Avalue · Système informatique

VMS-APL

Fiche technique

*Prix sur demande. Contactez-nous pour un devis.

Fabricant : Avalue

Points forts

Intel® Pentium®/Celeron®/Atom™ Processor
One 204-pin SODIMM Socket Up to 8GB DDR3L 1866MHz SDRAM
Rich I/O, 1-DP, 1-LVDS, 1-DC-Out, 1-8-bit GPIO, 2-Line-out, 2-Mic-in, 2-LAN, 2-COM, 4-USB
Onboard u-box M8N concurrent GNS module (GPS/QZSS, GLONASS, BeiDou)
Rugged Fanless Design Compliant with MIL-STD-810G
Power Management and Low Voltage Protection Design
Wake on RTC/SMS Via WWAN Module
Optional CAN modules supports OBD II, SAE J1939 or J1708
Wide Range DC Power Input from 9 ~ 36V
Fanless Operating from -20/40 ~ 70°C
Supports TPM 1.2/2.0 (Factory Option), SD card(SD 3.0)

Description du produit

The Avalue VMS-APL is a compact, fanless modular computing system designed for vehicular and mobile applications, powered by Intel® Apollo Lake processors. It offers robust connectivity options, including multiple USB, LAN, and COM ports, making it suitable for demanding environments.

The system supports wide temperature ranges, ensuring reliable performance in harsh conditions.

Caractéristiques techniques

Processeur

Intel® Pentium® Processor N4200 (2M Cache, up to 2.5 GHz)

Intel® Celeron® Processor N3350 (2M Cache, up to 2.4 GHz)

Intel® Celeron® Processor J3455 (2M Cache, up to 2.3 GHz)

Intel Atom® x7-E3950 Processor (2M Cache, up to 2.00 GHz)

Intel Atom® x5-E3940 Processor (2M Cache, up to 1.80 GHz)

Intel Atom® x5-E3930 Processor (2M Cache, up to 1.80 GHz)

Mémoire système

1 x 204-Pin DDR3L 1866MHz SO-DIMM up to 8 GB

Chien de garde (watchdog)

H/W Reset, 1sec. ~ 65535sec.

Surveillance de l'état matériel

CPU & system temperature monitoring and Voltages monitoring

SBC

EBM-APLV

Température de fonctionnement

N4200/ N3350/J3455

With extended temperature peripherals: -20°C ~ 70°C (-4°F ~ 158°F) with air flow

E3950/ E3940/ E3930

With extended temperature peripherals: -40°C ~ 70°C (-40°F ~ 158°F) with air flow

Température de stockage

-30°C ~ 70°C (-22°F ~ 158°F)

Humidité en fonctionnement

40°C @ 95% Relative Humidity, Non-condensing

Dimensions (larg. x long. x haut.)

239mm x 186mm x 62mm

Poids

2.6kg (system)

3.2kg (w/package)

Test de vibrations

Operating with SSD : MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure

Storage with SSD : MIL-STD-810G, Method 514.6, Category 24, minimum integrity test

Test de chocs

Operating with SSD : MIL-STD-810G, Method 516.6, Procedure I, functional shock=20G

Non-Operating with SSD : MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75G

Kit de montage

Wall mount kit (standard)

PCIe

2 x Mini-PCIe socket (PCIe + USB) for WLAN / WWAN option (w/ SIM Slot)

IET

1 x Avalue 80-Pin IET Interface (1 x DP, 4 x PCIex1, 3 x USB2.0, 1 x LPC, 1 x Line-Out(R/L), 1 x SMBus)

Extension

1 x CANBus module Interface (UART), supports OBDII, SAE J1939/J1708 (Factory Option)

M.2

1 x M.2 Key-B 2242, support SATA III

Baie de disque 2,5

1 x 2.5" Drive Bay (SATA III)

Carte MicroSD

1 x SD (3.0)

Bouton d'alimentation

1 x Push Button for Power on/off

Bouton de réinitialisation

1 x Push Button for Reset

Voyant LED

1 x Power LED (Blue)

1 x Storage LED (Yellow)

1 x WLAN LED (Green)

1 x WWAN LED (Green)

USB

2 x USB 3.0

E/S numériques

1 x 8-Bit GPIO

(Digital Input)

Input Voltage (Internal Type): 5VDC TTL (default)

Input Voltage (Source Type): 0~30 VDC

(Digital Output)

Digital Output (Sink Type): 5VDC TTL (default), max current: 20mA

Digital Output (Source Type): 0~30VDC, max current: 250mA

Audio

1 x Mic-In, 1 x Line-Out

Emplacement SIM

2 x SIM Card Slots (External Accessible)

USB

2 x USB 3.0

Port COM

2 x RS-232/422/485 (Jumper)

Port LAN

2 x RJ-45

Bus CAN

CANbus modules supports OBDII, SAE J1939/J1708 (Factory Option)

Audio

1 x Mic-in,1 x Line-Out

DP

1 x DP

LVDS

1 x LVDS

Antenne

5 x Antenna Mounting with Dust Cover

Entrée CA/CC

3-Pin Terminal Block

Sortie CC

2-Pin Terminal Block

Codec audio

Realtek ALC888S

supports 2.1-CH

Chipset graphique

Processor Graphics

Intel® HD Graphics 505 (N4200, E3950)

Intel® HD Graphics 500 (E3950, E3940, E3930)

Résolution

DP: Max. Resolution 4096x2160 @ 60Hz

LVDS: Max. Resolution 1920x1200 @ 60Hz

Chipset

Onboard u-blox NEO-M8N module supports GPS/ Gloness/ QZSS/ Galileo/ Beidou

Sensibilité

Industry leading, 167 dBm navigation sensitivity Product variants to meet performance and cost requirements Combines low power consumption and high sensitivity

Informations de certification

CE, FCC Class B, e13 Mark, ISO7637-2, IP50 Rating

Chipset LAN

2 x Intel® I211AT

Spécifications

10/100/1000 Base-Tx GbE compatible

Spéc. d'entrée de tension

Typical 12/24 Vdc ( +9~ 36V )

Connecteur d'entrée de tension

3-Pin Terminal Block

Spéc. de sortie DC

12Vdc/6A

Connecteur de sortie DC

2-Pin Terminal Block

ACPI

Single power ATX Support S0,S3, S4, S5

ACPI 5.0 Compliant

Mode d'alimentation

Vehicle Power Mode (Default Setting)

Industrial PC Power Mode supports AT/ATX

OS

Win 10, Linux

Android (by request)

Informations de commande

Intel® Apollo Lake Pentium®/Celeron® Processor Fanless Vehicle Telematics System

VMS-APL-N42-B1-1R (N4200)

VMS-APL-N33-B1-1R (N3350)

VMS-APL-J34-B1-1R (J3455)

VMS-APL-E50-B1-1R (E3950)

VMS-APL-E40-B1-1R (E3940)

VMS-APL-E30-B1-1R (E3930)

Qu'est-ce que le VMS-APL ?

The VMS-APL is a système informatique manufactured by Avalue, designed specifically for modular-computing-system applications. It features réseau of CPU & system temperature monitoring and Voltages monitoring, os of 1 x SD (3.0) and certification of CE, FCC Class B, e13 Mark, ISO7637-2, IP50 Rating. The Avalue VMS-APL is a compact, fanless modular computing system designed for vehicular and mobile applications, powered by Intel® Apollo Lake processors. It offers robust connectivity options, including multiple USB, LAN, and COM ports, making it suitable for demanding environments. The system supports wide temperature ranges, ensuring reliable performance in harsh conditions.

Caractéristiques et avantages clés

Intel® Pentium®/Celeron®/Atom™ Processor
One 204-pin SODIMM Socket Up to 8GB DDR3L 1866MHz SDRAM
Rich I/O, 1-DP, 1-LVDS, 1-DC-Out, 1-8-bit GPIO, 2-Line-out, 2-Mic-in, 2-LAN, 2-COM, 4-USB
Onboard u-box M8N concurrent GNS module (GPS/QZSS, GLONASS, BeiDou)
Rugged Fanless Design Compliant with MIL-STD-810G
Power Management and Low Voltage Protection Design
Wake on RTC/SMS Via WWAN Module
Optional CAN modules supports OBD II, SAE J1939 or J1708
Wide Range DC Power Input from 9 ~ 36V
Fanless Operating from -20/40 ~ 70°C
Supports TPM 1.2/2.0 (Factory Option), SD card(SD 3.0)

Applications et cas d'usage

Le VMS-APL est idéal pour de nombreuses applications d'automatisation industrielle :

Rugged industrial applications with high durability requirements
Dust-sensitive environments and silent operation requirements
DC-powered industrial installations and mobile applications
Extreme temperature environments and outdoor installations
High-performance computing and data processing tasks
Networked industrial systems and data communication
Peripheral device connectivity and data transfer
Memory-intensive applications and multitasking

Questions fréquentes

The VMS-APL is a specialized vehicle-mounted computing system featuring Intel Apollo Lake processors, designed for vehicular applications with ignition control, wide voltage input (9-36V), and integrated CAN bus support for vehicle communication. It offers wide temperature operation, vibration resistance (5Grms), shock resistance (50Grms), versatile I/O including multiple USB, COM, LAN, and HDMI/DP ports, wireless connectivity options, and fanless design. These features make it suitable for a range of vehicle applications including fleet management, heavy machinery, emergency vehicles, and public transportation.

The VMS-APL features comprehensive vehicle integration capabilities including ignition control for proper system startup/shutdown aligned with vehicle operation, wide voltage input (9-36V) compatible with both 12V and 24V vehicle electrical systems, CAN bus interface for accessing vehicle data, power control with delay timing to prevent data loss during irregular power conditions, and built-in super capacitor backup for safe shutdown during unexpected power loss. These features enable seamless integration with a variety of vehicles while protecting the system from the electrical challenges of vehicular environments.

The VMS-APL addresses vehicle-mounted operation challenges through several design features: high vibration and shock resistance (5Grms/50Grms) for durability during vehicle movement, wide temperature operation for functionality in uncontrolled vehicle environments, fanless design to prevent dust ingress, power protection against vehicle electrical system fluctuations, secure mounting options, wide voltage input compatibility with different vehicle electrical systems, and software utilities for power management during ignition cycles. These features ensure reliable operation despite the harsh conditions typical in vehicular applications.

The VMS-APL is ideal for a wide range of vehicular applications including fleet management systems for tracking and monitoring commercial vehicles, public transportation systems requiring passenger information displays and ticketing, emergency vehicles needing robust computing for dispatch and communication, heavy machinery and construction equipment control systems, agricultural vehicle automation, utility service vehicles, delivery and logistics management, mining equipment, railway systems, and any mobile application requiring reliable computing integrated with vehicle operations and data.

A Modular Computing System is an industrial-grade computer designed with modular components that can be interchanged or expanded to customize the system for specific applications. These systems typically feature a base unit with core processing capabilities and standardized interfaces for connecting specialized modules that add functionality such as additional I/O, communication protocols, or industry-specific features. This modularity provides flexibility, scalability, and future-proofing while maintaining the reliability and ruggedness required for industrial environments.

Modular Computing Systems offer several advantages over fixed-configuration computers: customization for specific application requirements, ability to adapt to changing needs without replacing the entire system, simpler upgrades by replacing only specific modules, reduced spare parts inventory, greater longevity as new technologies can be integrated via module updates, streamlined maintenance, and better return on investment through scalability. These benefits make modular systems particularly valuable in industrial environments where requirements evolve and system longevity is important.

An IET (Interface Extension Technology) module is a specialized expansion module used in systems like the EMS series to add specific functionality to the base computing platform. These modules connect to a standardized interface on the main system and provide additional capabilities such as extra COM ports, LAN ports, PoE functionality, or specialized interfaces like CAN bus. IET modules are important because they allow a single base system to be customized for diverse applications by simply changing the module, providing flexibility while maintaining a standardized core platform.

Industries benefiting from modular computing systems include manufacturing (automation control, data collection), transportation (fleet management, railway systems), utilities (substation monitoring, grid control), healthcare (medical equipment integration), retail (point-of-sale, inventory management), building automation (HVAC, access control), defense, aerospace, and smart city infrastructure. Applications requiring customization, future expansion, diverse I/O needs, or adaptation to legacy systems particularly benefit from the flexibility and scalability these systems provide while maintaining industrial-grade reliability.

Wide temperature operation (typically -40°C to 70°C for industrial systems) ensures reliable functioning in non-climate-controlled industrial environments like factory floors, outdoor installations, vehicles, and remote locations. This capability is achieved through careful component selection, thermal design, and elimination of moving parts like fans. Systems with wide temperature ranges can be deployed in harsh conditions without requiring expensive climate control systems, reducing installation and operating costs while improving reliability.

Fanless design means the computer uses passive cooling techniques with heat sinks and thermal engineering instead of active cooling fans. This design is crucial for industrial computers because it eliminates a common point of failure (the fan motor), prevents dust and contaminant ingress that could clog filters and cause overheating, enables sealed enclosures for harsh environments, reduces maintenance requirements, eliminates fan noise, and improves overall system reliability and longevity in challenging industrial conditions with dust, vibration, and temperature fluctuations.

TPM (Trusted Platform Module) 2.0 is a specialized security chip that provides hardware-based encryption capabilities, secure storage for authentication credentials, and system integrity verification. In industrial systems, TPM helps protect sensitive data, secure communication channels, prevent unauthorized access or tampering, and ensure the integrity of control systems. As industrial systems become more connected, TPM provides essential security features to protect against cyber threats targeting critical infrastructure and manufacturing systems.

Vibration and shock resistance are critical for industrial computing systems operating in environments with mechanical disturbances from machinery, vehicles, or handling. Systems are tested to standards like IEC 60068-2-64 (vibration) and IEC 60068-2-27 (shock) to ensure they can withstand these forces without component failure or connection issues. This resilience is achieved through solid-state storage, elimination of moving parts, reinforced component mounting, specialized chassis design, and industrial-grade components, ensuring reliable operation in mechanically challenging environments.

When installing modular computing systems, consider proper thermal management (ensuring adequate airflow around the unit), environmental protection (enclosures appropriate for dust/moisture levels), power quality (stable power source with appropriate voltage and backup options), EMI/RFI isolation (distance from high-interference sources), physical security, accessibility for module swapping and maintenance, proper grounding, cable management (strain relief and protection), and compliance with local regulations and industry standards. Proper planning ensures reliable operation and maximizes the benefits of the system's modular nature.

For fanless modular systems, proper thermal management is crucial: ensure adequate clearance around all sides (typically 5-10cm minimum), avoid enclosing in sealed cabinets without ventilation, mount vertically if possible to enhance natural convection cooling, install away from other heat-generating equipment, consider ambient temperature fluctuations in the installation location, follow manufacturer's mounting recommendations (which often include heat-dissipating brackets), and periodically check for dust accumulation on cooling surfaces. For high-temperature environments, consider additional passive cooling solutions or environmental controls.

For modular computing systems, select a power supply with sufficient wattage for the base system plus all modules (with 20-30% headroom for future expansion), ensure voltage matching the system's input range (typically 9-36V DC for industrial systems), implement surge protection for industrial environments with electrical noise, consider redundant power options for critical applications, use proper wire gauge for current requirements, and potentially include an uninterruptible power supply (UPS) for protection against power outages. The power system should account for the maximum possible configuration with all modules installed.

Best practices for cable management with modular systems include using appropriate cable types for the industrial environment (shielded where necessary), implementing strain relief to prevent connector damage, securing cables to prevent accidental disconnection due to vibration, labeling cables clearly for easier maintenance and troubleshooting, maintaining minimum bend radii to prevent internal damage, using cable trays or conduits for protection, separating power and data cables to minimize interference, allowing sufficient service loops for module replacement without disconnecting cables, and ensuring accessibility for future changes while maintaining a neat installation.

If the system fails to power on, check that the power supply provides the correct voltage within the system's input range (typically 9-36V DC), ensure connections are secure at both the power supply and system, verify any power switches or ignition control settings are correctly configured, check for tripped circuit breakers or blown fuses, inspect for visible damage to power connectors, test with an alternative known-good power supply if available, verify the power LED indicators, and check if the system is in AT mode requiring a specific power signal. For vehicle-mounted systems, ensure the ignition control is properly connected.

For issues with modules or expansion capabilities, verify the module is properly seated and secured, check power cycling the system after confirming connections, ensure any module-specific drivers are installed, check BIOS/UEFI settings for module-related options, inspect for physical damage to connectors, try an alternative slot if available, test with a known-working module to verify slot functionality, check system logs for error messages, and consult module-specific documentation for jumper settings or configuration requirements. After replacing modules, validate that the system recognizes the change through device manager or system information utilities.

For overheating issues, ensure adequate clearance around the system (minimum 5-10cm on all sides), check that the installation position allows for proper convection cooling (typically vertical mounting), clean dust from the chassis and heat sink fins using compressed air (when powered off), verify ambient temperature is within specifications, check system temperature through monitoring utilities or BIOS, ensure any thermal interface materials are properly applied if the system has been serviced, examine CPU usage for processes causing excessive load, and consider adding auxiliary passive cooling or relocating the system to a cooler environment if persistent.

To diagnose communication issues, first identify the specific interface (COM, LAN, USB, etc.) experiencing problems. Check physical connections and cables for damage, verify device driver installation and updates, confirm port configuration settings (baud rate, parity, etc. for serial connections; IP settings for network), try alternative cables or ports to isolate the issue, check for resource conflicts in Device Manager, test with a known-working device, verify any required protocol converters or adapters are functioning, and use diagnostic tools appropriate to the interface type (terminal emulator for serial, ping/traceroute for network) to identify where communication fails.

Points forts

Description du produit

Caractéristiques techniques

Informations système

Processeur

Mémoire système

Chien de garde (watchdog)

Surveillance de l'état matériel

SBC

Mécanique et environnement

Température de fonctionnement

Température de stockage

Humidité en fonctionnement

Dimensions (larg. x long. x haut.)

Poids

Test de vibrations

Test de chocs

Kit de montage

Extension

PCIe

IET

Extension

Stockage

M.2

Baie de disque 2,5

Carte MicroSD

E/S en face avant

Bouton d'alimentation

Bouton de réinitialisation

Voyant LED

USB

E/S numériques

Audio

Emplacement SIM

E/S en face arrière

USB

Port COM

Port LAN

Bus CAN

Audio

DP

LVDS

Antenne

Entrée CA/CC

Sortie CC

Audio

Codec audio

Écran

Chipset graphique

Résolution

Chipset

Sensibilité

Certifications

Informations de certification

Ethernet

Chipset LAN

Spécifications

Alimentation requise

Spéc. d'entrée de tension

Connecteur d'entrée de tension

Spéc. de sortie DC

Connecteur de sortie DC

ACPI

Mode d'alimentation

Prise en charge logicielle

OS

Informations de commande

Informations de commande

Qu'est-ce que le VMS-APL ?

Caractéristiques et avantages clés

Applications et cas d'usage

Questions fréquentes