Nexcom · Panel PC / Monitor / Mobile
IPPC 2170P










*Price on request. Contact us for a quote.
Highlights
- 21.5" 16:9 Full HD (1920 x 1080) fanless panel PC, 300 cd/m², 5000:1 contrast, 89° viewing on all axes
- 10-point P-Cap multi-touch with 87% light transmission and >= 6H anti-scratch surface, USB touch interface
- Metal chassis with robust aluminium IP66 zero-bezel flush front for oil & gas, refinery, wind-farm, chemical and pharma use
- 4th Generation Intel Core i7 / i5 / i3 (LGA1150) on Intel Q87 PCH (Core i5-4590T / i5-4570TE / i3-4350T / i3-4340TE / Pentium G3320TE / Celeron G1820TE)
- 2 x 204-pin DDR3/DDR3L SO-DIMM, up to 16 GB DDR3/DDR3L 1333/1600 (non-ECC, unbuffered)
- Storage: 1 x external locked CFast + 1 x mini-PCIe (mSATA) + optional 2.5" SATA HDD/SSD bay (DC model)
- Two expansion slots: 1 x PCI + 1 x PCIe x4, 2 x PCIe x4 default, 2 x PCI, or 1 x PCIe x16 — supports add-on PCI / PCIe cards
- Two FBI fieldbus ports — PROFINET / PROFIBUS / DeviceNet / EtherNet/IP / EtherCAT / SERCOS III master modules (optional)
- Optional JMobile HMI and CODESYS SoftLogic runtimes
- Dual Intel I210IT Gigabit Ethernet, 4 x USB 3.0, additional independent display (1 x DVI-I + 1 x DisplayPort)
- 2 x RS-232/422/485 with 5 V or 12 V selection (T/P-DC), PS/2 keyboard/mouse, audio (Line-out/Line-in/Mic-in, Realtek ALC886-GR)
- Wide 12–30 V DC input through 3-pin Phoenix connector; optional 24 V / 120 W AC-DC adapter
- Operating temp -10°C to 50°C, storage -20°C to 75°C, 10–90% RH non-condensing (90% RH at max 50°C)
- Dimensions 562.4 x 382.4 x 105.05 mm; weight 11.7 kg; cutout 544 x 364 mm (T = 2–12 mm)
- CE (EN 61000-6-2 / -6-4) + FCC Class A; OS: Windows 7 / 8.1 / 10 (32-bit + 64-bit)
Product Description
The Nexcom IPPC 2170P is a 21.5" 16:9 Full HD (1920 x 1080) heavy-industrial fanless panel PC sized for oil and gas rigs, wind farms, chemical plants, pharmaceutical plants and hazardous working areas.
It runs the 4th Generation Intel Core i processor family (LGA1150) on the Intel Q87 PCH chipset and accepts up to 16 GB DDR3 / DDR3L 1333/1600 (non-ECC, unbuffered) across two 204-pin SO-DIMM sockets.
CPU choices include the Core i5-4590T, Core i5-4570TE, Core i3-4350T, Core i3-4340TE, Pentium G3320TE and Celeron G1820TE. Storage is an external locked CFast socket, one mini-PCIe slot configurable as mSATA, and an optional internal 2.5" SATA HDD/SSD bay (DC model only).
The 300 cd/m² TFT panel sits behind a 10-point P-Cap multi-touch glass with 87% light transmission and >= 6H anti-scratch hardness, integrated into a metal chassis with a robust aluminium IP66 zero-bezel front for use in outdoor and harsh industrial environments.
Rear I/O carries 2 x Intel I210IT Gigabit Ethernet, 4 x USB 3.0, additional independent display via 1 x DVI-I (DVI-D + DVI-A) plus 1 x DisplayPort, audio (Line-out / Line-in / Mic-in with Realtek ALC886-GR), PS/2 keyboard/mouse, a 3-pin remote power on/off, a reset button and two configurable RS-232/422/485 ports (T/P-DC) selectable between 5 V and 12 V.
Expansion is two add-on PCI or PCIe x4 slots (configurable: 1 x PCI + 1 x PCIe x4, 2 x PCIe x4 default, 2 x PCI, or 1 x PCIe x16).
Two FBI fieldbus ports accept PROFINET, PROFIBUS, DeviceNet, EtherNet/IP, EtherCAT or SERCOS III master modules and the system optionally supports JMobile HMI and CODESYS SoftLogic.
Power is wide-range 12–30 V DC through a 3-pin Phoenix connector with an optional 24 V / 120 W AC-DC adapter (P/N 7400120023X00).
The chassis is rated -10°C to 50°C operating, 10–90% RH non-condensing, IP66 front, mounts panel / wall / stand / VESA 100 x 100 mm, weighs 11.7 kg (barebone) and measures 562.4 x 382.4 x 105.05 mm with a 544 x 364 mm panel cutout. CE-marked (EN 61000-6-2 / -6-4) and FCC Class A.
OS support: Windows 7 / 8.1 / 10 (32-bit + 64-bit). TSL Automation supplies the Nexcom IPPC 2170P worldwide.
Technical Specifications
What is IPPC 2170P?
The IPPC 2170P is a panel pc / monitor / mobile manufactured by Nexcom, designed specifically for industrial-panel-pc applications. It features processor of Core i5-4590T, Quad Core, 2.0 GHz, 6 MB Cache (3.0 GHz turbo), Core i5-4570TE, Dual Core, 2.7 GHz, 4 MB Cac…, display of 21.5" and touch of 10-point projected-capacitive (P-Cap) multi-touch. The Nexcom IPPC 2170P is a 21.5" 16:9 Full HD (1920 x 1080) heavy-industrial fanless panel PC sized for oil and gas rigs, wind farms, chemical plants, pharmaceutical plants and hazardous working areas. It runs the 4th Generation Intel Core i processor family (LGA1150) on the Intel Q87 PCH chipset and accepts up to 16 GB DDR3 / DDR3L 1333/1600 (non-ECC, unbuffered) across two 204-pin SO-DIMM sockets. CPU choices include the Core i5-4590T, Core i5-4570TE, Core i3-4350T, Core i3-4340TE, Pentium G3320TE and Celeron G1820TE. Storage is an external locked CFast socket, one mini-PCIe slot configurable as mSATA, and an optional internal 2.5" SATA HDD/SSD bay (DC model only). The 300 cd/m² TFT panel sits behind a 10-point P-Cap multi-touch glass with 87% light transmission and >= 6H anti-scratch hardness, integrated into a metal chassis with a robust aluminium IP66 zero-bezel front for use in outdoor and harsh industrial environments. Rear I/O carries 2 x Intel I210IT Gigabit Ethernet, 4 x USB 3.0, additional independent display via 1 x DVI-I (DVI-D + DVI-A) plus 1 x DisplayPort, audio (Line-out / Line-in / Mic-in with Realtek ALC886-GR), PS/2 keyboard/mouse, a 3-pin remote power on/off, a reset button and two configurable RS-232/422/485 ports (T/P-DC) selectable between 5 V and 12 V. Expansion is two add-on PCI or PCIe x4 slots (configurable: 1 x PCI + 1 x PCIe x4, 2 x PCIe x4 default, 2 x PCI, or 1 x PCIe x16). Two FBI fieldbus ports accept PROFINET, PROFIBUS, DeviceNet, EtherNet/IP, EtherCAT or SERCOS III master modules and the system optionally supports JMobile HMI and CODESYS SoftLogic. Power is wide-range 12–30 V DC through a 3-pin Phoenix connector with an optional 24 V / 120 W AC-DC adapter (P/N 7400120023X00). The chassis is rated -10°C to 50°C operating, 10–90% RH non-condensing, IP66 front, mounts panel / wall / stand / VESA 100 x 100 mm, weighs 11.7 kg (barebone) and measures 562.4 x 382.4 x 105.05 mm with a 544 x 364 mm panel cutout. CE-marked (EN 61000-6-2 / -6-4) and FCC Class A. OS support: Windows 7 / 8.1 / 10 (32-bit + 64-bit). TSL Automation supplies the Nexcom IPPC 2170P worldwide.
Key Features & Benefits
- 21.5" 16:9 Full HD (1920 x 1080) fanless panel PC, 300 cd/m², 5000:1 contrast, 89° viewing on all axes
- 10-point P-Cap multi-touch with 87% light transmission and >= 6H anti-scratch surface, USB touch interface
- Metal chassis with robust aluminium IP66 zero-bezel flush front for oil & gas, refinery, wind-farm, chemical and pharma use
- 4th Generation Intel Core i7 / i5 / i3 (LGA1150) on Intel Q87 PCH (Core i5-4590T / i5-4570TE / i3-4350T / i3-4340TE / Pentium G3320TE / Celeron G1820TE)
- 2 x 204-pin DDR3/DDR3L SO-DIMM, up to 16 GB DDR3/DDR3L 1333/1600 (non-ECC, unbuffered)
- Storage: 1 x external locked CFast + 1 x mini-PCIe (mSATA) + optional 2.5" SATA HDD/SSD bay (DC model)
- Two expansion slots: 1 x PCI + 1 x PCIe x4, 2 x PCIe x4 default, 2 x PCI, or 1 x PCIe x16 — supports add-on PCI / PCIe cards
- Two FBI fieldbus ports — PROFINET / PROFIBUS / DeviceNet / EtherNet/IP / EtherCAT / SERCOS III master modules (optional)
- Optional JMobile HMI and CODESYS SoftLogic runtimes
- Dual Intel I210IT Gigabit Ethernet, 4 x USB 3.0, additional independent display (1 x DVI-I + 1 x DisplayPort)
- 2 x RS-232/422/485 with 5 V or 12 V selection (T/P-DC), PS/2 keyboard/mouse, audio (Line-out/Line-in/Mic-in, Realtek ALC886-GR)
- Wide 12–30 V DC input through 3-pin Phoenix connector; optional 24 V / 120 W AC-DC adapter
- Operating temp -10°C to 50°C, storage -20°C to 75°C, 10–90% RH non-condensing (90% RH at max 50°C)
- Dimensions 562.4 x 382.4 x 105.05 mm; weight 11.7 kg; cutout 544 x 364 mm (T = 2–12 mm)
- CE (EN 61000-6-2 / -6-4) + FCC Class A; OS: Windows 7 / 8.1 / 10 (32-bit + 64-bit)
Applications & Use Cases
The IPPC 2170P is ideal for various industrial automation applications:
- Dust-sensitive environments and silent operation requirements
- DC-powered industrial installations and mobile applications
- Extreme temperature environments and outdoor installations
- Legacy equipment integration and serial communication
- High-performance computing and data processing tasks
- Networked industrial systems and data communication
- Interactive control interfaces and operator panels
- Chemical processing and petrochemical industries