Avalue · Sistema di elaborazione
ACS10-TGU
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Produttore: Avalue
In evidenza
- 11th Gen Intel® Core™ i5/i3 Tiger Lake-UP3 Processor
- Intel® Iris® Xe/ UHD Graphics Engine
- 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
- 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
- 2-COM Port (RS-232/422/485 & RS-232)
- 2-Audio Jack (Line-Out & Mic-In)
- 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
- 2-Expansion Slot (M.2 Key-E, Key-B)
- 6-USB Port (3-USB 3.2 & 3-USB 2.0)
- CE, FCC Class A, UKCA
Descrizione del prodotto
The Avalue ACS10-TGU is a compact computing system powered by Intel® Tiger Lake processors, designed for industrial applications. It features a fanless design, multiple I/O interfaces including USB, HDMI, and LAN, and supports wide temperature ranges.
This system is ideal for applications requiring high performance in a small, rugged form factor, offering reliability and flexibility for various industrial tasks.
Specifiche tecniche
Processore
Intel® Core™ i5-1135G7 Processor (TDP 15W) (Default)
Intel® Core™ i3-1115G4 Processor (TDP 15W) (Default)
Intel® Core™ i7-1165G7 Processor (TDP 15W) (Project Based)
Intel® Core™ i7-1185G7E Processor (TDP 15W) (Project Based)
Intel® Core™ i5-1145G7 Processor (TDP 15W) (Project Based)
Intel® Celeron 6305E Processor (TDP 15W) (Project Based)
Memoria di sistema
Single 260-Pin SO-DIMM Socket, Max. Up to 32GB DDR4 3200MHz
Watchdog timer
H/W Reset, 1sec., 65535sec./min.1sec. or 1min. step.
Informazioni BIOS
AMI uEFI BIOS, 256Mbit SPI Flash ROM
Monitoraggio dello stato hardware
CPU temperature monitoring and voltage monitoring
SBC
ECM-TGUC
TPM
TPM 2.0
Temperatura di esercizio
With wide-temp storage: 0°C ~ 50°C (32°F ~ 122°F) with 0.5m/s air flow
With general storage: 0°C ~ 40°C (32°F ~ 122°F) with 0.5m/s air flow
Temperatura di stoccaggio
-40°C ~ 75°C (-40°F ~ 167°F)
Umidità di esercizio
40°C @ 95% Relative Humidity, Non-condensing
Dimensioni (L x P x A)
188mm x 120mm x 48mm
Peso
835g
Test di vibrazione
With SSD: 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 30min/Axis
Test di urto
IEC 60068-2-27, Half Sine, 11ms
Test di caduta
ISTA 2A, IEC-60068-2-32 Test : Ed, 1 Corner, 3 Edges, 6 Faces
Kit di montaggio
Wall Mount Kit
M.2
1 x M.2 Key-E 2230 (PCIe, USB 2.0)
1 x M.2 Key-M 2280 NVMe (PCIe Gen4 x 4)
M.2
1 x M.2 Key-B 2242 (SATA3)
1 x M.2 Key-M 2280 NVMe (PCIe Gen4 x 4)
Pulsante di accensione
1 x Power Buttonw/LED
Porta COM
1 x RS-232/422/485 (Default RS-232)
1 x RS-232
Audio
1 x Line-Out
1 x Mic-In
USB
3 x USB 3.2 Gen.2
3 x USB 2.0
Porta COM
1 x RS-232/422/485 (Default RS-232)
1 x RS-232
Indicatore LED
1 x Power on/off LED
1 x Storage Access
Porta LAN
2 x RJ45
Audio
1 x Mic-in
1 x Line-out
DP
2 x DP++
HDMI
1 x HDMI 2.0b
Antenna
2 x Antenna Mounting with Dust Protection Cover
Ingresso AC/DC
Lockable DC Jack
Antenna
2 x Antenna Mounting with Dust Protection Cover
Antenna
2 x Antenna Mounting with Dust Protection Cover
Codec audio
RealTek ALC888S-VD2-GR
Chipset grafico
Intel® Iris® Xe Graphics (i7-1165G7/ i5-1135G7)
Intel® UHD Graphics for 11th Gen Intel® Processors (i3-1115G4)
Risoluzione
DP++ 1.4: 4096x2304@60Hz
Informazioni sulle certificazioni
CE, FCC Class A, UKCA
Chipset LAN
Intel® Ethernet Connection I219-LM (1G)
Intel® Ethernet Controller I225-V (2.5G)
Specifiche
10/100/1000 Gigabit (I219-LM)
10/100/1000/2500 Gigabit (I225-V)
ACPI
Single power ATX Support S0, S3, S4, S5
ACPI 5.0 Compliant
Modalità di alimentazione
AT/ATX (ATX is default setting)
Adattatore
AC to DC Adapter 60W
OS
Win11 64bits, Win10, Linux
Informazioni per l'ordine
11th Gen Intel® Core™ i5/i3 Tiger Lake-UP3 Processor
ACS10-TGU-A1-1R (i3-1115G4)
ACS10-TGU-A1-2R (i5-1135G7)
Che cos'è ACS10-TGU?
The ACS10-TGU is a sistema di elaborazione manufactured by Avalue, designed specifically for compact-computing-system applications. It features processore of Intel® Core™ i5-1135G7 Processor (TDP 15W) (Default), Intel® Core™ i3-1115G4 Processor (TDP 15W) (Default),…, rete of 2 x RJ45 and sistema operativo of AMI uEFI BIOS, 256Mbit SPI Flash ROM. The Avalue ACS10-TGU is a compact computing system powered by Intel® Tiger Lake processors, designed for industrial applications. It features a fanless design, multiple I/O interfaces including USB, HDMI, and LAN, and supports wide temperature ranges. This system is ideal for applications requiring high performance in a small, rugged form factor, offering reliability and flexibility for various industrial tasks.
Caratteristiche e vantaggi principali
- 11th Gen Intel® Core™ i5/i3 Tiger Lake-UP3 Processor
- Intel® Iris® Xe/ UHD Graphics Engine
- 1-260-pin DDR4 3200MHz SO-DIMM, Supports Up to 32GB
- 2-Gigabit Ethernet, 1 x 2.5GbE, 1 x 1GbE
- 2-COM Port (RS-232/422/485 & RS-232)
- 2-Audio Jack (Line-Out & Mic-In)
- 2-Storage (M.2 Key-M NVMe & M.2 Key-B SATA)
- 2-Expansion Slot (M.2 Key-E, Key-B)
- 6-USB Port (3-USB 3.2 & 3-USB 2.0)
- CE, FCC Class A, UKCA
Applicazioni e casi d'uso
ACS10-TGU è ideale per diverse applicazioni di automazione industriale:
- Legacy equipment integration and serial communication
- High-performance computing and data processing tasks
- Networked industrial systems and data communication
- Applications requiring high performance in a small
- Peripheral device connectivity and data transfer
- Memory-intensive applications and multitasking
- Data logging and storage-intensive operations
- Industrial computing and data processing
Domande frequenti
A Compact Computing System (CCS) is a small form factor computer designed for industrial and commercial applications with limited space. These systems feature reduced physical dimensions while maintaining essential computing capabilities, I/O connectivity, and industrial-grade reliability. CCS units are ideal for edge computing, IoT gateways, digital signage, automation control, and various embedded applications where space efficiency is crucial.
Compact Computing Systems offer numerous advantages including smaller physical footprint for space-constrained deployments, lower power consumption, fanless cooling for dusty environments, wide temperature operation, industrial-grade components for 24/7 reliability, extended product lifecycles, multiple mounting options, extensive I/O capabilities in a small package, and resistance to shock and vibration for challenging environments.
Compact Computing Systems utilize a range of processors including Intel Celeron, Pentium, Core, and Atom series; AMD Ryzen Embedded processors; and ARM-based SoCs. The selection depends on the performance requirements, with options ranging from low-power, efficient processors for basic tasks to high-performance multi-core CPUs for demanding applications like AI inference, machine vision, and multi-display control systems.
Compact Computing Systems achieve fanless cooling through advanced thermal design including extruded aluminum chassis that act as heat sinks, internal heat pipes that transfer heat from components to the chassis, strategic component layout to optimize heat dissipation, thermal interface materials to improve heat transfer, and specially designed fins or ridges on external surfaces to increase the cooling area. This passive cooling approach eliminates noise, prevents dust ingress, and improves system reliability.
Compact Computing Systems offer versatile mounting options including DIN rail mounting for industrial control cabinets, VESA mounting for attachment to monitors or walls (typically using 75mm or 100mm patterns), wall mounting with specific brackets, desktop placement with rubber feet, rack shelf mounting, and specialized vehicle or machinery mounts. This flexibility allows CCS units to be installed in virtually any environment where space is limited.
The ACS10-TGU features an 11th Gen Intel Tiger Lake processor (Core i3/i5/i7), up to 64GB DDR4 memory, dual M.2 slots for NVMe storage, exceptional graphics with Intel Iris Xe, extensive I/O including Thunderbolt 4/USB4, multiple display outputs supporting 8K resolution, dual 2.5GbE LAN ports, AI acceleration with Intel DL Boost, and advanced thermal design for high-performance, fanless operation from 0°C to 40°C. Its compact but powerful design makes it ideal for AI edge computing, machine vision, advanced HMI systems, and multimedia applications.
The Intel Tiger Lake platform brings significant performance capabilities to the ACS10-TGU including 10nm SuperFin technology delivering up to 20% better CPU performance than previous generations, Willow Cove core architecture with improved IPC (instructions per cycle), Intel Iris Xe graphics with up to 96 execution units offering dedicated GPU-class performance, integrated Thunderbolt 4 controller, PCIe 4.0 support doubling bandwidth for storage and peripherals, Intel DL Boost with integrated neural processing unit for AI acceleration, and improved media engines supporting multiple 4K streams or 8K content decoding.
The ACS10-TGU balances high performance with thermal constraints through a sophisticated thermal design including a large copper heat pipe system transferring heat from components to the exterior chassis, precision-machined aluminum chassis with maximum surface area for heat dissipation, optimized internal airflow channels for natural convection, strategic component placement to prevent heat concentration, dynamic thermal management with intelligent throttling algorithms, configurable TDP settings to balance performance and heat generation based on the application requirements, and high-efficiency power delivery systems reducing energy loss and heat generation.
Compact Computing Systems typically support a wide range of operating systems including Windows 10 IoT Enterprise, Windows 11 Pro/Enterprise, various Linux distributions (Ubuntu, Debian, CentOS, Yocto), real-time operating systems (VxWorks, QNX, RTX), and specialized industrial distributions. Most models provide driver support for both 64-bit and 32-bit operating systems, and many include pre-activation options for Windows or pre-installation services. The specific BIOS/UEFI configurations and driver packages are optimized for industrial applications with long-term deployment requirements and enhanced stability.
Compact Computing Systems typically feature robust networking capabilities including dual Intel Gigabit Ethernet ports supporting teaming and redundancy, Wake-on-LAN functionality, PXE boot support, jumbo frames up to 9KB, IEEE 1588 Precision Time Protocol support, specialized industrial Ethernet protocol support (EtherCAT, Profinet, EtherNet/IP), optional fiber network interfaces for extended distance or high EMI environments, Wi-Fi 6/6E options supporting 2.4GHz and 5GHz bands, Bluetooth 5.x for peripheral connectivity, 4G/5G cellular options for remote deployments, and advanced packet handling capabilities supporting Quality of Service (QoS) and network segregation through VLANs.
Compact Computing Systems offer diverse storage options including high-speed NVMe SSDs in M.2 form factors (2242/2280), SATA SSDs in both M.2 and 2.5" formats, industrial-grade eMMC embedded storage, mSATA modules, optional CFast or SD card slots for removable storage, RAID configurations (0/1/5) on models with multiple storage interfaces, enterprise-grade SSD options with enhanced write endurance (up to 30 DWPD), MLC or 3D TLC NAND technology optimized for industrial temperature ranges, storage devices with power loss protection for data integrity, and conformal-coated storage components for humidity and contaminant resistance in harsh environments.
Compact Computing Systems address security through multiple layers including TPM 2.0 modules for hardware-based security and encryption, UEFI Secure Boot preventing unauthorized boot loaders and operating systems, configurable I/O port disabling capability, optional intrusion detection switches, secure firmware update mechanisms with cryptographic verification, write-protected system partitions, storage device encryption support, optional removable storage with physical security features, support for advanced authentication including biometrics when paired with appropriate peripherals, AMT remote management with secured communication, and compliance with various security standards including NIST guidelines for industrial control systems.
Compact Computing Systems implement comprehensive power management including wide-range DC input supporting industrial power sources (typically 9-36V DC), reverse polarity protection preventing damage from incorrect connections, power surge and transient voltage protection, advanced power states (S0-S5) with configurable wake events, intelligent hibernate capabilities for power failure scenarios, programmable power-on scheduling, watchdog timers ensuring system recovery from software failures, remote power control options via network, GPIO-triggered power modes, graceful shutdown sequencing, battery backup options on select models, and compliance with Energy Star and similar efficiency standards while maintaining industrial-grade reliability and performance.
When mounting Compact Computing Systems, key considerations include ensuring adequate clearance around all sides for proper air circulation (typically 5-10cm minimum), selecting appropriate mounting location away from direct heat sources or extreme vibration, using all designated mounting points with proper hardware to ensure stability, maintaining accessibility to I/O ports and power connections for future maintenance, considering cable management to prevent strain on connectors, ensuring proper orientation as specified in the manual (some units have preferred mounting direction for optimal cooling), verifying weight support capacity of mounting surfaces, providing proper grounding connection, and following industry-specific regulations for equipment installation in specialized environments like transportation or hazardous locations.
For reliable power connection to Compact Computing Systems, several practices are recommended: using the manufacturer-specified power supply or ensuring third-party supplies meet all voltage/current requirements, implementing proper wire gauge selection based on distance and current requirements, adding ferrules to stranded wire ends for secure terminal connections, installing surge protection devices for installations in electrically noisy environments, applying proper torque to terminal screws preventing both loose connections and hardware damage, adding strain relief to prevent cable movement from affecting connections, considering redundant power sources for critical applications, incorporating a buffer/isolation transformer in environments with unstable power, and implementing proper labeling and documentation of power connections for future maintenance.
Critical environmental factors for Compact Computing System installation include ambient temperature ranges (ensuring deployment within the specified operating temperature limits), relative humidity levels (typically 5-95% non-condensing), altitude considerations affecting thermal performance, air quality assessment including dust, corrosive gases, or conductive particulates requiring additional protection, vibration and shock profiles in the installation location, electromagnetic interference sources that may require additional shielding, adequate ventilation ensuring passive cooling can function effectively, protection from direct sunlight or water exposure, consideration of acoustic requirements in noise-sensitive environments, and potential for temperature cycling that may affect component reliability over time.
Best practices for cable management with Compact Computing Systems include using appropriate length cables to minimize excess loops and clutter, implementing proper cable routing to avoid sharp bends exceeding minimum bend radius, applying strain relief to prevent connector damage from cable weight or movement, separating power and signal cables to reduce interference, using shielded cables in high-EMI environments, labeling all connections clearly for future maintenance, securing cables with proper ties or channels without overly compressing them, maintaining accessibility for future changes or troubleshooting, ensuring airflow isn't blocked by cable bundles, using locking connectors where available to prevent accidental disconnection, and considering environmental factors like temperature, UV exposure, or chemical presence when selecting cable types.
Recommended initial setup and BIOS configuration steps include updating to the latest stable BIOS version before deployment, configuring boot device priority and secure boot settings according to security requirements, adjusting power management settings for the specific application needs, enabling or disabling unused I/O ports for security and resource optimization, configuring watchdog timer parameters for appropriate application monitoring, setting correct date/time and configuring NTP synchronization if available, adjusting fan control settings on models with active cooling, configuring remote management features if applicable, saving BIOS settings to profile for quick recovery if needed, documenting all custom BIOS settings for future reference, and performing a controlled power cycle to verify all settings are properly applied and retained.
To diagnose power-related issues, follow these steps: verify input power is within the specified range using a multimeter, check power adapter or supply functionality with known working equipment if possible, inspect power connectors for damage or loose connections, look for status LEDs indicating power state (many units have power good indicators), disconnect all peripherals to eliminate potential short circuits, verify internal CMOS battery if system loses settings, test with alternative power source if available, check for overheating that might trigger thermal protection shutdown, inspect for physical damage that could affect power circuits, and consult system logs through BIOS or operating system for power event errors. If the system has redundant power, verify each power input independently.
If a Compact Computing System fails to boot, follow this systematic approach: verify power supply and connections are functioning correctly, check for any status LEDs or beep codes indicating specific errors, disconnect all external devices except display and essential input devices, try resetting BIOS to default settings using the clear CMOS jumper or button, test with alternative known-working memory if applicable, verify boot device is functioning and properly connected, check for physical damage to components, try booting from recovery media or USB if supported, check display connection and try alternative display or output port, inspect for signs of moisture or corrosion that could cause electrical issues, and review recent changes to hardware or firmware that might have precipitated the issue.
To resolve network connectivity issues: verify physical connection with working ethernet cable and check port LEDs for link status, confirm network interface is enabled in BIOS and not disabled by operating system, check IP configuration settings including possible IP conflicts, verify switch/router port functionality, test with alternative network if available, update network interface drivers to latest stable version, check for MAC address filtering on the network that might block the device, inspect system logs for network-related errors, try disabling and re-enabling the interface, test with static IP instead of DHCP to eliminate addressing issues, and verify no hardware security features are blocking network traffic. For wireless connectivity, also check antenna connections and potential interference sources.
For thermal issues or unexpected shutdowns: check ambient temperature is within specified operating range, ensure all chassis vents are clear of dust and obstructions, verify proper mounting orientation allowing for designed airflow patterns, inspect heat sinks for dust accumulation or detachment from thermal pads, monitor internal temperature using BIOS or operating system utilities, reduce computational load temporarily to see if stability improves, check for processes consuming excessive CPU resources, ensure BIOS and hardware drivers are updated to latest stable versions, verify power supply is adequate for the configuration, inspect logs for thermal events or critical errors preceding shutdowns, and consider adding auxiliary cooling for extreme environments if compatible with the system's environmental rating.
To troubleshoot storage issues or data corruption: run diagnostic utilities provided by the operating system or storage manufacturer to check device health, verify proper connection of storage devices including seating of M.2 or other modular storage, check SMART attributes for early failure indicators, scan for file system errors using appropriate utilities, test with known-good storage device if possible, verify stable power supply as fluctuations can cause corruption, check for excessive vibration that might affect mechanical drives, update storage controller drivers and firmware, inspect logs for I/O errors or unusual patterns, consider potential security issues like malware causing corruption, backup data immediately if possible when corruption is detected, and for critical systems, consider implementing RAID configurations to provide redundancy against single device failure.