5 ~ 3.0 Grm, random, 5 ~ 500Hz). This makes it suitable for deployment in harsh industrial environments.
The RSC-3568J offers comprehensive communication interfaces including 2 x RJ45 Gigabit Ethernet ports (Realtek RTL8211FDI), 1 x RS232/422/485 DB9, 3 x RS232 by pin header, 1 x RS232/422/485 by pin header, 2 x CAN by pin header, various USB ports (USB 3.0 Type A, USB 3.0 Type A with OTG, USB 2.0 by pin header), and expansion options through M.2 slots for WiFi and LTE connectivity.
ARM-based Single Board Computers (SBCs) use processors based on ARM architecture, known for excellent power efficiency and performance-per-watt ratio compared to x86 SBCs. ARM SBCs typically consume less power, generate less heat (often enabling fanless designs), and are more cost-effective for many applications. While traditionally providing lower raw processing power than x86 counterparts, modern ARM SoCs (especially those with multi-core designs) now offer competitive performance for many industrial and embedded applications while maintaining their efficiency advantages.
ARM-based SBCs excel in industrial applications including HMI (Human-Machine Interface) systems, IoT gateways, edge computing devices, industrial control panels, digital signage, point-of-sale systems, industrial automation, machine vision systems, robotics, medical devices, and transportation systems. Their low power consumption, wide temperature operation, compact form factors, and long lifecycle support make them ideal for environments where reliability, efficiency, and space constraints are critical factors.
ARM-based SBCs typically support a variety of operating systems including various Linux distributions (Debian, Ubuntu, Yocto Project), Android, and some specialized real-time operating systems (RTOS). Windows 10 IoT Core or Windows 11 for ARM is available on select platforms. For industrial applications, Linux-based systems (particularly Yocto) are popular due to their customizability, stability, and long-term support options, while Android is common for touch-based interactive applications.
ARM-based SBCs offer several advantages for industrial applications including lower power consumption (reducing cooling requirements and operating costs), fanless operation (enhancing reliability in dusty environments), wide temperature operation ranges, compact form factors, extended lifecycle support, diverse I/O options optimized for industrial use (like CAN, RS-485, and industrial Ethernet), competitive pricing, and increasingly powerful processing capabilities for edge computing and AI workloads.
When selecting an ARM-based SBC, consider: processing requirements (CPU/GPU capabilities for your workload); memory and storage needs; I/O requirements (specific interfaces like CAN, RS-485, industrial Ethernet); display requirements (resolution, number of displays, interface types); environmental specifications (temperature range, humidity, vibration resistance); power constraints; form factor and mechanical integration; long-term availability and support; operating system compatibility; and total cost of ownership. Prioritize industrial-grade components and wide temperature operation for demanding environments.
ARM Cortex-A53 is an older 64-bit core offering good power efficiency and reliability for basic tasks. Cortex-A55 is its successor, providing approximately 18% better performance at the same power level, with improved memory system. Cortex-A76 is a high-performance core with significantly higher processing power (2-3x over A55) but at higher power consumption, often used in big.LITTLE configurations where A76 cores handle intensive tasks while A55 cores manage background processes to balance performance and power efficiency in modern SoCs.
Common display interfaces on ARM-based SBCs include: HDMI (digital interface supporting high resolutions and audio); LVDS (differential signaling interface common in industrial panels); MIPI DSI (low-power interface for mobile/embedded displays); eDP (DisplayPort variant for embedded applications); and legacy interfaces like VGA (analog) or DVI. They differ in resolution support, cable length limitations, EMI characteristics, power consumption, and compatibility with industrial displays. Modern SBCs often include multiple interfaces to accommodate various display options.
To ensure reliability in harsh environments: select boards with appropriate temperature ratings; implement proper thermal management (heat sinks, enclosures with thermal design); protect against dust and moisture using appropriate IP-rated enclosures; use industrial-grade components and conformal coating where available; implement surge protection and proper grounding; select boards with vibration/shock resistance certifications for mobile applications; use locking connectors to prevent disconnection; implement watchdog timers and reliable power supplies with appropriate filtering; perform thorough environmental testing; and establish monitoring systems for predictive maintenance.
When installing ARM-based SBCs, consider: proper voltage range (typically 9-36V DC for industrial boards); sufficient power supply rating with headroom above maximum consumption; power supply quality (filtering, stability); surge and brownout protection; proper grounding and isolation in electrically noisy environments; cable gauge selection for power delivery; backup power options (UPS or battery) for critical applications; power sequencing requirements for attached peripherals; thermal implications of power consumption; and power management settings in the operating system to optimize efficiency while meeting performance requirements.
For effective thermal management of ARM-based SBCs: ensure adequate airflow around the board; use appropriate heat sinks or thermal pads on processors and other heat-generating components; maintain recommended clearance from other heat sources; consider ambient temperature in the installation environment; for higher-temperature environments, select boards with wider temperature ratings; implement temperature monitoring; in sealed enclosures, use thermal transfer techniques to conduct heat to the enclosure walls; and for outdoor installations, consider solar loading effects and use reflective or insulated enclosures.
For optimal connectivity with ARM-based SBCs: use high-quality, shielded cables for signal integrity; implement proper strain relief to prevent connector damage; use locking connectors where possible; separate signal cables from power cables to minimize interference; follow proper grounding practices; add surge protection for external connections; implement network security measures for connected systems; maintain proper cable lengths within specifications; label all connections clearly; document the complete connectivity scheme; and test all connections thoroughly before final deployment.
For first-time boot and configuration: verify proper power supply and connectivity before powering on; prepare the bootable media (microSD/eMMC) with the appropriate operating system image; connect essential peripherals (display, keyboard); power on and observe boot indicators; follow specific first-boot procedures for your OS (setting root password, network configuration); update the system to latest patches; configure system services as needed; implement required security measures; set up remote access if needed; configure automatic startup applications; establish monitoring and logging; create system backups; and document the complete configuration for future reference.
If an ARM-based SBC fails to boot: verify power supply voltage and polarity; check for power indicators on the board; inspect for physical damage or loose connections; try an alternative power supply; verify boot media (microSD/eMMC) is properly inserted and functional; connect a display to check for boot messages; check boot mode jumpers/switches if present; try a known-good operating system image; look for error codes or LED blink patterns indicating specific issues; disconnect all peripherals except essential ones; and check manufacturer-specific recovery mechanisms or boot options. Document what you've tried for more effective technical support if needed.
To diagnose network issues: check physical connections and link indicators; verify IP configuration (static/DHCP settings); use diagnostic commands (ping, ifconfig/ip addr, traceroute, nslookup); examine network services status; check firewall settings; verify DNS configuration; examine logs for network errors; test alternative network cables; confirm network switch port functionality; verify MAC address conflicts; check for overheating causing intermittent connectivity; test multiple network applications to isolate the issue; and capture network traffic with tools like tcpdump or Wireshark for deeper analysis if necessary.
Common causes of instability include: inadequate power supply (voltage drops under load); thermal issues (overheating due to inadequate cooling or ambient conditions); memory leaks in applications; storage device failures; incompatible drivers or kernel modules; hardware clock issues; excessive I/O operations overwhelming the system; corrupted operating system files; electromagnetic interference in industrial environments; insufficient RAM for workload; improper shutdown causing filesystem corruption; incompatible peripherals; and outdated firmware or operating system. Systematic testing and log analysis can help identify the specific cause.
To resolve display issues: verify physical connections and cable integrity; confirm monitor power and input selection; check supported resolutions and refresh rates; verify display interface configuration in the operating system; examine logs for graphics driver errors; test alternative cables or adapters; try different resolution/refresh settings; update graphics drivers if available; check for conflicting display settings when using multiple outputs; verify sufficient power for the display subsystem; review boot logs for early graphics initialization errors; and try alternative display devices to isolate whether the issue is with the SBC or the display device.