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Avalue · Computer-on-Module

ESM-EHLC

ESM-EHLC FrontESM-EHLC FrontESM-EHLC Front
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Data Sheet

*Price on request. Contact us for a quote.

Manufacturer: Avalue

Highlights

  • COM Express Type 6 Compact module (95 x 95 mm)
  • Intel Celeron J6413/J6412, Atom x6413E/x6425RE (Elkhart Lake)
  • 2 x 260-pin DDR4 3200MHz SO-DIMM up to 32GB (In-Band ECC on selected SKUs)
  • Optional onboard TPM 2.0, optional eMMC 5.1 up to 128GB
  • Intel Gen11 LP graphics, triple display (HDMI/DP/LVDS/VGA/eDP) up to 4K
  • 3 x PCIe x1 Gen3, 4x USB3.2 Gen2 + 8x USB2.0, 2x SATA III
  • Intel i225LM/IT 2.5GbE
  • Standard 0~60°C, conditional extended -40~85°C
  • Windows 10 IoT Enterprise / Linux; CE, FCC, RoHS

Product Description

The Avalue ESM-EHLC is a COM Express Type 6 Compact module (95 x 95 mm) built on Intel Celeron J6413/J6412 and Atom x6413E/x6425RE (Elkhart Lake) processors, designed as a low-power, long-lifecycle compute core for embedded and industrial designs.

With dual DDR4 3200MHz SO-DIMM (up to 32GB, In-Band ECC on selected SKUs), optional onboard TPM 2.0, and optional eMMC up to 128GB, it delivers efficient x86 performance through the standardised Type 6 pin-out.

It offers Intel Gen11 LP graphics with triple display (HDMI/DP/LVDS/VGA/eDP up to 4K), 4x USB3.2 Gen2 + 8x USB2.0, 2x SATA III, Intel i225LM/IT 2.5GbE, PCIe Gen3, and a wide +9~19V input with a conditional extended -40~85°C range, running Windows 10 IoT Enterprise or Linux.

Technical Specifications

Processor

Intel® Celeron® J6413 4C 1.8 GHz/ 10W

Intel® Celeron® J6412 4C 1.8 GHz/ 10W

Intel® Atom® x6413E 4C 1.5 GHz/ 9W

Intel® Atom® x6425RE 4C 1.9 GHz/ 12W

System Memory

2 x 260-Pin DDR4 3200MHz SO-DIMM SDRAM Slot Up to 32GB, Support In-Band ECC Memory Protection (Selected SKUs)

I/O Chipset

EC iTE IT5571

Watchdog Timer

H/W Reset, 1Sec. ~ 65535Sec. and 1Sec./Step

BIOS

AMI uEFI BIOS, 256 Mbit SPI Flash ROM

H/W Status Monitor

Monitoring System Temperature

Voltage and FAN Status with Auto Throttling Control

TPM

Onboard TPM 2.0 Optional

Expansion

3 x PCIe x1 (Gen3)

Storage

eMMC 5.1 Up to 128GB (Optional)

Graphic Chipset

Intel® SoC Processor Integrated Gen11 LP Graphics

Spec. & Resolution

HDMI 1.4b/2.0b: 4096x2160@60Hz

DP 1.4: 4096x2160 @60Hz *Per Intel Design Guide, Need to Add Redriver (Redriver in Carrier Board to Fine Tune the Signal of DP1.4)

eDP 1.3b (Optional): 4096x2160 @60Hz (Only Support 4Lanes 2560x1440 & 2Lanes 1920x1080)

LVDS(via eDP-to-LVDS): 1920x1080 @60Hz, LVDS Via CH7511B

VGA(via DP-to-VGA): 1920x1080 @60Hz, VGA Via CH7517A (DP to VGA)

Multiple Display

Triple Display Support, Display Port1.4, HDMI2.0b/1.4b, Dual Channel LVDS, VGA, eDP1.3 (Optional)

LVDS

CH7511B(eDP to LVDS)

DDI

3 x DDI

DDI 1: HDMI/DP(Default)

DDI 2: DP or DP VGA Supported by Build Option Via DP-to-VGA IC (In Place of DDI 2)

DDI 3: DP or eDP/LVDS (BOM Optional)

Audio Interface

Intel® HD Audio Integrated on CPU

LAN Chipset

1 x Intel® I225LM/IT

Ethernet Interface

10/100/1000/2500 Base-Tx GbE Compatible, above 70°C Tc, Recommended Speed is 1G

OS

Windows 10 IoT Enterprise (64-bit)

Linux

Certification Information

CE, FCC Class, RoHS Compliant

USB

4 x USB 3.2 Gen2 x 1

8 x USB 2.0

COM Port

2 x UART (RX/TX Only)

SATA

2 x SATA III

DIO

1 x 8-bit GPIO

MIO

1 x SMBus

1 x LPC (Via eSPI-to-LPC Bridge) or 1x eSPI (Only Support 20MHz), Build Option

1 x I2C

Operating Temp.

Standard 0°C ~ 60°C (32°F ~ 140°F) with 0.2m/s Air Flow Conditional

Extend: -40°C ~ 85°C (-40°F ~ 185°F) with 0.5m/s Air Flow (Note: Above 70°C Tc, Recommended Ethernet Speed is 1G)

Storage Temp.

-40°C ~ 75°C (-40°F ~ 167°F)

Operating Humidity

40°C @ 95% Relative Humidity, Non-condensing

Weight

0.14lbs (0.068Kg)

Power Requirement

+9V ~ +19V

Power Mode

AT/ATX

Dimension (L x W)

3.74” x 3.74” (95 x 95 mm)

Ordering Information

ESM-EHLC-J6413-A1R | Intel® Celeron® SoC Processor J6413 Type6 COMe Compact Module

ESM-EHLC-J6412-A1R | Intel® Celeron® SoC Processor J6412 Type6 COMe Compact Module

ESM-EHLC-X13E-A1R | Intel® Atom® SoC Processor x6413E Type6 COMe Compact Module

ESM-EHLC-X25RE-A1R | Intel® Atom® SoC Processor x6425RE Type6 COMe Compact Module

EEV-EX16-B1R | mATX Ev. Board for COMe Type 6

ACC-ESMEHLC-SK-1R | Heatsink of ESM-EHLC W/O FAN H=34mm for Standard Temp. SKUs

ACC-ESMEHLC-CL-1R | Cooler of ESM-EHLC W/FAN H=60mm for Wide Temp. SKUs

ACC-ESMEHLC-SD-1R | Heatspreader for ESM-EHLC H=11mm for the Module W/ Standard Temp. CPU SKUs

ACC-ESMEHLC-SD-2R | Heatspreader for ESM-EHLC H=11mm for the Module W/ Wide Temp. CPU SKUs

What is ESM-EHLC?

The ESM-EHLC is a computer-on-module manufactured by Avalue, designed specifically for com-express-type-6 applications. The Avalue ESM-EHLC is a COM Express Type 6 Compact module (95 x 95 mm) built on Intel Celeron J6413/J6412 and Atom x6413E/x6425RE (Elkhart Lake) processors, designed as a low-power, long-lifecycle compute core for embedded and industrial designs. With dual DDR4 3200MHz SO-DIMM (up to 32GB, In-Band ECC on selected SKUs), optional onboard TPM 2.0, and optional eMMC up to 128GB, it delivers efficient x86 performance through the standardised Type 6 pin-out. It offers Intel Gen11 LP graphics with triple display (HDMI/DP/LVDS/VGA/eDP up to 4K), 4x USB3.2 Gen2 + 8x USB2.0, 2x SATA III, Intel i225LM/IT 2.5GbE, PCIe Gen3, and a wide +9~19V input with a conditional extended -40~85°C range, running Windows 10 IoT Enterprise or Linux.

Key Features & Benefits

  • COM Express Type 6 Compact module (95 x 95 mm)
  • Intel Celeron J6413/J6412, Atom x6413E/x6425RE (Elkhart Lake)
  • 2 x 260-pin DDR4 3200MHz SO-DIMM up to 32GB (In-Band ECC on selected SKUs)
  • Optional onboard TPM 2.0, optional eMMC 5.1 up to 128GB
  • Intel Gen11 LP graphics, triple display (HDMI/DP/LVDS/VGA/eDP) up to 4K
  • 3 x PCIe x1 Gen3, 4x USB3.2 Gen2 + 8x USB2.0, 2x SATA III
  • Intel i225LM/IT 2.5GbE
  • Standard 0~60°C, conditional extended -40~85°C
  • Windows 10 IoT Enterprise / Linux; CE, FCC, RoHS

Applications & Use Cases

The ESM-EHLC is ideal for various industrial automation applications:

  • Extreme temperature environments and outdoor installations
  • High-performance computing and data processing tasks
  • Peripheral device connectivity and data transfer
  • Memory-intensive applications and multitasking
  • Internet of Things (IoT) and edge computing
  • Visual monitoring and data display systems
  • Industrial automation and control
  • Manufacturing process monitoring

Frequently Asked Questions