Avalue · Calcul haute performance

HPS-ERSD4B

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Fiche technique

*Prix sur demande. Contactez-nous pour un devis.

Fabricant : Avalue

Points forts

  • 19" 4U liquid-cooled rackmount workstation (430 x 174.8 x 834 mm)
  • Dual 4th/5th Gen Intel® Xeon® Scalable (LGA4677, max. TDP 270W each)
  • Avalue HPM-ERSDE dual-socket board, Intel® C741, IPMI 2.0
  • 1-to-1 liquid cooling: 2 x CPU cold plates with water-tight connectors
  • 12 x DDR5 5600MHz RDIMM up to 3TB
  • 1 x 1300W PS2 ATX PSU or 1 x 1600W CRPS
  • 7 x PCIe Gen5 x16 slots
  • 3 x front-accessible 2.5" bays + 1 x M.2 NVMe
  • Intel I210AT 1GbE + I226-LM 2.5GbE + X550AT2 (2 x 10GbE)

Description du produit

The Avalue HPS-ERSD4B is a 19" 4U liquid-cooled rackmount workstation built around the Avalue HPM-ERSDE dual-socket server board for two 4th/5th Generation Intel® Xeon® Scalable processors (max.

TDP up to 270W each) with the Intel® C741 chipset, designed as a high-core-count, thermally-aggressive node for HPC and edge data centers.

With 12 x DDR5 5600MHz RDIMM up to 3TB, a 1-to-1 liquid-cooling module (2 CPU cold plates with water-tight connectors), a 1300W ATX or 1600W CRPS PSU and IPMI 2.0 via an ASPEED AST2600 BMC, it packages two-socket Xeon Scalable performance into a 430 x 174.8 x 834 mm chassis.

It provides 7 x PCIe Gen5 x16 slots, an M.2 NVMe, 3 x front-accessible 2.5" bays, triple Intel Ethernet (I210AT 1GbE, I226-LM 2.5GbE, X550AT2 dual 10GbE), USB 3.2 Gen1 and VGA, running Windows 10 IoT / Windows Server IoT 2019/2022, Ubuntu or RHEL.

Caractéristiques techniques

Processeur

Dual Intel FCLGA4677 Sockets support 4th/5th Generation Intel Xeon Scalable Processors (Max. TDP at 270W each)

Platform Controller Hub

Intel® C741 Chipset

Mémoire système

12 x DDR5 5600 MHz RDIMM up to 3TB

BIOS

AMI UEFI BIOS

Chien de garde (watchdog)

System reset event 0 ~ 6553 seconds

Surveillance de l'état matériel

CPU temperature, fan speed and voltage monitoring, fan speed control, case open detection

TPM

TPM 2.0 onboard

IPMI

IPMI 2.0 with AST 2600 BMC controller onboard

SBC

HPM-ERSDE

Refroidissement

1-to-1 Liquid Cooling module with 2 x CPU Liquid Heat Dissipation Plates with Water-Tight Connectors

USB

2 x USB 3.2 Gen1 ports

Bouton d'alimentation

1 x Power button

Bouton de réinitialisation

1 x Reset button

Voyant LED

1 x Power status indicator

1 x Disk activity indicator

1 x Network activity indicator

USB

6 x USB 3.2 Gen1 ports

Port COM

1 x RS232 port

VGA

1 x VGA port

RJ-45

5 x RJ45: MGMT port for dedicated IPMI access only, LAN1 for 1GbE shared with IPMI, LAN2 for 2.5GbE, LAN3 and 4 for 10GbE

Chipset graphique

AST 2600 BMC controller

Résolution

1 x VGA port VGA: 1920 x 1200 @ 60Hz 32bpp

Bloc d'alimentation

1 x 1300W PS2 ATX PSU (Default)

1 x 1600W CRPS (Option)

Extension

7 x PCIe Gen5 x16 slots

Slot 1, PCIe 5.0 x16 from 2nd CPU

Slot 2, PCIe 5.0 x16 from 1st CPU

Slot 3, PCIe 5.0 x16 from 2nd CPU

Slot 4, PCIe 5.0 x16 from 1st CPU

Slot 5, PCIe 5.0 x16 from 2nd CPU

Slot 6, PCIe 5.0 x16 from 1st CPU

Slot 7, PCIe 5.0 x16 from 2nd CPU (closest to CPU)

M.2

1 x M.2 M-Key PCIe 5.0 x4 NVMe SSD, 2242/2260/2280/22110 form factor

Baie de disque 2,5

3 x Front accessible 2.5" storage bays

Chipset LAN

1 x Intel I210AT 1GbE controller

1 x Intel I226-LM 2.5GbE controller

1 x Intel X550AT2 10GbE controller supports 2 x 10GbE Ethernet ports

Port LAN

5 x RJ45: MGMT port for dedicated IPMI access only, LAN1 for 1GbE shared with IPMI, LAN2 for 2.5GbE, LAN3 and 4 for 10GbE

Temp. de fonctionnement

0 ~ 35°C (L6 system with 1300W ATX PSU)

0 ~ 40°C (L6 system with 1600W CRPS)

Temp. de stockage

-40°C 24hrs IEC60068-2-1 Cold test Test: Ab

70°C/ RH95% 24hrs IEC 60068-2-3 Test: Ca

Humidité en fonctionnement

35°C @ 95% Relative Humidity, Non-condensing

Dimensions (larg. x long. x prof.)

19" 4U Chassis 430mm(W) x 174.8mm(H) x 834mm(D)

OS

Windows 10 IoT Enterprise LTSC 2021

Windows Server IoT 2019 with VT-d disabled

Windows Server IoT 2022

Ubuntu 21.10, 22.04 LTS or later

Red Hat Enterprise Linux (RHEL) 8.2 and later

Informations de commande

HPS-ERSD4BD-A1R: L6 19" 4U Rackmount w/HPM-ERSDEA/1300W/1-to-1 Cooling module

HPS-ERSD4BU-A1R: L6 19" 4U Rackmount w/HPM-ERSDEA/1600W R/1-to-1 Cooling module

Qu'est-ce que le HPS-ERSD4B ?

The HPS-ERSD4B is a calcul haute performance manufactured by Avalue, designed specifically for rackmount-tower-workstation applications. It features réseau of CPU temperature, fan speed and voltage monitoring, fan speed control, case open detection and os of AMI UEFI BIOS. The Avalue HPS-ERSD4B is a 19" 4U liquid-cooled rackmount workstation built around the Avalue HPM-ERSDE dual-socket server board for two 4th/5th Generation Intel® Xeon® Scalable processors (max. TDP up to 270W each) with the Intel® C741 chipset, designed as a high-core-count, thermally-aggressive node for HPC and edge data centers. With 12 x DDR5 5600MHz RDIMM up to 3TB, a 1-to-1 liquid-cooling module (2 CPU cold plates with water-tight connectors), a 1300W ATX or 1600W CRPS PSU and IPMI 2.0 via an ASPEED AST2600 BMC, it packages two-socket Xeon Scalable performance into a 430 x 174.8 x 834 mm chassis. It provides 7 x PCIe Gen5 x16 slots, an M.2 NVMe, 3 x front-accessible 2.5" bays, triple Intel Ethernet (I210AT 1GbE, I226-LM 2.5GbE, X550AT2 dual 10GbE), USB 3.2 Gen1 and VGA, running Windows 10 IoT / Windows Server IoT 2019/2022, Ubuntu or RHEL.

Caractéristiques et avantages clés

  • 19" 4U liquid-cooled rackmount workstation (430 x 174.8 x 834 mm)
  • Dual 4th/5th Gen Intel® Xeon® Scalable (LGA4677, max. TDP 270W each)
  • Avalue HPM-ERSDE dual-socket board, Intel® C741, IPMI 2.0
  • 1-to-1 liquid cooling: 2 x CPU cold plates with water-tight connectors
  • 12 x DDR5 5600MHz RDIMM up to 3TB
  • 1 x 1300W PS2 ATX PSU or 1 x 1600W CRPS
  • 7 x PCIe Gen5 x16 slots
  • 3 x front-accessible 2.5" bays + 1 x M.2 NVMe
  • Intel I210AT 1GbE + I226-LM 2.5GbE + X550AT2 (2 x 10GbE)

Applications et cas d'usage

Le HPS-ERSD4B est idéal pour de nombreuses applications d'automatisation industrielle :

  • High-performance computing and data processing tasks
  • Memory-intensive applications and multitasking
  • Internet of Things (IoT) and edge computing
  • Visual monitoring and data display systems
  • Industrial computing and data processing
  • Edge computing and IoT applications
  • Real-time monitoring and control
  • Industrial automation systems

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