Avalue · Système informatique
EPC-APL
*Prix sur demande. Contactez-nous pour un devis.
Fabricant : Avalue
Points forts
- Intel® Pentium®/Celeron® Processor
- Single DRAM Socket, Max. Up to 8GB DDR3L 1866MHz
- Rich I/O, 1-VGA, 1-COM, 2-HDMI, 2-LAN, 4-USB3.0, 2-Antennal Mounting
- Fanless Operating from -10°C ~ 50°C
- Wide Range DC Power Input from 12V ~ 26V
- Compact Size, 177mm x 123mm x 43.5mm
- Optional VESA / DIN-Rail Kit
- TPM 2.0
Description du produit
The Avalue EPC-APL is a compact computing system powered by Intel® Apollo Lake processors. It features a fanless design, multiple I/O ports including USB, HDMI, and LAN, and supports a wide temperature range, making it suitable for industrial applications.
This system is designed for reliability and efficiency in various industrial environments, providing robust performance in a compact form factor.
Caractéristiques techniques
Processeur
Intel® Pentium® Processor N4200 (2M Cache, up to 2.5 GHz)
Intel® Celeron® Processor N3350 (2M Cache, up to 2.4 GHz)
Intel® Celeron® Processor J3455 (2M Cache, up to 2.3 GHz)
Mémoire système
1 x 204-pin SO-DIMM Socket, Max, Up to 8GB DDR3L 1866MHz
Chien de garde (watchdog)
H/W Reset, 1sec. ~ 65535sec and 1sec. or 1min./step.
Informations BIOS
AMI BIOS, 128Mbit SPI Flash ROM
Surveillance de l'état matériel
Monitoring CPU Temperature, Voltage with Auto Throttling Control
SBC
ECM-APL2
TPM
TPM 2.0
Température de fonctionnement
With extended temperature peripherals:-10°C ~ 50°C (14°F ~ 122°F) with 0.2m/s air flow
With 2.5” hard drive: 0°C ~ 40°C (32°°F ~ 113°F) with 0.2m/s air flow
Température de stockage
-30~70C° (-22°F ~ 158°F)
Humidité en fonctionnement
40°C @ 95% Relative Humidity, Non-condensing
Dimensions (larg. x long. x haut.)
177mm x 123mm x 43.5 mm (7” x 4.8” x 1.7”)
Poids
2.65lbs(1.2KG)
Test de vibrations
With SSD: 5Grms, IEC 60068-2-64, Random, 10 ~ 500Hz, 30min/Axis, 3 Axis
Test de chocs
With SDD : 50G, IEC 60068-2-27, Half Sine, 11ms, Z Axis
Test de chute
ISTA 2A, IEC-60068-2-32 Test : Ed, 1 Corner, 3 Edges, 6 Faces
Kit de montage
Stand (Default)
VESA Mount kit (Factory Option)
Din Rail kit (Factory Option)
mPCIe
1 x Full size mini PCIe (SATA/PCIE/USB2.0)
1 x Half size mini PCIe (PCIE/USB2.0)
mSATA
1 x mSATA
Baie de disque 2,5
1 x 2.5” Drive Bay (7mm)
Bouton d'alimentation
1 x Power Button
Voyant LED
1 x LED for Storage Access
USB
4 x USB 3.0
Port COM
1 x RS-232/422/485(Jumper&BIOS)
Voyant LED
2 x LED for Power On/Off & Storage Access
Port LAN
2 x RJ45
VGA
1 x VGA
HDMI
2 x HDMI 1.4b
Antenne
2 x Antenna Mounting with Dust Cover
Entrée CA/CC
1 x Lockable DC Jack
Codec audio
Realtek ALC888S
Chipset graphique
Intel® HD Graphics 500 (N3350/J3455)
Intel® HD Graphics 505 (N4200)
Résolution
1 x VGA: Max. Resolution 1920 x 1200@60Hz
2 x HDMI 1.4b: Max. Resolution 3840x2160@30Hz (HDMI 1.4b)
Informations de certification
CE, FCC Class B, UKCA
Chipset LAN
2 x Intel® I210AT
Spécifications
10/100/1000 Base-Tx Gigabit Ethernet Compatible
ACPI
Single Power ATX Support S0, S3, S4, S5
ACPI 5.0 Compliant
Mode d'alimentation
AT/ATX (ATX is default setting)
Adaptateur
Input: 100 ~ 240Vdc/ 50 ~ 60Hz
Output: 12V/5A AC-DC 60W Adapter
OS
Win 10, Linux
Informations de commande
Intel® Pentium®/Celeron® Processor Fanless Tiny System
EPC-APL-42-C2-1R (N4200)
EPC-APL-33-C2-1R (N3350)
EPC-APL-34-C2-1R (J3455)
Qu'est-ce que le EPC-APL ?
The EPC-APL is a système informatique manufactured by Avalue, designed specifically for compact-computing-system applications. It features réseau of Monitoring CPU Temperature, Voltage with Auto Throttling Control, os of AMI BIOS, 128Mbit SPI Flash ROM and certification of CE, FCC Class B, UKCA. The Avalue EPC-APL is a compact computing system powered by Intel® Apollo Lake processors. It features a fanless design, multiple I/O ports including USB, HDMI, and LAN, and supports a wide temperature range, making it suitable for industrial applications. This system is designed for reliability and efficiency in various industrial environments, providing robust performance in a compact form factor.
Caractéristiques et avantages clés
- Intel® Pentium®/Celeron® Processor
- Single DRAM Socket, Max. Up to 8GB DDR3L 1866MHz
- Rich I/O, 1-VGA, 1-COM, 2-HDMI, 2-LAN, 4-USB3.0, 2-Antennal Mounting
- Fanless Operating from -10°C ~ 50°C
- Wide Range DC Power Input from 12V ~ 26V
- Compact Size, 177mm x 123mm x 43.5mm
- Optional VESA / DIN-Rail Kit
- TPM 2.0
Applications et cas d'usage
Le EPC-APL est idéal pour de nombreuses applications d'automatisation industrielle :
- Dust-sensitive environments and silent operation requirements
- Reliability and efficiency in various industrial environments
- DC-powered industrial installations and mobile applications
- High-performance computing and data processing tasks
- Networked industrial systems and data communication
- Panel-mounted installations and control cabinets
- Peripheral device connectivity and data transfer
- DIN rail mounting in industrial control panels
Questions fréquentes
A Compact Computing System (CCS) is a small form factor computer designed for industrial and commercial applications with limited space. These systems feature reduced physical dimensions while maintaining essential computing capabilities, I/O connectivity, and industrial-grade reliability. CCS units are ideal for edge computing, IoT gateways, digital signage, automation control, and various embedded applications where space efficiency is crucial.
Compact Computing Systems offer numerous advantages including smaller physical footprint for space-constrained deployments, lower power consumption, fanless cooling for dusty environments, wide temperature operation, industrial-grade components for 24/7 reliability, extended product lifecycles, multiple mounting options, extensive I/O capabilities in a small package, and resistance to shock and vibration for challenging environments.
Compact Computing Systems utilize a range of processors including Intel Celeron, Pentium, Core, and Atom series; AMD Ryzen Embedded processors; and ARM-based SoCs. The selection depends on the performance requirements, with options ranging from low-power, efficient processors for basic tasks to high-performance multi-core CPUs for demanding applications like AI inference, machine vision, and multi-display control systems.
Compact Computing Systems achieve fanless cooling through advanced thermal design including extruded aluminum chassis that act as heat sinks, internal heat pipes that transfer heat from components to the chassis, strategic component layout to optimize heat dissipation, thermal interface materials to improve heat transfer, and specially designed fins or ridges on external surfaces to increase the cooling area. This passive cooling approach eliminates noise, prevents dust ingress, and improves system reliability.
Compact Computing Systems offer versatile mounting options including DIN rail mounting for industrial control cabinets, VESA mounting for attachment to monitors or walls (typically using 75mm or 100mm patterns), wall mounting with specific brackets, desktop placement with rubber feet, rack shelf mounting, and specialized vehicle or machinery mounts. This flexibility allows CCS units to be installed in virtually any environment where space is limited.
The EPC-APL features an Intel Apollo Lake processor (Celeron N3350/Pentium N4200), up to 8GB DDR3L memory, multiple storage options (M.2, mSATA, 2.5" SATA), extensive I/O including 4 COM ports, 4 USB 3.0 ports, dual Gigabit LAN, dual display support (HDMI/VGA), wide voltage input (9-24V DC), wide temperature operation (-10°C to 60°C), and DIN rail or wall mounting options. Its design makes it suitable for industrial automation, transportation systems, and factory applications.
The EPC-APL offers significant connectivity advantages for industrial control including 4 serial COM ports supporting RS-232/422/485 for legacy equipment, dual Intel Gigabit LAN ports enabling network redundancy, isolated digital I/O (optional) for direct sensor and actuator connections, multiple USB 3.0 ports for high-speed peripherals, dual independent displays supporting different interfaces, and expansion capabilities via mini PCIe slots. This extensive I/O in a compact, ruggedized form factor enables the system to interface with diverse industrial equipment without requiring additional converters or adapters.
The EPC-APL ensures reliability in industrial environments through several design features including wide temperature operation from -10°C to 60°C, fanless cooling eliminating a common failure point, wide voltage input with protection against surges and transients, vibration and shock resistance tested to industrial standards, high-quality industrial capacitors rated for extended temperature range, over-current and over-voltage protection circuits, watchdog timer functionality for system recovery, ECC memory support for data integrity, and industrial-grade flash storage withstanding higher number of write cycles than consumer SSDs.
Compact Computing Systems typically support a wide range of operating systems including Windows 10 IoT Enterprise, Windows 11 Pro/Enterprise, various Linux distributions (Ubuntu, Debian, CentOS, Yocto), real-time operating systems (VxWorks, QNX, RTX), and specialized industrial distributions. Most models provide driver support for both 64-bit and 32-bit operating systems, and many include pre-activation options for Windows or pre-installation services. The specific BIOS/UEFI configurations and driver packages are optimized for industrial applications with long-term deployment requirements and enhanced stability.
Compact Computing Systems typically feature robust networking capabilities including dual Intel Gigabit Ethernet ports supporting teaming and redundancy, Wake-on-LAN functionality, PXE boot support, jumbo frames up to 9KB, IEEE 1588 Precision Time Protocol support, specialized industrial Ethernet protocol support (EtherCAT, Profinet, EtherNet/IP), optional fiber network interfaces for extended distance or high EMI environments, Wi-Fi 6/6E options supporting 2.4GHz and 5GHz bands, Bluetooth 5.x for peripheral connectivity, 4G/5G cellular options for remote deployments, and advanced packet handling capabilities supporting Quality of Service (QoS) and network segregation through VLANs.
Compact Computing Systems offer diverse storage options including high-speed NVMe SSDs in M.2 form factors (2242/2280), SATA SSDs in both M.2 and 2.5" formats, industrial-grade eMMC embedded storage, mSATA modules, optional CFast or SD card slots for removable storage, RAID configurations (0/1/5) on models with multiple storage interfaces, enterprise-grade SSD options with enhanced write endurance (up to 30 DWPD), MLC or 3D TLC NAND technology optimized for industrial temperature ranges, storage devices with power loss protection for data integrity, and conformal-coated storage components for humidity and contaminant resistance in harsh environments.
Compact Computing Systems address security through multiple layers including TPM 2.0 modules for hardware-based security and encryption, UEFI Secure Boot preventing unauthorized boot loaders and operating systems, configurable I/O port disabling capability, optional intrusion detection switches, secure firmware update mechanisms with cryptographic verification, write-protected system partitions, storage device encryption support, optional removable storage with physical security features, support for advanced authentication including biometrics when paired with appropriate peripherals, AMT remote management with secured communication, and compliance with various security standards including NIST guidelines for industrial control systems.
Compact Computing Systems implement comprehensive power management including wide-range DC input supporting industrial power sources (typically 9-36V DC), reverse polarity protection preventing damage from incorrect connections, power surge and transient voltage protection, advanced power states (S0-S5) with configurable wake events, intelligent hibernate capabilities for power failure scenarios, programmable power-on scheduling, watchdog timers ensuring system recovery from software failures, remote power control options via network, GPIO-triggered power modes, graceful shutdown sequencing, battery backup options on select models, and compliance with Energy Star and similar efficiency standards while maintaining industrial-grade reliability and performance.
When mounting Compact Computing Systems, key considerations include ensuring adequate clearance around all sides for proper air circulation (typically 5-10cm minimum), selecting appropriate mounting location away from direct heat sources or extreme vibration, using all designated mounting points with proper hardware to ensure stability, maintaining accessibility to I/O ports and power connections for future maintenance, considering cable management to prevent strain on connectors, ensuring proper orientation as specified in the manual (some units have preferred mounting direction for optimal cooling), verifying weight support capacity of mounting surfaces, providing proper grounding connection, and following industry-specific regulations for equipment installation in specialized environments like transportation or hazardous locations.
For reliable power connection to Compact Computing Systems, several practices are recommended: using the manufacturer-specified power supply or ensuring third-party supplies meet all voltage/current requirements, implementing proper wire gauge selection based on distance and current requirements, adding ferrules to stranded wire ends for secure terminal connections, installing surge protection devices for installations in electrically noisy environments, applying proper torque to terminal screws preventing both loose connections and hardware damage, adding strain relief to prevent cable movement from affecting connections, considering redundant power sources for critical applications, incorporating a buffer/isolation transformer in environments with unstable power, and implementing proper labeling and documentation of power connections for future maintenance.
Critical environmental factors for Compact Computing System installation include ambient temperature ranges (ensuring deployment within the specified operating temperature limits), relative humidity levels (typically 5-95% non-condensing), altitude considerations affecting thermal performance, air quality assessment including dust, corrosive gases, or conductive particulates requiring additional protection, vibration and shock profiles in the installation location, electromagnetic interference sources that may require additional shielding, adequate ventilation ensuring passive cooling can function effectively, protection from direct sunlight or water exposure, consideration of acoustic requirements in noise-sensitive environments, and potential for temperature cycling that may affect component reliability over time.
Best practices for cable management with Compact Computing Systems include using appropriate length cables to minimize excess loops and clutter, implementing proper cable routing to avoid sharp bends exceeding minimum bend radius, applying strain relief to prevent connector damage from cable weight or movement, separating power and signal cables to reduce interference, using shielded cables in high-EMI environments, labeling all connections clearly for future maintenance, securing cables with proper ties or channels without overly compressing them, maintaining accessibility for future changes or troubleshooting, ensuring airflow isn't blocked by cable bundles, using locking connectors where available to prevent accidental disconnection, and considering environmental factors like temperature, UV exposure, or chemical presence when selecting cable types.
Recommended initial setup and BIOS configuration steps include updating to the latest stable BIOS version before deployment, configuring boot device priority and secure boot settings according to security requirements, adjusting power management settings for the specific application needs, enabling or disabling unused I/O ports for security and resource optimization, configuring watchdog timer parameters for appropriate application monitoring, setting correct date/time and configuring NTP synchronization if available, adjusting fan control settings on models with active cooling, configuring remote management features if applicable, saving BIOS settings to profile for quick recovery if needed, documenting all custom BIOS settings for future reference, and performing a controlled power cycle to verify all settings are properly applied and retained.
To diagnose power-related issues, follow these steps: verify input power is within the specified range using a multimeter, check power adapter or supply functionality with known working equipment if possible, inspect power connectors for damage or loose connections, look for status LEDs indicating power state (many units have power good indicators), disconnect all peripherals to eliminate potential short circuits, verify internal CMOS battery if system loses settings, test with alternative power source if available, check for overheating that might trigger thermal protection shutdown, inspect for physical damage that could affect power circuits, and consult system logs through BIOS or operating system for power event errors. If the system has redundant power, verify each power input independently.
If a Compact Computing System fails to boot, follow this systematic approach: verify power supply and connections are functioning correctly, check for any status LEDs or beep codes indicating specific errors, disconnect all external devices except display and essential input devices, try resetting BIOS to default settings using the clear CMOS jumper or button, test with alternative known-working memory if applicable, verify boot device is functioning and properly connected, check for physical damage to components, try booting from recovery media or USB if supported, check display connection and try alternative display or output port, inspect for signs of moisture or corrosion that could cause electrical issues, and review recent changes to hardware or firmware that might have precipitated the issue.
To resolve network connectivity issues: verify physical connection with working ethernet cable and check port LEDs for link status, confirm network interface is enabled in BIOS and not disabled by operating system, check IP configuration settings including possible IP conflicts, verify switch/router port functionality, test with alternative network if available, update network interface drivers to latest stable version, check for MAC address filtering on the network that might block the device, inspect system logs for network-related errors, try disabling and re-enabling the interface, test with static IP instead of DHCP to eliminate addressing issues, and verify no hardware security features are blocking network traffic. For wireless connectivity, also check antenna connections and potential interference sources.
For thermal issues or unexpected shutdowns: check ambient temperature is within specified operating range, ensure all chassis vents are clear of dust and obstructions, verify proper mounting orientation allowing for designed airflow patterns, inspect heat sinks for dust accumulation or detachment from thermal pads, monitor internal temperature using BIOS or operating system utilities, reduce computational load temporarily to see if stability improves, check for processes consuming excessive CPU resources, ensure BIOS and hardware drivers are updated to latest stable versions, verify power supply is adequate for the configuration, inspect logs for thermal events or critical errors preceding shutdowns, and consider adding auxiliary cooling for extreme environments if compatible with the system's environmental rating.
To troubleshoot storage issues or data corruption: run diagnostic utilities provided by the operating system or storage manufacturer to check device health, verify proper connection of storage devices including seating of M.2 or other modular storage, check SMART attributes for early failure indicators, scan for file system errors using appropriate utilities, test with known-good storage device if possible, verify stable power supply as fluctuations can cause corruption, check for excessive vibration that might affect mechanical drives, update storage controller drivers and firmware, inspect logs for I/O errors or unusual patterns, consider potential security issues like malware causing corruption, backup data immediately if possible when corruption is detected, and for critical systems, consider implementing RAID configurations to provide redundancy against single device failure.