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Avalue · Computer-on-Module

ESM-TGH

ESM-TGH FrontESM-TGH FrontESM-TGH Front
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Data Sheet

*Price on request. Contact us for a quote.

Manufacturer: Avalue

Highlights

  • COM Express Type 6 module (125 x 95 mm)
  • 11th Gen Intel Xeon W / Core i7/i5/i3 / Celeron (Tiger Lake-H, up to 45W)
  • ECC support on Xeon SKUs
  • 3 x 260-pin DDR4 3200MHz SO-DIMM up to 96GB total
  • Optional onboard TPM 2.0
  • Intel UHD (Xe) graphics, quad display (3x DDI + eDP)
  • 1 x PCIe x16 Gen4 + 8 x PCIe x1 Gen3
  • Intel I225LM/IT 2.5GbE, 4x USB3.2 Gen2 + 8x USB2.0, 4x SATA III
  • Standard 0~60°C / optional industrial -40~75°C; Windows 10 / Linux

Product Description

The Avalue ESM-TGH is a COM Express Type 6 module (125 x 95 mm) built on 11th Gen Intel Xeon W, Core and Celeron processors (Tiger Lake-H, up to 45W, ECC on Xeon SKUs), designed as a high-performance, upgrade-ready compute core for demanding embedded and industrial designs.

With triple DDR4 3200MHz SO-DIMM (up to 96GB total), optional onboard TPM 2.0, and PCIe Gen4 x16 expansion, it delivers workstation-class x86 performance through the standardised Type 6 pin-out.

It offers Intel UHD (Xe) graphics with quad display (3x DDI + eDP up to 2K, HDMI 2.0b/DP 1.4 4096x2304), 4x USB3.2 Gen2 + 8x USB2.0, 4x SATA III, Intel I225LM/IT 2.5GbE, and a wide +9~19V input with an optional industrial -40~75°C range, running Windows 10 64-bit or Linux.

Technical Specifications

Processor

11th Gen. Intel® Xeon® Core™ and Celeron® Processor

Xeon® W-11865MRE* 45W (35W cTDP), 8C/16T (ECC)

Xeon® W-11155MRE* 45W (35W cTDP), 4C/8T (ECC)

Core™ i7-11850HE* 45W (35W cTDP), 8C/16T (Non-ECC)

Core™ i5-11500HE* 45W (35W cTDP), 6C/12T (Non-ECC)

Core™ i3-11100HE* 45W (35W cTDP), 4C/8T (Non-ECC)

Celeron® 6600HE* 35W, 2C/2T (Non-ECC)

Platform Controller Hub

Intel® RM590E Chipset

Intel® QM580E Chipset

Intel® HM570E Chipset

System Memory

3 x 260-Pin DDR4 3200MHz SO-DIMM Slot Up to 32 GByte Each (96 GByte Total)

I/O Chipset

EC iTE IT5571

Watchdog Timer

H/W Reset, 1Sec. ~ 65535Sec. and 1Sec./Step

BIOS

AMI uEFI BIOS, 256 Mbit SPI Flash ROM

H/W Status Monitor

Monitoring System Temperature

Voltage and FAN Status with Auto Throttling Control

TPM

Onboard TPM 2.0 Optional

Expansion

1 x PCIe x16 (Gen4)

8 x PCIe x1 (Gen3)

Graphic Chipset

Intel® UHD Graphics (Xe Architecture)

Spec. & Resolution

HDMI 2.0b: 4096x 2304@60Hz

DP 1.4: 4096x 2304@60Hz

LVDS: 1920x 1080@60Hz, Support Dual Channel 18/24-bit LVDS (Via eDP-to-LVDS IC CH7511B)

VGA: 1920x 1200@60Hz (Via DP to VGA IC Chrontel® 7517A)

eDP 1.4b: 4096x 2304@60Hz (Optional), (Per Intel Design Guide, Need to Add Redriver (Redriver in Carrier Board to Fine Tune the Signal of DP1.4)

(Only Support 4Lanes 2560x1440 & 2Lanes 1920x1080)

Multiple Display

Four Display Support, Up to 2K (3DDI+eDP)

LVDS

CH7511B(eDP to LVDS)

DDI

3 x DDI, VGA, eDP/LVDS (BOM Optional)

HDMI/DP(Default)

VGA Supported by Build Option Via DP-to-VGA IC (In Place of DDI 3)

Audio Interface

Intel® HD Audio Integrated on CPU

LAN Chipset

1 x Intel® I225LM/IT

Ethernet Interface

10/100/1000/2500 Base-Tx GbE Compatible

OS

Windows 10 64-bit

Linux (Kernel 5.8) above

Certification Information

CE, FCC Class, RoHS Compliant

USB

4 x USB 3.2 Gen.2 x 1

8 x USB 2.0

COM Port

2 x UART (RX/TX Only)

SATA

4 x SATA III

DIO

1 x 8-bit GPIO

MIO

1 x SMBus

1 x LPC (Via eSPI to LPC Bridge)

1 x I2C

Operating Temp.

Standard 0°C ~ 60°C (32°F ~ 140°F)

Operating Industrial (Build Option with Selected SKUs): -40°C ~ 75°C (-40°F ~ 167°F)

Storage Temp.

-40°C ~ 85°C (-40°F ~ 185°F)

Operating Humidity

40°C @ 95% Relative Humidity, Non-condensing

Weight

0.2425lbs (0.11Kg)

Power Requirement

+9V ~ +19V

Power Mode

AT/ATX

Dimension (L x W)

4.92" x 3.74" (125*95 mm)

Ordering Information

ESM-TGH-1850-A1R | Intel® HM570E COM Express Module Type 6 on board-i7-11850HE CPU

ESM-TGH-1500-A1R | Intel® HM570E COM Express Module Type 6 on board-i5-11500HE CPU

ESM-TGH-1100-A1R | Intel® HM570E COM Express Module Type 6 on board-i3-11100HE CPU

ESM-TGH-6600-A1R | Intel® HM570E COM Express Module Type 6 on board-Celeron 6600HE CPU

ESM-TGH-1850-A1-1R | Intel® QM580E COM Express Module Type 6 on board-i7-11850HE CPU

ESM-TGH-1500-A1-1R | Intel® QM580E COM Express Module Type 6 on board-i5-11500HE CPU

ESM-TGH-1865R-A1R | Intel® RM590E COM Express Module Type 6 on board-Xeon W-11865MRE CPU

ESM-TGH-1155R-A1R | Intel® RM590E COM Express Module Type 6 on board-Xeon W-11155MRE CPU

What is ESM-TGH?

The ESM-TGH is a computer-on-module manufactured by Avalue, designed specifically for com-express-type-6 applications. The Avalue ESM-TGH is a COM Express Type 6 module (125 x 95 mm) built on 11th Gen Intel Xeon W, Core and Celeron processors (Tiger Lake-H, up to 45W, ECC on Xeon SKUs), designed as a high-performance, upgrade-ready compute core for demanding embedded and industrial designs. With triple DDR4 3200MHz SO-DIMM (up to 96GB total), optional onboard TPM 2.0, and PCIe Gen4 x16 expansion, it delivers workstation-class x86 performance through the standardised Type 6 pin-out. It offers Intel UHD (Xe) graphics with quad display (3x DDI + eDP up to 2K, HDMI 2.0b/DP 1.4 4096x2304), 4x USB3.2 Gen2 + 8x USB2.0, 4x SATA III, Intel I225LM/IT 2.5GbE, and a wide +9~19V input with an optional industrial -40~75°C range, running Windows 10 64-bit or Linux.

Key Features & Benefits

  • COM Express Type 6 module (125 x 95 mm)
  • 11th Gen Intel Xeon W / Core i7/i5/i3 / Celeron (Tiger Lake-H, up to 45W)
  • ECC support on Xeon SKUs
  • 3 x 260-pin DDR4 3200MHz SO-DIMM up to 96GB total
  • Optional onboard TPM 2.0
  • Intel UHD (Xe) graphics, quad display (3x DDI + eDP)
  • 1 x PCIe x16 Gen4 + 8 x PCIe x1 Gen3
  • Intel I225LM/IT 2.5GbE, 4x USB3.2 Gen2 + 8x USB2.0, 4x SATA III
  • Standard 0~60°C / optional industrial -40~75°C; Windows 10 / Linux

Applications & Use Cases

The ESM-TGH is ideal for various industrial automation applications:

  • Extreme temperature environments and outdoor installations
  • High-performance computing and data processing tasks
  • Peripheral device connectivity and data transfer
  • Memory-intensive applications and multitasking
  • Visual monitoring and data display systems
  • Industrial automation and control
  • Manufacturing process monitoring
  • Quality assurance and inspection

Frequently Asked Questions