Avalue · Sistema de computación

VMS-CFS-M12

Ficha técnica

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Fabricante: Avalue

Aspectos destacados

8th/9th Gen Intel® Core™ i7/i5/i3 Processors
Intel® Q370 Express Chipset
Intel® UHD Graphics 630/610
Memory Max. Up to 64GB DDR4 2666
mPCIe,M.2 Key-E, M.2 Key-B Expansion Slots
4 ports M12 PoE, support 802.3af
-25~70/-40C~70C Operating Temperature
9~36Vdc DC Input, with Vehicle Power Management
Support RAID 0/1/5/10, Firmware TPM 2.0, iATM 12.0

Descripción del producto

The Avalue VMS-CFS-PSE-RJ45 is a modular computing system designed for vehicular applications, featuring Power over Ethernet (PoE) and RJ45 connectivity. It supports a fanless design and wide temperature range, making it suitable for harsh environments.

This system is ideal for applications requiring robust network connectivity and reliable power management for mobile industrial use.

Especificaciones técnicas

Procesador

Intel® Core™ i7-8700T Processor (12M Cache, up to 4.00 GHz)

Intel® Core™ i5-8500T Processor (9M Cache, up to 3.50 GHz)

Intel® Core™ i3-8100T Processor (6M Cache, 3.10 GHz)

Intel® Pentium® Gold G5400T Processor (4M Cache, 3.10 GHz)

Intel® Celeron® G4900T Processor (2M Cache, 2.90 GHz)

Intel® Core™ i7-9700TE Processor (12M Cache, up to 3.80 GHz)

Intel® Core™ i5-9500TE Processor (9M Cache, up to 3.60 GHz)

Intel® Core™ i3-9100TE Processor (6M Cache, up to 3.20 GHz)

Platform Controller Hub

Intel® Q370 Express Chipset

Memoria del sistema

2 x 260-pin DDR4 SODIMM 2400/2666MHz up to 64 GB

Temporizador watchdog

H/W Reset, 1sec. ~ 65535min.

Monitor de estado del hardware

Monitoring CPU & System Temperature and Voltage

RAID

Support RAID 0/1/5/10

iAMT

iATM 12.0

SBC

EBM-CFSV

TPM

TPM 2.0 (Firmware)

Temperatura de funcionamiento

-40°C ~ 70C (-40°F ~ 158°F) with 0.5m/s air flow, extended temperature peripherals

Temperatura de almacenamiento

-30°C ~ 70°C (-22°F ~ 158°F)

Humedad en funcionamiento

40°C @ 95% Relative Humidity, Non-condensing

Dimensiones (An x L x Al)

279.4mm x 210mm x 110 mm(w/ wall mount)

Peso

5.4KG (w/packing)

4.5KG (System)

Ensayo de vibración

Operating with SSD : MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure

Non-Operating with SSD : MIL-STD-810G, Method 514.6, Category 24, minimum integrity test

Ensayo de choque

Operating with SSD : MIL-STD-810H, Method 516.8, Procedure I, functional shock=20G

Non-Operating with SSD: MIL-STD-810H, Method 516.8, Procedure V, crash hazard shock test=75G

Kit de montaje

Wall mount kit (standard)

M.2

1 x M.2 Key-E 2230 for Wi-Fi & BT Module

2 x M.2 Key-B 2242/3042/2280 w/ push-push SIM slot for SSD/ LTE/ I/O Modules

mPCIe

1 x Full Size Mini PCIe (w/ push-push SIM Slot)

Expansión

1 x CANBus module Interface (UART), supports ATBS Module (Factory Option)

M.2

2 x M.2 Key-B SSD (SATA III, Max. up to 2280)

Bahía de unidad de 2,5

2 x 2.5" Drive Bay (SATA III, Max. up to 12,5mm Height Storage)

Botón de encendido

1 x Push Button for Power on/off w/ LED

Botón de reinicio

1 x Push Button for Reset in hiding

Indicador LED

1 x Power LED (Blue)

1 x Storage LED (Yellow)

1 x WLAN LED (Green)

1 x WWAN LED (Green)

USB

2 x USB 3.2 Gen. 1

E/S digital

1 x 8bit GPIO, w/1.5KV isolation

Audio

1 x Mic-In

1 x Line-Out

Ranura SIM

3 x SIM Card Slot (External Accessible w/Dust Protection Cover)

USB

4 x USB 3.2 Gen.1

Puerto COM

2 x RS232/422/485, (Jumper + DIP switch), with +5V and +12V support on Pin-9 via Jumper + DIP switch, support auto-flow

1 x RS-232 (COM3), with +5V and +12V support on Pin-9 via Jumper + DIP switch

Puerto LAN

2 x RJ-45

4 x PoE ports support IEEE 802.3at/af.

Bus CAN

CANbus modules supports OBDII, SAE J1939/J1708 (Factory Option)

Audio

1 x Mic-In

1 x Line-Out

DP

1 x DP

HDMI

2 x HDMI

LVDS

1 x DB26 LVDS interface with 12V and USB2.0

Antena

5x Antenna Mounting Hole

Entrada CA/CC

3-Pin Terminal Block

Chipset

Onboard u-blox NEO-M8N module supports GPS/ Gloness/ QZSS/ Galileo/ Beidou

Códec de audio

Realtek ALC888S

supports 2-CH

Chipset gráfico

Intel® UHD Graphics 630 (i7-8700T, i5-8500T, i3-8100T)

Intel® UHD Graphics 610 (Pentium G5400T, Celeron G4900T)

Resolución

DP: Max. resolution 4096x2160 @ 60Hz

HDMI: Max. resolution 4096x2160 @ 30Hz

LVDS: Max. resolution 1920x1200 @ 60Hz

Información de certificación

CE, FCC Class A, E13 Mark, ISO 7637-2, IP50

Chipset LAN

1 x Intel® I211AT

1 x Intel® I219LM

1 x Intel® I210IT

Especificación

10/100/1000 Base-Tx GbE compatible

Espec. de entrada de tensión

Typical 12/24Vdc ( +9~ 36Vdc)

Conector de entrada de tensión

3-Pin Terminal Block

ACPI

Single Power ATX Support S0, S3, S4, S5

ACPI 5.0 Compliant

Modo de alimentación

Vehicle Power Mode (Default Setting)

Industrial PC Power Mode supports AT/ATX

SO

Win10, Linux

Información de pedido

Intel® 8th/9th Coffee Lake Rugged Fanless Vehicle Telematics System w/M12 PoE

With Intel® Q370 Chipset

VMS-CFS-87-B1-2R (i7-8700T)

VMS-CFS-85-B1-2R (i5-8500T)

VMS-CFS-81-B1-2R (i3-8100T)

VMS-CFS-54-B1-2R (Pentium Gold G5400T)

VMS-CFS-49-B1-2R (Celeron G4900T)

VMS-CFS-97-B1-2R (i7-9700TE)

VMS-CFS-95-B1-2R (i5-9500TE)

VMS-CFS-91-B1-2R (i3-9100TE)

¿Qué es VMS-CFS-M12?

The VMS-CFS-M12 is a sistema de computación manufactured by Avalue, designed specifically for modular-computing-system applications. It features red of 2 x RJ-45, 4 x PoE ports support IEEE 802.3at/af.. The Avalue VMS-CFS-PSE-RJ45 is a modular computing system designed for vehicular applications, featuring Power over Ethernet (PoE) and RJ45 connectivity. It supports a fanless design and wide temperature range, making it suitable for harsh environments. This system is ideal for applications requiring robust network connectivity and reliable power management for mobile industrial use.

Características y ventajas principales

8th/9th Gen Intel® Core™ i7/i5/i3 Processors
Intel® Q370 Express Chipset
Intel® UHD Graphics 630/610
Memory Max. Up to 64GB DDR4 2666
mPCIe,M.2 Key-E, M.2 Key-B Expansion Slots
4 ports M12 PoE, support 802.3af
-25~70/-40C~70C Operating Temperature
9~36Vdc DC Input, with Vehicle Power Management
Support RAID 0/1/5/10, Firmware TPM 2.0, iATM 12.0

Aplicaciones y casos de uso

El VMS-CFS-M12 es ideal para numerosas aplicaciones de automatización industrial:

DC-powered industrial installations and mobile applications
Extreme temperature environments and outdoor installations
High-performance computing and data processing tasks
Memory-intensive applications and multitasking
Industrial computing and data processing
Edge computing and IoT applications
Real-time monitoring and control
Industrial automation systems

Preguntas frecuentes

The VMS-CFS-M12 is a specialized vehicle-mounted computing system featuring Intel® 8th/9th Gen Coffee Lake processors, up to 64GB DDR4 memory, and notably M12 connectors with PoE capabilities for superior vibration resistance and environmental sealing. It offers comprehensive I/O including multiple USB ports, COM ports, display outputs (DP, HDMI, LVDS), and GPS functionality. The system provides robust vehicular integration with extreme wide temperature operation (-40°C to 70°C), shock/vibration resistance to military standards, vehicle power management (9-36V DC input), and E-Mark certification. This configuration is ideal for applications in severe environments where connector reliability and sealing are critical, such as construction equipment, railways, outdoor vehicles, and applications subject to wash-down or extreme vibration.

M12 connectors provide significant advantages for vehicle-mounted applications through their screw-lock mating mechanism that prevents vibration-induced disconnections, IP67/IP68-rated sealing protecting against dust, water, and pressure washing, robust metal construction resisting mechanical damage, standardized industrial interface ensuring long-term availability and compatibility, enhanced EMI/RFI shielding for electrical noise immunity, extended temperature range operation, and resistance to chemicals, oils, and cleaning agents. These features make M12 connectors ideal for vehicle applications operating in harsh environments where standard connectors would fail due to vibration, moisture, dust, or chemical exposure, ensuring reliable connectivity in demanding conditions like construction sites, agricultural environments, exposed transportation systems, and industrial vehicles.

The VMS-CFS-M12 addresses extreme vehicular environmental challenges through a comprehensive design approach combining M12 sealed connectors protecting against water and dust ingress, reinforced chassis construction withstanding severe shock and vibration (tested to MIL-STD-810 standards), wide temperature operation (-40°C to 70°C) accommodating freezing and desert conditions, sealed thermal design preventing contamination while maintaining cooling efficiency, conformal coating protecting circuit boards from humidity and condensation, integrated power filtering managing vehicle electrical transients, and compliance with international standards for vehicular electronics (E-Mark, ISO 7637-2). This design ensures reliable operation in environments like construction sites, utility vehicles, railway applications, agriculture equipment, and other applications where exposure to extreme elements and mechanical stress is routine.

Applications particularly benefiting from the VMS-CFS-M12 include railway and train control systems requiring vibration-resistant connections, construction equipment operating in dusty and wet environments, agricultural machinery exposed to field conditions and chemical sprays, mining vehicles operating in extreme dust and moisture, outdoor surveillance systems on vehicles, municipal service vehicles subject to all-weather operation, emergency response vehicles requiring reliable connections in all conditions, marine and port vehicle applications exposed to salt spray, specialized military and defense vehicle computing, utility maintenance vehicles operating in all weather conditions, and any vehicle application where environmental exposure, vibration resistance, and connection reliability are critical factors that would compromise standard connector systems.

A Modular Computing System is an industrial-grade computer designed with modular components that can be interchanged or expanded to customize the system for specific applications. These systems typically feature a base unit with core processing capabilities and standardized interfaces for connecting specialized modules that add functionality such as additional I/O, communication protocols, or industry-specific features. This modularity provides flexibility, scalability, and future-proofing while maintaining the reliability and ruggedness required for industrial environments.

Modular Computing Systems offer several advantages over fixed-configuration computers: customization for specific application requirements, ability to adapt to changing needs without replacing the entire system, simpler upgrades by replacing only specific modules, reduced spare parts inventory, greater longevity as new technologies can be integrated via module updates, streamlined maintenance, and better return on investment through scalability. These benefits make modular systems particularly valuable in industrial environments where requirements evolve and system longevity is important.

An IET (Interface Extension Technology) module is a specialized expansion module used in systems like the EMS series to add specific functionality to the base computing platform. These modules connect to a standardized interface on the main system and provide additional capabilities such as extra COM ports, LAN ports, PoE functionality, or specialized interfaces like CAN bus. IET modules are important because they allow a single base system to be customized for diverse applications by simply changing the module, providing flexibility while maintaining a standardized core platform.

Industries benefiting from modular computing systems include manufacturing (automation control, data collection), transportation (fleet management, railway systems), utilities (substation monitoring, grid control), healthcare (medical equipment integration), retail (point-of-sale, inventory management), building automation (HVAC, access control), defense, aerospace, and smart city infrastructure. Applications requiring customization, future expansion, diverse I/O needs, or adaptation to legacy systems particularly benefit from the flexibility and scalability these systems provide while maintaining industrial-grade reliability.

Wide temperature operation (typically -40Â°C to 70Â°C for industrial systems) ensures reliable functioning in non-climate-controlled industrial environments like factory floors, outdoor installations, vehicles, and remote locations. This capability is achieved through careful component selection, thermal design, and elimination of moving parts like fans. Systems with wide temperature ranges can be deployed in harsh conditions without requiring expensive climate control systems, reducing installation and operating costs while improving reliability.

Fanless design means the computer uses passive cooling techniques with heat sinks and thermal engineering instead of active cooling fans. This design is crucial for industrial computers because it eliminates a common point of failure (the fan motor), prevents dust and contaminant ingress that could clog filters and cause overheating, enables sealed enclosures for harsh environments, reduces maintenance requirements, eliminates fan noise, and improves overall system reliability and longevity in challenging industrial conditions with dust, vibration, and temperature fluctuations.

TPM (Trusted Platform Module) 2.0 is a specialized security chip that provides hardware-based encryption capabilities, secure storage for authentication credentials, and system integrity verification. In industrial systems, TPM helps protect sensitive data, secure communication channels, prevent unauthorized access or tampering, and ensure the integrity of control systems. As industrial systems become more connected, TPM provides essential security features to protect against cyber threats targeting critical infrastructure and manufacturing systems.

Vibration and shock resistance are critical for industrial computing systems operating in environments with mechanical disturbances from machinery, vehicles, or handling. Systems are tested to standards like IEC 60068-2-64 (vibration) and IEC 60068-2-27 (shock) to ensure they can withstand these forces without component failure or connection issues. This resilience is achieved through solid-state storage, elimination of moving parts, reinforced component mounting, specialized chassis design, and industrial-grade components, ensuring reliable operation in mechanically challenging environments.

When installing modular computing systems, consider proper thermal management (ensuring adequate airflow around the unit), environmental protection (enclosures appropriate for dust/moisture levels), power quality (stable power source with appropriate voltage and backup options), EMI/RFI isolation (distance from high-interference sources), physical security, accessibility for module swapping and maintenance, proper grounding, cable management (strain relief and protection), and compliance with local regulations and industry standards. Proper planning ensures reliable operation and maximizes the benefits of the system's modular nature.

For fanless modular systems, proper thermal management is crucial: ensure adequate clearance around all sides (typically 5-10cm minimum), avoid enclosing in sealed cabinets without ventilation, mount vertically if possible to enhance natural convection cooling, install away from other heat-generating equipment, consider ambient temperature fluctuations in the installation location, follow manufacturer's mounting recommendations (which often include heat-dissipating brackets), and periodically check for dust accumulation on cooling surfaces. For high-temperature environments, consider additional passive cooling solutions or environmental controls.

For modular computing systems, select a power supply with sufficient wattage for the base system plus all modules (with 20-30% headroom for future expansion), ensure voltage matching the system's input range (typically 9-36V DC for industrial systems), implement surge protection for industrial environments with electrical noise, consider redundant power options for critical applications, use proper wire gauge for current requirements, and potentially include an uninterruptible power supply (UPS) for protection against power outages. The power system should account for the maximum possible configuration with all modules installed.

Best practices for cable management with modular systems include using appropriate cable types for the industrial environment (shielded where necessary), implementing strain relief to prevent connector damage, securing cables to prevent accidental disconnection due to vibration, labeling cables clearly for easier maintenance and troubleshooting, maintaining minimum bend radii to prevent internal damage, using cable trays or conduits for protection, separating power and data cables to minimize interference, allowing sufficient service loops for module replacement without disconnecting cables, and ensuring accessibility for future changes while maintaining a neat installation.

If the system fails to power on, check that the power supply provides the correct voltage within the system's input range (typically 9-36V DC), ensure connections are secure at both the power supply and system, verify any power switches or ignition control settings are correctly configured, check for tripped circuit breakers or blown fuses, inspect for visible damage to power connectors, test with an alternative known-good power supply if available, verify the power LED indicators, and check if the system is in AT mode requiring a specific power signal. For vehicle-mounted systems, ensure the ignition control is properly connected.

For issues with modules or expansion capabilities, verify the module is properly seated and secured, check power cycling the system after confirming connections, ensure any module-specific drivers are installed, check BIOS/UEFI settings for module-related options, inspect for physical damage to connectors, try an alternative slot if available, test with a known-working module to verify slot functionality, check system logs for error messages, and consult module-specific documentation for jumper settings or configuration requirements. After replacing modules, validate that the system recognizes the change through device manager or system information utilities.

For overheating issues, ensure adequate clearance around the system (minimum 5-10cm on all sides), check that the installation position allows for proper convection cooling (typically vertical mounting), clean dust from the chassis and heat sink fins using compressed air (when powered off), verify ambient temperature is within specifications, check system temperature through monitoring utilities or BIOS, ensure any thermal interface materials are properly applied if the system has been serviced, examine CPU usage for processes causing excessive load, and consider adding auxiliary passive cooling or relocating the system to a cooler environment if persistent.

To diagnose communication issues, first identify the specific interface (COM, LAN, USB, etc.) experiencing problems. Check physical connections and cables for damage, verify device driver installation and updates, confirm port configuration settings (baud rate, parity, etc. for serial connections; IP settings for network), try alternative cables or ports to isolate the issue, check for resource conflicts in Device Manager, test with a known-working device, verify any required protocol converters or adapters are functioning, and use diagnostic tools appropriate to the interface type (terminal emulator for serial, ping/traceroute for network) to identify where communication fails.

Aspectos destacados

Descripción del producto

Especificaciones técnicas

Información del sistema

Procesador

Platform Controller Hub

Memoria del sistema

Temporizador watchdog

Monitor de estado del hardware

RAID

iAMT

SBC

TPM

Mecánica y condiciones ambientales

Temperatura de funcionamiento

Temperatura de almacenamiento

Humedad en funcionamiento

Dimensiones (An x L x Al)

Peso

Ensayo de vibración

Ensayo de choque

Kit de montaje

Expansión

M.2

mPCIe

Expansión

Almacenamiento

M.2

Bahía de unidad de 2,5

E/S frontal

Botón de encendido

Botón de reinicio

Indicador LED

USB

E/S digital

Audio

Ranura SIM

E/S trasera

USB

Puerto COM

Puerto LAN

Bus CAN

Audio

DP

HDMI

LVDS

Antena

Entrada CA/CC

GPS

Chipset

Audio

Códec de audio

Pantalla

Chipset gráfico

Resolución

Certificaciones

Información de certificación

Ethernet

Chipset LAN

Especificación

Requisitos de alimentación

Espec. de entrada de tensión

Conector de entrada de tensión

ACPI

Modo de alimentación

Soporte de software

SO

Información de pedido

Información de pedido

¿Qué es VMS-CFS-M12?

Características y ventajas principales

Aplicaciones y casos de uso

Preguntas frecuentes