Avalue · Système informatique

EMS-TGL

Fiche technique

*Prix sur demande. Contactez-nous pour un devis.

Fabricant : Avalue

Points forts

11th Gen Intel® Core™ i7/i5/i3 BGA Processor
2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE
Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
CE, FCC Class B, IP50
Wide range DC power input from +9~36V
Support HW TPM 2.0

Description du produit

The Avalue EMS-TGL is a modular industrial computing system powered by Intel® Tiger Lake processors. It is designed for high-performance applications, offering fanless operation, multiple I/O options, and wide temperature support, making it ideal for demanding industrial environments.

The modular design allows for flexibility and scalability in various applications, ensuring robust and reliable performance.

Caractéristiques techniques

Processeur

Intel® Core™ i7-1185GRE Processor (15W, 12M Cache, up to 2.80 GHz), WT

Intel® Core™ i5-1145GRE Processor (15W, 8M Cache, up to 2.60 GHz), WT

Intel® Core™ i3-1115GRE Processor (15W, 6M Cache, up to 3.00 GHz), WT

Intel® Core™ i7-1185G7E Processor (15W, 12M Cache, up to 2.80 GHz), ST

Intel® Core™ i5-1145G7E Processor (15W, 8M Cache, up to 2.60 GHz), ST

Intel® Core™ i3-1115G4E Processor (15W, 6M Cache, up to 3.00 GHz), ST

Mémoire système

2 x 262-pin SODIMM socket Max. up to 64GB DDR5 3200 MT/s

Chipset E/S

EC ITE IT8528E

Informations BIOS

AMI uEFI BIOS 256 Mbit SPI Flash ROM

Chien de garde (watchdog)

H/W Reset, 1sec. ~ 65535sec.

Surveillance de l'état matériel

CPU & system temperature monitoring and Voltages monitoring

SBC

EBM-TGLS

Température de fonctionnement

-40°C ~ 70°C (w/SSD) ambient w/ air flow, WT sku

0°C ~ 70°C (w/SSD) ambient w/ air flow, ST sku

Température de stockage

-30°C ~ 70°C (-22°F ~ 158°F)

Humidité en fonctionnement

40°C @ 95% Relative Humidity, Non-condensing

Dimensions (larg. x long. x haut.)

240mm x 150mm x 48 mm (Standard)

240mm x 150mm x 69 mm (w/ IET module)

Poids

2.1 kg (System)

2.9 kg (w_Package)

Test de vibrations

With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 1hr/axis

Test de chocs

With SSD : 55Grms, IEC 60068-2-27, Half Sine, 11ms

Indice de protection

IP 50

Kit de montage

Wall mount kit (standard)

DIN RAIL (optional)

M.2

1 x M.2 Key-B 2242/3042/3052 support SATA3/ PCIeIII x1/ USB3.1 and SIM slot1

1 x M.2 Key-E 2230 for Wi-Fi & BT Module(CNVi)

IET

1 x IET interface (1 x DDI, 2x PCIe3 x 2, 3 x USB2.0, 1 x Line-Out(R/L), 1 x SMBus, LPC)

M.2

1 x M.2 Key-M 2242/2280, support PCIe Gen. III x 4 (NVMe SSD)

1 x M.2 Key-B 2242, support SATA (share with expansion slot)

Bouton d'alimentation

1 x Push Button for Power on/off

Bouton de réinitialisation

1 x Push Button for Reset

Voyant LED

1 x Power LED (Blue)

1 x Storage LED (Yellow)-M.2 B-key SATA

1 x LTE LED (Green)- M.2 B-key PCIe

1 x Wifi LED (Green)- M.2 E key

Port COM

2 x COM RS232/422/485 (select via BIOS, auto flow control via HW)

E/S numériques

1 x 8-bit GPIO (DB9)

Marche/arrêt par commande filaire

2-Pin Terminal Block

Antenne

2 x Antenna with dust cover

USB

2 x USB 3.1 Gen.2 (10Gbp/s)

2 x USB 3.1 Gen.1 (5Gbp/s)

Port LAN

2 x RJ-45

Audio

Mic-In, Line-Out

DP

1 x DP 1.4

HDMI

1 x HDMI 2.0b

Emplacement SIM

1 x internal SIM slot

Antenne

2 x Antenna with dust cover

Entrée CA/CC

3-Pin Terminal Block (V+. V-, GND)

Antenne

2 x Antenna with dust cover

Antenne

2 x Antenna with dust cover

Codec audio

Realtek ALC888S HD codec

Chipset graphique

Intel® Iris® Xe Graphics (i7-1185GRE/i5-1145GRE/i7-1185G7E/i5-1145G7E)

Intel® UHD Graphics for 11th Gen Intel® Processors (i3-1115GRE/i3-1115G4E)

Résolution

DP++ 1.4: 4096x2304 @ 60Hz

HDMI 2.0b : Max. resolution 4096x2304 @ 60Hz

Informations de certification

CE, FCC Class B

Chipset LAN

1 x Intel® I225-LM

1 x Intel® I219-LM

Spécifications

1 x 10/100/1000/2.5G Base-Tx GbE compatible

1 x 10/100/1000Base-Tx GbE compatible.

Spéc. d'entrée de tension

DC in typical 12/24V (+9V ~ +36V), wide voltage single power input

TVS component for surge protection

Reverse current/voltage protection(Max. Currency: 13A)

Connecteur d'entrée de tension

3-Pin Terminal Block (V+. V-, GND)

ACPI

Single power ATX Support S0,S3, S4, S5

ACPI 5.0 Compliant

Mode d'alimentation

AT/ATX (ATX is default setting)

OS

Win 10 64bit , Linux

Informations de commande

Intel® 11th Tiger Lake Core™ Processor i7/i5/i3 Fanless Rugged Embedded System

EMS-TGL-W85-A1-1R (i7-1185GRE)

EMS-TGL-W45-A1-1R (i5-1145GRE)

EMS-TGL-W15-A1-1R (i3-1115GRE)

EMS-TGL-S85-A1-1R (i7-1185G7E)

EMS-TGL-S45-A1-1R (i5-1145G7E)

EMS-TGL-S15-A1-1R (i3-1115G4E)

Qu'est-ce que le EMS-TGL ?

The EMS-TGL is a système informatique manufactured by Avalue, designed specifically for modular-computing-system applications. It features réseau of CPU & system temperature monitoring and Voltages monitoring, os of AMI uEFI BIOS 256 Mbit SPI Flash ROM and certification of CE, FCC Class B. The Avalue EMS-TGL is a modular industrial computing system powered by Intel® Tiger Lake processors. It is designed for high-performance applications, offering fanless operation, multiple I/O options, and wide temperature support, making it ideal for demanding industrial environments. The modular design allows for flexibility and scalability in various applications, ensuring robust and reliable performance.

Caractéristiques et avantages clés

11th Gen Intel® Core™ i7/i5/i3 BGA Processor
2x 260-pin SODIMM socket Max. up to 64GB DDR4 3200MT/s
Rich I/O, 4-USB3.1, 1-DP, 1-HDMI, 2-COM, 2-LAN, 1-8bit GPIO.
Support 5G (Sub-6G) module, M.2 NVMe SSD Gen. III x 4, HDMI 2.0b (4K @ 60Hz), LAN 2.5G Base-Tx GbE
Fanless operation temperature from -40°C ~ 70°C (WT) / 0°C ~ 70°C (ST)
CE, FCC Class B, IP50
Wide range DC power input from +9~36V
Support HW TPM 2.0

Applications et cas d'usage

Le EMS-TGL est idéal pour de nombreuses applications d'automatisation industrielle :

Dust-sensitive environments and silent operation requirements
DC-powered industrial installations and mobile applications
Extreme temperature environments and outdoor installations
High-performance computing and data processing tasks
Networked industrial systems and data communication
Peripheral device connectivity and data transfer
Memory-intensive applications and multitasking
Data logging and storage-intensive operations

Questions fréquentes

The EMS-TGL is a high-performance modular embedded computing system powered by 11th Generation Intel Tiger Lake processors, offering significantly more processing power than Elkhart Lake-based systems. While detailed specifications are limited in the provided data, it likely features enhanced graphics capabilities, PCIe 4.0 support, integrated Thunderbolt connectivity, increased memory bandwidth, and AI acceleration features inherent to Tiger Lake architecture, while maintaining the industrial-grade reliability, fanless design, and expansion flexibility characteristic of the EMS series.

The EMS-TGL, based on Intel's 11th Gen Tiger Lake architecture, offers substantial performance advantages over the Elkhart Lake-based EMS-EHL series, including higher CPU performance with improved IPC (instructions per clock), significantly more powerful Intel Xe graphics with enhanced media encoding/decoding capabilities, PCIe 4.0 support for faster peripherals, Thunderbolt 4 connectivity options, and Intel Deep Learning Boost with enhanced AI acceleration. These improvements make it suitable for more demanding workloads including edge AI, advanced HMI, multi-display applications, and real-time analytics.

The EMS-TGL's enhanced performance makes it particularly suitable for demanding industrial applications such as machine vision and inspection systems, edge AI and machine learning implementations, complex HMI with multiple high-resolution displays, advanced industrial control systems requiring significant computational power, real-time data analytics, industrial IoT gateways processing data from numerous sensors, digital twins, simulation systems, and any application that benefits from the combination of high CPU performance, powerful graphics, and AI acceleration in a rugged industrial form factor.

Tiger Lake-based systems like the EMS-TGL typically offer enhanced connectivity options including PCIe 4.0 for twice the bandwidth of PCIe 3.0, Thunderbolt 4 ports enabling high-speed peripheral connections (40 Gbps), USB 4.0 support, higher performance DDR4 memory, Wi-Fi 6 (802.11ax) capabilities, 2.5GbE networking, enhanced display outputs supporting multiple 4K displays, and improved M.2 expansion options. These connectivity advantages enable more sophisticated system configurations with higher performance peripherals and faster data transfer for demanding industrial applications.

A Modular Computing System is an industrial-grade computer designed with modular components that can be interchanged or expanded to customize the system for specific applications. These systems typically feature a base unit with core processing capabilities and standardized interfaces for connecting specialized modules that add functionality such as additional I/O, communication protocols, or industry-specific features. This modularity provides flexibility, scalability, and future-proofing while maintaining the reliability and ruggedness required for industrial environments.

Modular Computing Systems offer several advantages over fixed-configuration computers: customization for specific application requirements, ability to adapt to changing needs without replacing the entire system, simpler upgrades by replacing only specific modules, reduced spare parts inventory, greater longevity as new technologies can be integrated via module updates, streamlined maintenance, and better return on investment through scalability. These benefits make modular systems particularly valuable in industrial environments where requirements evolve and system longevity is important.

An IET (Interface Extension Technology) module is a specialized expansion module used in systems like the EMS series to add specific functionality to the base computing platform. These modules connect to a standardized interface on the main system and provide additional capabilities such as extra COM ports, LAN ports, PoE functionality, or specialized interfaces like CAN bus. IET modules are important because they allow a single base system to be customized for diverse applications by simply changing the module, providing flexibility while maintaining a standardized core platform.

Industries benefiting from modular computing systems include manufacturing (automation control, data collection), transportation (fleet management, railway systems), utilities (substation monitoring, grid control), healthcare (medical equipment integration), retail (point-of-sale, inventory management), building automation (HVAC, access control), defense, aerospace, and smart city infrastructure. Applications requiring customization, future expansion, diverse I/O needs, or adaptation to legacy systems particularly benefit from the flexibility and scalability these systems provide while maintaining industrial-grade reliability.

Wide temperature operation (typically -40°C to 70°C for industrial systems) ensures reliable functioning in non-climate-controlled industrial environments like factory floors, outdoor installations, vehicles, and remote locations. This capability is achieved through careful component selection, thermal design, and elimination of moving parts like fans. Systems with wide temperature ranges can be deployed in harsh conditions without requiring expensive climate control systems, reducing installation and operating costs while improving reliability.

Fanless design means the computer uses passive cooling techniques with heat sinks and thermal engineering instead of active cooling fans. This design is crucial for industrial computers because it eliminates a common point of failure (the fan motor), prevents dust and contaminant ingress that could clog filters and cause overheating, enables sealed enclosures for harsh environments, reduces maintenance requirements, eliminates fan noise, and improves overall system reliability and longevity in challenging industrial conditions with dust, vibration, and temperature fluctuations.

TPM (Trusted Platform Module) 2.0 is a specialized security chip that provides hardware-based encryption capabilities, secure storage for authentication credentials, and system integrity verification. In industrial systems, TPM helps protect sensitive data, secure communication channels, prevent unauthorized access or tampering, and ensure the integrity of control systems. As industrial systems become more connected, TPM provides essential security features to protect against cyber threats targeting critical infrastructure and manufacturing systems.

Vibration and shock resistance are critical for industrial computing systems operating in environments with mechanical disturbances from machinery, vehicles, or handling. Systems are tested to standards like IEC 60068-2-64 (vibration) and IEC 60068-2-27 (shock) to ensure they can withstand these forces without component failure or connection issues. This resilience is achieved through solid-state storage, elimination of moving parts, reinforced component mounting, specialized chassis design, and industrial-grade components, ensuring reliable operation in mechanically challenging environments.

When installing modular computing systems, consider proper thermal management (ensuring adequate airflow around the unit), environmental protection (enclosures appropriate for dust/moisture levels), power quality (stable power source with appropriate voltage and backup options), EMI/RFI isolation (distance from high-interference sources), physical security, accessibility for module swapping and maintenance, proper grounding, cable management (strain relief and protection), and compliance with local regulations and industry standards. Proper planning ensures reliable operation and maximizes the benefits of the system's modular nature.

For fanless modular systems, proper thermal management is crucial: ensure adequate clearance around all sides (typically 5-10cm minimum), avoid enclosing in sealed cabinets without ventilation, mount vertically if possible to enhance natural convection cooling, install away from other heat-generating equipment, consider ambient temperature fluctuations in the installation location, follow manufacturer's mounting recommendations (which often include heat-dissipating brackets), and periodically check for dust accumulation on cooling surfaces. For high-temperature environments, consider additional passive cooling solutions or environmental controls.

For modular computing systems, select a power supply with sufficient wattage for the base system plus all modules (with 20-30% headroom for future expansion), ensure voltage matching the system's input range (typically 9-36V DC for industrial systems), implement surge protection for industrial environments with electrical noise, consider redundant power options for critical applications, use proper wire gauge for current requirements, and potentially include an uninterruptible power supply (UPS) for protection against power outages. The power system should account for the maximum possible configuration with all modules installed.

Best practices for cable management with modular systems include using appropriate cable types for the industrial environment (shielded where necessary), implementing strain relief to prevent connector damage, securing cables to prevent accidental disconnection due to vibration, labeling cables clearly for easier maintenance and troubleshooting, maintaining minimum bend radii to prevent internal damage, using cable trays or conduits for protection, separating power and data cables to minimize interference, allowing sufficient service loops for module replacement without disconnecting cables, and ensuring accessibility for future changes while maintaining a neat installation.

If the system fails to power on, check that the power supply provides the correct voltage within the system's input range (typically 9-36V DC), ensure connections are secure at both the power supply and system, verify any power switches or ignition control settings are correctly configured, check for tripped circuit breakers or blown fuses, inspect for visible damage to power connectors, test with an alternative known-good power supply if available, verify the power LED indicators, and check if the system is in AT mode requiring a specific power signal. For vehicle-mounted systems, ensure the ignition control is properly connected.

For issues with modules or expansion capabilities, verify the module is properly seated and secured, check power cycling the system after confirming connections, ensure any module-specific drivers are installed, check BIOS/UEFI settings for module-related options, inspect for physical damage to connectors, try an alternative slot if available, test with a known-working module to verify slot functionality, check system logs for error messages, and consult module-specific documentation for jumper settings or configuration requirements. After replacing modules, validate that the system recognizes the change through device manager or system information utilities.

For overheating issues, ensure adequate clearance around the system (minimum 5-10cm on all sides), check that the installation position allows for proper convection cooling (typically vertical mounting), clean dust from the chassis and heat sink fins using compressed air (when powered off), verify ambient temperature is within specifications, check system temperature through monitoring utilities or BIOS, ensure any thermal interface materials are properly applied if the system has been serviced, examine CPU usage for processes causing excessive load, and consider adding auxiliary passive cooling or relocating the system to a cooler environment if persistent.

To diagnose communication issues, first identify the specific interface (COM, LAN, USB, etc.) experiencing problems. Check physical connections and cables for damage, verify device driver installation and updates, confirm port configuration settings (baud rate, parity, etc. for serial connections; IP settings for network), try alternative cables or ports to isolate the issue, check for resource conflicts in Device Manager, test with a known-working device, verify any required protocol converters or adapters are functioning, and use diagnostic tools appropriate to the interface type (terminal emulator for serial, ping/traceroute for network) to identify where communication fails.

Points forts

Description du produit

Caractéristiques techniques

Informations système

Processeur

Mémoire système

Chipset E/S

Informations BIOS

Chien de garde (watchdog)

Surveillance de l'état matériel

SBC

Mécanique et environnement

Température de fonctionnement

Température de stockage

Humidité en fonctionnement

Dimensions (larg. x long. x haut.)

Poids

Test de vibrations

Test de chocs

Indice de protection

Kit de montage

Extension

M.2

IET

Stockage

M.2

E/S en face avant

Bouton d'alimentation

Bouton de réinitialisation

Voyant LED

Port COM

E/S numériques

Marche/arrêt par commande filaire

Antenne

E/S en face arrière

USB

Port LAN

Audio

DP

HDMI

Emplacement SIM

Antenne

Entrée CA/CC

E/S côté droit

Antenne

E/S côté gauche

Antenne

Audio

Codec audio

Écran

Chipset graphique

Résolution

Certifications

Informations de certification

Ethernet

Chipset LAN

Spécifications

Alimentation requise

Spéc. d'entrée de tension

Connecteur d'entrée de tension

ACPI

Mode d'alimentation

Prise en charge logicielle

OS

Informations de commande

Informations de commande

Qu'est-ce que le EMS-TGL ?

Caractéristiques et avantages clés

Applications et cas d'usage

Questions fréquentes