Product category
Computer-on-Module
TSL Automation supplies a complete Computer-on-Module portfolio that lets OEMs decouple the CPU subsystem from the carrier board for faster, lower-risk product development. From x86 COM Express and COM-HPC to ARM SMARC, Qseven and Open Standard Modules — plus matching evaluation carriers — these modules deliver upgradable performance, long lifecycle support, and rugged industrial reliability.
Browse Computer-on-Module categories
COM-HPC
COM-HPC is the next-generation high-performance Computer-on-Module standard, succeeding COM Express for compute-intensive applications. Our COM-HPC modules provide high core counts, PCIe Gen4/Gen5 lanes, multi-channel DDR and high-bandwidth I/O — ideal for edge AI, medical imaging, and industrial servers requiring a long product lifecycle.
Open Standard Module
Open Standard Module (OSM) is an SGET solder-down System-on-Module standard that eliminates connectors for maximum shock/vibration resistance and the smallest footprint. Our OSM range with NXP i.MX and Rockchip SoCs suits high-reliability, mass-deployment IoT, medical, and edge devices needing a compact, long-lifecycle compute core.
COM Express Type 6
Our COM Express Type 6 modules pack desktop- and server-class Intel processors into the industry-standard 95 x 95 mm / 125 x 95 mm form factor, exposing PCI Express, USB 3.x, SATA and multiple digital displays through the Type 6 pinout. They enable long-lifecycle, upgrade-ready embedded systems for medical, automation, and edge-AI platforms.
Eval Carrier Board
Our evaluation carrier boards expose the full I/O of COM Express, SMARC, and Qseven modules so engineers can prototype, validate, and benchmark a module before committing to a custom carrier. They shorten development time for medical, automation, and edge-AI products built on Computer-on-Module architecture.
Qseven
Qseven modules deliver low-power x86 compute in an ultra-compact 70 x 70 mm footprint with an edge-connector interface. They suit space-constrained, battery- and fanless designs in medical, handheld, and IoT gateways where a small, upgrade-ready CPU module is essential.
SMARC
SMARC (Smart Mobility ARChitecture) modules combine ARM and x86 SoCs in a credit-card-sized, low-power form factor with rich serial, camera, and display interfaces. Our SMARC range — including NXP i.MX, Rockchip, and Qualcomm options — is ideal for fanless edge-AI, vision, and IoT gateway products with long lifecycle support.
COM Express Type 10
COM Express Type 10 (the PICMG COM.0 'Mini' form factor, 84 x 55 mm) puts a complete x86 subsystem — CPU, memory and core I/O — onto a small, upgrade-ready module that plugs into a custom carrier. It is the smallest COM Express pin-out, exposing PCIe, USB, SATA, LAN and digital display through a single connector so designers can reuse the carrier and refresh the compute over long product lifecycles.
About Computer-on-Module
TSL Automation supplies a complete Computer-on-Module portfolio that lets OEMs decouple the CPU subsystem from the carrier board for faster, lower-risk product development. From x86 COM Express and COM-HPC to ARM SMARC, Qseven and Open Standard Modules — plus matching evaluation carriers — these modules deliver upgradable performance, long lifecycle support, and rugged industrial reliability.