What are the key features of the EMS-EHL-4COM-isolation modular system?

It is an Elkhart Lake modular system with Intel Celeron J6413 or Atom x6425E, one DDR4 3200 SO-DIMM up to 32GB, onboard TPM 2.0, four 2.5KV-isolated RS-232/422/485 ports plus 2 x BIOS-selectable RS-232/422/485, 8-bit GPIO, USB 3.2 Gen2/Gen1 + USB 2.0, dual LAN, DP++ and HDMI, and dual M.2 expansion.

What does the '4COM-isolation' in the model name mean?

This variant provides four RS-232/422/485 serial ports with 2.5KV galvanic isolation, protecting the system from ground loops and voltage surges in electrically noisy industrial and field environments.

Which processors does the EMS-EHL-4COM-isolation support?

It supports the Intel Celeron J6413 (standard temperature) or the Intel Atom x6425E (wide temperature, -40°C to 105°C Tj), both Elkhart Lake-class, low-power CPUs.

How much memory does it support?

It has one 260-pin SO-DIMM socket supporting up to 32GB DDR4 at 3200 MT/s.

How many serial ports does it provide?

It provides six serial ports total: four 2.5KV-isolated RS-232/422/485 on the rear, plus two BIOS-selectable RS-232/422/485 with hardware auto flow control on the front.

What storage and expansion options are available?

It offers M.2 Key-B 2242/2280 SATA storage and an additional M.2 Key-B 2242 (shared with expansion), plus an M.2 Key-E 2230 for Wi-Fi/BT and a Key-B slot with an internal SIM slot.

Does it include hardware security?

Yes, it includes onboard TPM 2.0 for hardware key storage and platform integrity in secure industrial deployments.

What display outputs does it provide?

It offers DP++ and HDMI outputs via Intel UHD Graphics (10th Gen class), each up to 4096 x 2160 @ 60Hz, for industrial HMI and signage.

What power input does it use?

Power is supplied via a 3-pin terminal block (V+, V-, GND), with a 2-pin terminal block for wire-control power on/off — robust for industrial cabinet wiring.

What applications is the EMS-EHL-4COM-isolation best suited for?

With isolated multi-COM, wide-temperature CPU option, TPM 2.0, and rugged terminal-block power, it suits machine control, factory automation, transportation, energy, and field systems where serial isolation and reliability are critical.

Avalue · Computing System

EMS-EHL-4COM-isolation

Data Sheet

*Price on request. Contact us for a quote.

Manufacturer: Avalue

Highlights

Intel Celeron J6413 / Atom x6425E (Elkhart Lake, wide-temp option)
1 x DDR4 3200 MT/s SO-DIMM, up to 32GB
Onboard TPM 2.0 (EBM-EHLS SBC)
4 x RS-232/422/485 with 2.5KV isolation
2 x RS-232/422/485 (BIOS-selectable, HW auto flow control)
8-bit GPIO (DB9)
USB 3.2 Gen2/Gen1 + USB 2.0, dual LAN
DP++ and HDMI display
Dual M.2 (Key-B w/ SIM, Key-E Wi-Fi/BT), terminal-block power

Product Description

The Avalue EMS-EHL-4COM-isolation is a modular computing system based on the Elkhart Lake platform — Intel Celeron J6413 or wide-temperature Intel Atom x6425E — with a single DDR4 3200 MT/s SO-DIMM up to 32GB and onboard TPM 2.0.

Built on the EBM-EHLS SBC, this variant is distinguished by four isolated RS-232/422/485 serial ports with 2.5KV isolation, making it ideal for electrically noisy industrial environments.

Beyond the isolated COM bank it provides 2 x BIOS-selectable RS-232/422/485 with hardware auto flow control, 8-bit GPIO, a mix of USB 3.2 Gen2/Gen1 and USB 2.0, dual LAN, DP++ and HDMI display, and dual M.2 expansion (Key-B with SIM, Key-E for Wi-Fi/BT).

Terminal-block power input and full antenna/LED provisioning suit machine control, transportation, and rugged edge deployments running Windows or Linux.

Technical Specifications

Processor

Intel® Celeron® Processor J6413 (1.5M Cache, up to 3.00Ghz), ST, Tj=105°C

Intel® Atom® Processor x6425E(1.5M Cache, up to 3.00Ghz), WT, Tj=-40°C ~105°C

System Memory

1 x 260-pin SODIMM socket Max. Up to 32GB DDR4 3200 MT/s

Watchdog Timer

H/W Reset, 1sec. ~ 65535sec.

H/W Status Monitor

CPU & system temperature monitoring and Voltages monitoring

TPM

TPM 2.0

SBC

EBM-EHLS

M.2

1 x M.2 Key-B 2242/3042/3052 support SATA3/ PCIe III/ USB3.2 Gen.1 and SIM slot1 (internal), default support 3.3V, jumper setting to adjust 3.3V/ 3.8V

1 x M.2 Key-E 2230 for Wi-Fi & BT Module (USB2.0/ PCIe III)

M.2

1 x M.2 Key-B 2242/2280, support SATA

1 x M.2 Key-B 2242, support SATA (share with expansion slot)

Power Button

1 x Push Button for Power on/off

Reset Button

1 x Push Button for Reset

LED Indicator

1 x Power LED (Blue)

1 x Storage LED (Yellow)- M.2 B-key SATA

1 x LTE LED (Green)- M.2 B-key PCIe

1 x Wifi LED (Green)- M.2 E key

COM Port

2 x COM RS232/422/485 (select via BIOS, auto flow control via HW)

Digital I/O

1 x 8-bit GPIO (DB9)

Wire-Control Power On/Off

1 x 2-Pin Terminal Block for wire-control power on/off

Antenna

2 x Antenna with dust cover

USB

2 x USB 3.2 Gen.2 (10Gbp/s)

2 x USB 3.2 Gen.1 (5Gbp/s)

2 x USB 2.0

COM Port

4x RS232/422/485 (2.5KV isolation)

LAN Port

2 x RJ45

Audio

1 x Mic-In

1 x Line-Out

DP

1 x DP++

HDMI

1 x HDMI

Antenna

2 x Antenna with dust cover

AC/DC Input

1 x 3-Pin Terminal Block (V+. V-, GND)

Antenna

2 x Antenna with dust cover

Antenna

2 x Antenna with dust cover

Graphic Chipset

Intel® UHD Graphics for 10th Gen Intel® Processors

Resolution

DP++ : Max. resolution 4096x2304 @ 60Hz

HDMI : Max. resolution 4096x2304 @ 60Hz

Audio Codec

Realtek ALC888S (co-lay with ALC897) HD codec

LAN Chipset

2 x Intel I226-IT

Specification

2 x 10/100/1000/2.5G Base-Tx GbE compatible

Voltage Input Spec.

DC in 12/24V (+9V ~ +36V), wide voltage single power input

TVS component for surge protection

Reverse current/voltage protection (Max. Currency: 13A)

Voltage Input Connector

3-Pin Terminal Block (V+. V-, GND)

ACPI

Single power ATX Support S0,S3, S4, S5

ACPI 5.0 Compliant

Power Mode

AT/ATX (ATX is default setting)

OS

Win 10 64bit / Win 11 64 bit/ Linux

Certification Information

CE, FCC Class B, LVD 62368-1

Operating Temp.

-40°C ~ 70°C (w/SSD) ambient w/ 0.5 air flow, WT sku, x6425E

0°C ~ 65°C (w/SSD) ambient w/ 0.5 air flow, ST sku, J6413

Storage Temp.

-30°C ~ 70°C (-22°F ~ 158°F)

Operating Humidity

40°C @ 95% Relative Humidity, Non-condensing

Dimension (W x L x H)

240mm x 150mm x 64 mm (w/ IET module)

Weight

1.9 kg (System)

2.7 kg (w_Package)

Vibration Test

With SSD : 5Grms, IEC 60068-2-64, Random, 5 ~ 500Hz, 0.5hr/axis

Shock Test

With SSD : 55Grms, IEC 60068-2-27, Half Sine, 11ms

IP Rating

IP 50

Mounting Kit

Wall mount kit (standard)

DIN RAIL (optional)

Ordering Information

Intel® Elkhart Lake Atom®/Celeron® Processor Fanless Rugged Embedded System, w_4COM Isolation IET Module, EMS-EHL-J64-A1-4R (J6413), EMS-EHL-X64-A1-4R (x6425E)

What is EMS-EHL-4COM-isolation?

The EMS-EHL-4COM-isolation is a computing system manufactured by Avalue, designed specifically for modular-computing-system applications. The Avalue EMS-EHL-4COM-isolation is a modular computing system based on the Elkhart Lake platform — Intel Celeron J6413 or wide-temperature Intel Atom x6425E — with a single DDR4 3200 MT/s SO-DIMM up to 32GB and onboard TPM 2.0. Built on the EBM-EHLS SBC, this variant is distinguished by four isolated RS-232/422/485 serial ports with 2.5KV isolation, making it ideal for electrically noisy industrial environments. Beyond the isolated COM bank it provides 2 x BIOS-selectable RS-232/422/485 with hardware auto flow control, 8-bit GPIO, a mix of USB 3.2 Gen2/Gen1 and USB 2.0, dual LAN, DP++ and HDMI display, and dual M.2 expansion (Key-B with SIM, Key-E for Wi-Fi/BT). Terminal-block power input and full antenna/LED provisioning suit machine control, transportation, and rugged edge deployments running Windows or Linux.

Key Features & Benefits

Intel Celeron J6413 / Atom x6425E (Elkhart Lake, wide-temp option)
1 x DDR4 3200 MT/s SO-DIMM, up to 32GB
Onboard TPM 2.0 (EBM-EHLS SBC)
4 x RS-232/422/485 with 2.5KV isolation
2 x RS-232/422/485 (BIOS-selectable, HW auto flow control)
8-bit GPIO (DB9)
USB 3.2 Gen2/Gen1 + USB 2.0, dual LAN
DP++ and HDMI display
Dual M.2 (Key-B w/ SIM, Key-E Wi-Fi/BT), terminal-block power

Applications & Use Cases

The EMS-EHL-4COM-isolation is ideal for various industrial automation applications:

DC-powered industrial installations and mobile applications
Wireless connectivity and remote monitoring applications
Legacy equipment integration and serial communication
High-performance computing and data processing tasks
Networked industrial systems and data communication
Peripheral device connectivity and data transfer
Memory-intensive applications and multitasking
Electrically noisy industrial environments

Frequently Asked Questions

A Modular Computing System is an industrial-grade computer designed with modular components that can be interchanged or expanded to customize the system for specific applications. These systems typically feature a base unit with core processing capabilities and standardized interfaces for connecting specialized modules that add functionality such as additional I/O, communication protocols, or industry-specific features. This modularity provides flexibility, scalability, and future-proofing while maintaining the reliability and ruggedness required for industrial environments.

Modular Computing Systems offer several advantages over fixed-configuration computers: customization for specific application requirements, ability to adapt to changing needs without replacing the entire system, simpler upgrades by replacing only specific modules, reduced spare parts inventory, greater longevity as new technologies can be integrated via module updates, streamlined maintenance, and better return on investment through scalability. These benefits make modular systems particularly valuable in industrial environments where requirements evolve and system longevity is important.

An IET (Interface Extension Technology) module is a specialized expansion module used in systems like the EMS series to add specific functionality to the base computing platform. These modules connect to a standardized interface on the main system and provide additional capabilities such as extra COM ports, LAN ports, PoE functionality, or specialized interfaces like CAN bus. IET modules are important because they allow a single base system to be customized for diverse applications by simply changing the module, providing flexibility while maintaining a standardized core platform.

Industries benefiting from modular computing systems include manufacturing (automation control, data collection), transportation (fleet management, railway systems), utilities (substation monitoring, grid control), healthcare (medical equipment integration), retail (point-of-sale, inventory management), building automation (HVAC, access control), defense, aerospace, and smart city infrastructure. Applications requiring customization, future expansion, diverse I/O needs, or adaptation to legacy systems particularly benefit from the flexibility and scalability these systems provide while maintaining industrial-grade reliability.

Wide temperature operation (typically -40°C to 70°C for industrial systems) ensures reliable functioning in non-climate-controlled industrial environments like factory floors, outdoor installations, vehicles, and remote locations. This capability is achieved through careful component selection, thermal design, and elimination of moving parts like fans. Systems with wide temperature ranges can be deployed in harsh conditions without requiring expensive climate control systems, reducing installation and operating costs while improving reliability.

Fanless design means the computer uses passive cooling techniques with heat sinks and thermal engineering instead of active cooling fans. This design is crucial for industrial computers because it eliminates a common point of failure (the fan motor), prevents dust and contaminant ingress that could clog filters and cause overheating, enables sealed enclosures for harsh environments, reduces maintenance requirements, eliminates fan noise, and improves overall system reliability and longevity in challenging industrial conditions with dust, vibration, and temperature fluctuations.

TPM (Trusted Platform Module) 2.0 is a specialized security chip that provides hardware-based encryption capabilities, secure storage for authentication credentials, and system integrity verification. In industrial systems, TPM helps protect sensitive data, secure communication channels, prevent unauthorized access or tampering, and ensure the integrity of control systems. As industrial systems become more connected, TPM provides essential security features to protect against cyber threats targeting critical infrastructure and manufacturing systems.

Vibration and shock resistance are critical for industrial computing systems operating in environments with mechanical disturbances from machinery, vehicles, or handling. Systems are tested to standards like IEC 60068-2-64 (vibration) and IEC 60068-2-27 (shock) to ensure they can withstand these forces without component failure or connection issues. This resilience is achieved through solid-state storage, elimination of moving parts, reinforced component mounting, specialized chassis design, and industrial-grade components, ensuring reliable operation in mechanically challenging environments.

When installing modular computing systems, consider proper thermal management (ensuring adequate airflow around the unit), environmental protection (enclosures appropriate for dust/moisture levels), power quality (stable power source with appropriate voltage and backup options), EMI/RFI isolation (distance from high-interference sources), physical security, accessibility for module swapping and maintenance, proper grounding, cable management (strain relief and protection), and compliance with local regulations and industry standards. Proper planning ensures reliable operation and maximizes the benefits of the system's modular nature.

For fanless modular systems, proper thermal management is crucial: ensure adequate clearance around all sides (typically 5-10cm minimum), avoid enclosing in sealed cabinets without ventilation, mount vertically if possible to enhance natural convection cooling, install away from other heat-generating equipment, consider ambient temperature fluctuations in the installation location, follow manufacturer's mounting recommendations (which often include heat-dissipating brackets), and periodically check for dust accumulation on cooling surfaces. For high-temperature environments, consider additional passive cooling solutions or environmental controls.

For modular computing systems, select a power supply with sufficient wattage for the base system plus all modules (with 20-30% headroom for future expansion), ensure voltage matching the system's input range (typically 9-36V DC for industrial systems), implement surge protection for industrial environments with electrical noise, consider redundant power options for critical applications, use proper wire gauge for current requirements, and potentially include an uninterruptible power supply (UPS) for protection against power outages. The power system should account for the maximum possible configuration with all modules installed.

Best practices for cable management with modular systems include using appropriate cable types for the industrial environment (shielded where necessary), implementing strain relief to prevent connector damage, securing cables to prevent accidental disconnection due to vibration, labeling cables clearly for easier maintenance and troubleshooting, maintaining minimum bend radii to prevent internal damage, using cable trays or conduits for protection, separating power and data cables to minimize interference, allowing sufficient service loops for module replacement without disconnecting cables, and ensuring accessibility for future changes while maintaining a neat installation.

If the system fails to power on, check that the power supply provides the correct voltage within the system's input range (typically 9-36V DC), ensure connections are secure at both the power supply and system, verify any power switches or ignition control settings are correctly configured, check for tripped circuit breakers or blown fuses, inspect for visible damage to power connectors, test with an alternative known-good power supply if available, verify the power LED indicators, and check if the system is in AT mode requiring a specific power signal. For vehicle-mounted systems, ensure the ignition control is properly connected.

For issues with modules or expansion capabilities, verify the module is properly seated and secured, check power cycling the system after confirming connections, ensure any module-specific drivers are installed, check BIOS/UEFI settings for module-related options, inspect for physical damage to connectors, try an alternative slot if available, test with a known-working module to verify slot functionality, check system logs for error messages, and consult module-specific documentation for jumper settings or configuration requirements. After replacing modules, validate that the system recognizes the change through device manager or system information utilities.

For overheating issues, ensure adequate clearance around the system (minimum 5-10cm on all sides), check that the installation position allows for proper convection cooling (typically vertical mounting), clean dust from the chassis and heat sink fins using compressed air (when powered off), verify ambient temperature is within specifications, check system temperature through monitoring utilities or BIOS, ensure any thermal interface materials are properly applied if the system has been serviced, examine CPU usage for processes causing excessive load, and consider adding auxiliary passive cooling or relocating the system to a cooler environment if persistent.

To diagnose communication issues, first identify the specific interface (COM, LAN, USB, etc.) experiencing problems. Check physical connections and cables for damage, verify device driver installation and updates, confirm port configuration settings (baud rate, parity, etc. for serial connections; IP settings for network), try alternative cables or ports to isolate the issue, check for resource conflicts in Device Manager, test with a known-working device, verify any required protocol converters or adapters are functioning, and use diagnostic tools appropriate to the interface type (terminal emulator for serial, ping/traceroute for network) to identify where communication fails.

Highlights

Product Description

Technical Specifications

System Information

Processor

System Memory

Watchdog Timer

H/W Status Monitor

TPM

SBC

Expansion

M.2

Storage

M.2

Front I/O

Power Button

Reset Button

LED Indicator

COM Port

Digital I/O

Wire-Control Power On/Off

Antenna

Rear I/O

USB

COM Port

LAN Port

Audio

DP

HDMI

Antenna

AC/DC Input

Right I/O

Antenna

Left I/O

Antenna

Display

Graphic Chipset

Resolution

Audio

Audio Codec

Ethernet

LAN Chipset

Specification

Power Requirement

Voltage Input Spec.

Voltage Input Connector

ACPI

Power Mode

Software Support

OS

Certification

Certification Information

Mechanical & Environmental

Operating Temp.

Storage Temp.

Operating Humidity

Dimension (W x L x H)

Weight

Vibration Test

Shock Test

IP Rating

Mounting Kit

Ordering Information

Ordering Information

What is EMS-EHL-4COM-isolation?

Key Features & Benefits

Applications & Use Cases

Frequently Asked Questions