EMS-SKLU-DVI
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EMS-SKLU-DVI
*Price on request. Contact us for a quote.
Manufacturer: Avalue
- 6th Gen Intel® Core™ SoC i7/i5/i3/Celeron BGA Processor
- One 260-pin SODIMM Socket Up to 16GB DDR4 2133MHz SDRAM
- Dual Display:DP+DVI
- 1xDVI,1xDP,2xLAN,1xCOM1,4xUSB 3.0,2xUSB2.0,1xMulti-Function Port (1xGPIO,1xCOM2,1xAudio,1xSMBus,2xPS2)
- Expansion Slot Supports 1 Mini PCIe Slot, 1 M.2, 1 IET Interface
- Front Access Swappable 2.5" Drive Bay, 2 SIM Card
- Rugged Design for Vibration & Shock Protection
- Fanless Operating from -20 ~ 60°C, Support IP50
- Power Input: Typical 12/24 Vdc ( +9~ 32V )
- Supports Intel® iAMT 11.0, TPM2.0 , Turbo Boost Technology, vPro, Wake on LAN, RAID 0/1
- Service Window, Easy to Install M.2, Memory and Mini PCIe Module
The Avalue EMS-SKLU-DVI is a modular industrial computing system equipped with Intel® Skylake-U processors and multiple DVI outputs for high-quality digital video. It features a fanless design and supports wide temperature ranges, making it suitable for use in demanding industrial environments. This system is ideal for applications that require reliable video output and robust performance, ensuring flexibility and scalability in various settings
Processor
Intel® Core™ i7-6600U, 2-Core, 2.6GHz processor
Intel® Core™ i5-6300U, 2-Core, 2.4GHz processor
Intel® Core™ i3-6100U, 2-Core, 2.3GHz processor
Intel® Celeron® 3955U, 2-Core, 2.0GHz processor
System Memory
1 x 260-Pin DDR4 2133MHz SO-DIMM up to 16 GB
Watchdog Timer
H/W Reset, 1sec. ~ 65535sec.
H/W Status Monitor
Monitoring CPU & System Temperature and Voltage
SBC
EBM-SKLUS + EBM-CDVS DB-A
Operating Temperature
(w/SSD), ambient w/ air flow
-20°C ~ 60°C (-4°F ~ 140°F)
(w/HDD), ambient w/ air flow
0°C ~ 40°C (32°F ~ 104°F)
Storage Temperature
-30°C ~ 70°C (-22°F ~ 158°F)
Operating Humidity
40°C @ 95% Relative Humidity, Non-condensing
Dimension (W x L x H)
9.45" x 5.96" x 2.36" (240mm x 151.5mm x 60mm)
Vibration Test
With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 1hr/axis
Shock Test
With SSD : 55Grms, IEC 60068-2-27, Half Sine, 11ms
Mounting Kit
Wall mount kit (standard)
M.2
1 x M.2 (2242/3042) B-Key, supports SATA/ PCIex1/ USB3.0
PCIe
1 x Mini PCIe
IET
1 x Avalue 80-Pin IET Interface
M.2
1 x M.2 (SATA)
2.5 Drive Bay
1 x 2.5" Drive Bay
USB
2 x USB 3.0
USB
2 x USB 3.0
2 x USB 2.0
COM Port
2 x RS-232/422/485 (Jumper), supports auto-flow
LAN Port
2 x RJ-45
SMBus
1 x SMBus
Audio
Mic-In, Line-In and Line-Out
Digital I/O
1 x 12bit GPIO
SIM Slot
2 x SIM Card Slot
Antenna
2 x Knockouts for Antenna Mounting
AC/DC Input
3-Pin Terminal Block
Audio Codec
Realtek ALC888S
supports 2.1-CH
Graphic Chipset
Intel® Skylake SoC integrated Graphics
Resolution
DP: Max. resolution 4096x2304 @ 60Hz
DVI-D:Max. resolution 1920x1200@ 60Hz
LAN Chipset
1 x Intel® I211AT
1 x Intel® I219-LM
Specification
10/100/1000 Base-Tx GbE compatible
ACPI
Single power ATX Support S0,S3, S4, S5
ACPI 5.0 Compliant
Power Mode
AT/ATX (ATX is default setting)
Adapter
Optional AC-DC Adapter
OS
Win 10 / Win 8.1 / Win 7 / Linux
Ordering Information
Intel® 6th Skylake Core™ Processor i7/i5/i3/Celeron Fanless Rugged Embedded System, w_DVI IET Module
EMS-SKLU-66-B1-7R (i7-6600U)
EMS-SKLU-63-B1-7R (i5-6300U)
EMS-SKLU-61-B1-7R (i3-6100U)
EMS-SKLU-39-B1-7R (3955U)
Frequently Asked Questions
The EMS-SKLU-DVI features Intel 6th Gen Skylake-U processors (Core i7/i5/i3/Celeron), up to 16GB DDR4 memory, and notably multiple DVI outputs for reliable industrial display connectivity. It offers comprehensive I/O including USB 3.0, COM ports, dual LAN, and expansion capabilities via Mini PCIe, M.2, and IET interface. The system operates fanless in wide temperature ranges (-20°C to 60°C), has IP50 protection, accepts wide voltage input (9-32V), and includes TPM 2.0 security. This specialized configuration is particularly valuable for industrial environments with existing DVI infrastructure or applications requiring the reliability and compatibility advantages of DVI connections.
DVI connectivity remains important in industrial applications due to its proven reliability, widespread adoption in industrial displays, screw-in connectors that resist vibration disconnection, backward compatibility with VGA via simple adapters, and support for both digital and analog signals (DVI-I). The EMS-SKLU-DVI addresses these needs by providing DVI outputs powered by Intel HD Graphics, enabling connectivity to existing industrial displays, KVM systems, and specialized monitors. This allows organizations to leverage their existing display infrastructure while upgrading to modern computing capabilities, providing an optimal migration path from legacy systems while maintaining the robust connectivity that industrial environments demand.
The Skylake-U architecture enhances the EMS-SKLU-DVI through several key advantages: improved Intel HD Graphics that support multiple independent displays with high resolution and color depth, hardware acceleration for rendering and video processing, improved power efficiency that enables sophisticated display functions within a fanless design, and support for modern graphics APIs alongside legacy compatibility. These capabilities allow the system to drive complex industrial visualization applications, multi-display operator interfaces, and detailed monitoring systems while maintaining compatibility with existing industrial DVI displays and providing the reliability necessary for mission-critical industrial applications running 24/7 in challenging environments.
Applications particularly benefiting from the EMS-SKLU-DVI include industrial control rooms with existing DVI infrastructure, manufacturing systems requiring high-reliability display connections, transportation control systems with specialized monitors, medical equipment with calibrated DVI displays, defense and military systems with specific compatibility requirements, industrial automation with ruggedized operator interfaces, process control systems in regulated industries where display certification is required, legacy migration projects requiring compatibility with existing infrastructure, and any application where the proven reliability and industrial-grade connection security of DVI is preferred over consumer-oriented display technologies for critical visual information delivery.
A Modular Computing System is an industrial-grade computer designed with modular components that can be interchanged or expanded to customize the system for specific applications. These systems typically feature a base unit with core processing capabilities and standardized interfaces for connecting specialized modules that add functionality such as additional I/O, communication protocols, or industry-specific features. This modularity provides flexibility, scalability, and future-proofing while maintaining the reliability and ruggedness required for industrial environments.
Modular Computing Systems offer several advantages over fixed-configuration computers: customization for specific application requirements, ability to adapt to changing needs without replacing the entire system, simpler upgrades by replacing only specific modules, reduced spare parts inventory, greater longevity as new technologies can be integrated via module updates, streamlined maintenance, and better return on investment through scalability. These benefits make modular systems particularly valuable in industrial environments where requirements evolve and system longevity is important.
An IET (Interface Extension Technology) module is a specialized expansion module used in systems like the EMS series to add specific functionality to the base computing platform. These modules connect to a standardized interface on the main system and provide additional capabilities such as extra COM ports, LAN ports, PoE functionality, or specialized interfaces like CAN bus. IET modules are important because they allow a single base system to be customized for diverse applications by simply changing the module, providing flexibility while maintaining a standardized core platform.
Industries benefiting from modular computing systems include manufacturing (automation control, data collection), transportation (fleet management, railway systems), utilities (substation monitoring, grid control), healthcare (medical equipment integration), retail (point-of-sale, inventory management), building automation (HVAC, access control), defense, aerospace, and smart city infrastructure. Applications requiring customization, future expansion, diverse I/O needs, or adaptation to legacy systems particularly benefit from the flexibility and scalability these systems provide while maintaining industrial-grade reliability.
Wide temperature operation (typically -40°C to 70°C for industrial systems) ensures reliable functioning in non-climate-controlled industrial environments like factory floors, outdoor installations, vehicles, and remote locations. This capability is achieved through careful component selection, thermal design, and elimination of moving parts like fans. Systems with wide temperature ranges can be deployed in harsh conditions without requiring expensive climate control systems, reducing installation and operating costs while improving reliability.
Fanless design means the computer uses passive cooling techniques with heat sinks and thermal engineering instead of active cooling fans. This design is crucial for industrial computers because it eliminates a common point of failure (the fan motor), prevents dust and contaminant ingress that could clog filters and cause overheating, enables sealed enclosures for harsh environments, reduces maintenance requirements, eliminates fan noise, and improves overall system reliability and longevity in challenging industrial conditions with dust, vibration, and temperature fluctuations.
TPM (Trusted Platform Module) 2.0 is a specialized security chip that provides hardware-based encryption capabilities, secure storage for authentication credentials, and system integrity verification. In industrial systems, TPM helps protect sensitive data, secure communication channels, prevent unauthorized access or tampering, and ensure the integrity of control systems. As industrial systems become more connected, TPM provides essential security features to protect against cyber threats targeting critical infrastructure and manufacturing systems.
Vibration and shock resistance are critical for industrial computing systems operating in environments with mechanical disturbances from machinery, vehicles, or handling. Systems are tested to standards like IEC 60068-2-64 (vibration) and IEC 60068-2-27 (shock) to ensure they can withstand these forces without component failure or connection issues. This resilience is achieved through solid-state storage, elimination of moving parts, reinforced component mounting, specialized chassis design, and industrial-grade components, ensuring reliable operation in mechanically challenging environments.
When installing modular computing systems, consider proper thermal management (ensuring adequate airflow around the unit), environmental protection (enclosures appropriate for dust/moisture levels), power quality (stable power source with appropriate voltage and backup options), EMI/RFI isolation (distance from high-interference sources), physical security, accessibility for module swapping and maintenance, proper grounding, cable management (strain relief and protection), and compliance with local regulations and industry standards. Proper planning ensures reliable operation and maximizes the benefits of the system's modular nature.
For fanless modular systems, proper thermal management is crucial: ensure adequate clearance around all sides (typically 5-10cm minimum), avoid enclosing in sealed cabinets without ventilation, mount vertically if possible to enhance natural convection cooling, install away from other heat-generating equipment, consider ambient temperature fluctuations in the installation location, follow manufacturer's mounting recommendations (which often include heat-dissipating brackets), and periodically check for dust accumulation on cooling surfaces. For high-temperature environments, consider additional passive cooling solutions or environmental controls.
For modular computing systems, select a power supply with sufficient wattage for the base system plus all modules (with 20-30% headroom for future expansion), ensure voltage matching the system's input range (typically 9-36V DC for industrial systems), implement surge protection for industrial environments with electrical noise, consider redundant power options for critical applications, use proper wire gauge for current requirements, and potentially include an uninterruptible power supply (UPS) for protection against power outages. The power system should account for the maximum possible configuration with all modules installed.
Best practices for cable management with modular systems include using appropriate cable types for the industrial environment (shielded where necessary), implementing strain relief to prevent connector damage, securing cables to prevent accidental disconnection due to vibration, labeling cables clearly for easier maintenance and troubleshooting, maintaining minimum bend radii to prevent internal damage, using cable trays or conduits for protection, separating power and data cables to minimize interference, allowing sufficient service loops for module replacement without disconnecting cables, and ensuring accessibility for future changes while maintaining a neat installation.
If the system fails to power on, check that the power supply provides the correct voltage within the system's input range (typically 9-36V DC), ensure connections are secure at both the power supply and system, verify any power switches or ignition control settings are correctly configured, check for tripped circuit breakers or blown fuses, inspect for visible damage to power connectors, test with an alternative known-good power supply if available, verify the power LED indicators, and check if the system is in AT mode requiring a specific power signal. For vehicle-mounted systems, ensure the ignition control is properly connected.
For issues with modules or expansion capabilities, verify the module is properly seated and secured, check power cycling the system after confirming connections, ensure any module-specific drivers are installed, check BIOS/UEFI settings for module-related options, inspect for physical damage to connectors, try an alternative slot if available, test with a known-working module to verify slot functionality, check system logs for error messages, and consult module-specific documentation for jumper settings or configuration requirements. After replacing modules, validate that the system recognizes the change through device manager or system information utilities.
For overheating issues, ensure adequate clearance around the system (minimum 5-10cm on all sides), check that the installation position allows for proper convection cooling (typically vertical mounting), clean dust from the chassis and heat sink fins using compressed air (when powered off), verify ambient temperature is within specifications, check system temperature through monitoring utilities or BIOS, ensure any thermal interface materials are properly applied if the system has been serviced, examine CPU usage for processes causing excessive load, and consider adding auxiliary passive cooling or relocating the system to a cooler environment if persistent.
To diagnose communication issues, first identify the specific interface (COM, LAN, USB, etc.) experiencing problems. Check physical connections and cables for damage, verify device driver installation and updates, confirm port configuration settings (baud rate, parity, etc. for serial connections; IP settings for network), try alternative cables or ports to isolate the issue, check for resource conflicts in Device Manager, test with a known-working device, verify any required protocol converters or adapters are functioning, and use diagnostic tools appropriate to the interface type (terminal emulator for serial, ping/traceroute for network) to identify where communication fails.